IPC - 2152

[This is a working document. It is created for the purpose of review for major
categories. The sections are being incorporated by the IPC Task Group 1-10b.
Comments can be sent to [email protected]]

Standard for Determining

Current-Carrying Capacity
In Printed Board Design

1
TABLE OF CONTENTS

1 SCOPE .......................................................... 4 5.1.1 Power Density ............................... 13

1.1 PURPOSE .................................................. 4 5.1.2 Electrical Resistance ..................... 13

1.2 DEFINITION OF TERMS ................................ 4 5.1.3 Temperature dependence ............. 13

1.3 APPLICABLE DOCUMENTS ........................... 4 5.1.4 Volume Resistivity ......................... 14

2 CONDUCTOR DESIGN OVERVIEW............ 5 5.1.5 Current........................................... 14

2.1 EARLIER CONCEPTS OF CONDUCTOR SIZING 5.1.6 Transient Current Pulses............... 15

AND CURRENT CARRYING CAPACITY .................... 5
5.1.7 Power Dissipation in Copper Planes
2.2 CONDUCTOR SIZING BASED ON CROSS- 15
SECTIONAL RELATIONSHIP ................................... 5
5.2 HIGH SPEED DESIGN CONSIDERATIONS..... 15
3 THERMAL MANAGEMENT.......................... 7
5.2.1 Skin Effect and Skin Depth ........... 15
3.1 BASICS OF HEAT TRANSFER ....................... 7
6 CONDUCTOR TEMPERATURE RISE........ 15
3.1.1 Conduction...................................... 7
6.1 INFLUENCE OF BOARD THICKNESS ............ 16
3.1.2 Convection ...................................... 7
6.2 INFLUENCE OF BOARD MATERIAL PROPERTY
3.1.3 Radiation......................................... 8 16

3.1.4 Heat transfer problem ..................... 8 6.3 INFLUENCE OF INTERNAL COPPER PLANE(S)
16
3.2 TEMPERATURE RISE .................................. 9
6.4 INFLUENCE OF MOUNTING CONFIGURATIONS
3.2.1 Steady State ................................... 9
17
3.2.2 Transient ( add fusing) .................... 9
6.5 INFLUENCE OF CONVECTIVE ENVIRONMENTS
3.2.3 Mounting Configurations................. 9
17
3.2.4 Altitude Effects ................................ 9
6.6 INFLUENCE OF SPACE ENVIRONMENTS....... 17
3.3 POWER DISSIPATION CONSIDERATIONS .... 10
7 CHARTS ...................................................... 17
3.3.1 Individual Component Power
7.1 PARALLEL CONDUCTORS AND COILS .......... 17
Dissipation ................................................... 10
7.2 DERATING VALUES ................................... 19
3.3.2 Board Material Properties ............. 10
7.3 AIR/EARTH ENVIRONMENTS CHARTS ......... 20
4 GENERAL CIRCUIT FEATURES............... 10
7.3.2 1 oz Air .......................................... 20
4.1.1 Conductor Width and Thickness... 11
7.3.3 1 oz fine line Air............................. 20
5 POWER DISSIPATION............................... 13
7.3.4 2 oz Air .......................................... 20

2
 7.3.5 2 oz fine line Air ............................ 20

7.3.6 3 oz Air.......................................... 20

7.3.7 External 2 oz Air............................ 20

7.3.8 2 oz fine line Air ............................ 20

7.3.9 3 oz External AirError! Bookmark

not defined.

7.4 VACUUM/SPACE ENVIRONMENTS .............. 20

7.4.1 1/2 oz Internal VAC....................... 20

7.4.2 1/2 oz fine line Internal VAC ......... 20

7.4.3 1 oz Internal VAC.......................... 20

7.4.4 2 oz Internal VAC.......................... 20

7.4.5 2 oz fine line Internal VAC ............ 20

7.4.6 3 oz Internal VAC.......................... 20

7.4.7 2 oz External VAC......................... 20

7.4.8 2 oz fine line External VAC ........... 20

7.4.9 3 oz External VAC......................... 20

8 THERMAL MODELING .............................. 21

8.1.1 Power Planes................................ 21

8.1.2 Embedded Passives ..................... 22

8.1.3 Conductor Sizing........................... 22

9 TEST DATA ................................................ 22

10 TEST METHOD ..................................... 22

3
IPC-2152 To assist the reader, the word "shall" is presented
in bold characters.

1.2 Definition of Terms

Standard for Determining Current Carrying
Capacity in Printed Board Design The definition of all terms used herein shall be as
specified in IPC-T-50.
May-03
1.3 Applicable documents

Institute for Interconnecting and Packaging

Reference:
Electronic Circuits (IPC)1
[1] NBS (National Bureau of Standards) Report
The following documents form a part of this
#4283 “Characterization of Metal-insulator
document to the extent specified herein.
Laminates”, D.S. Hoynes, May 1, 1956.
Commissioned by Navy Bureau of Ships IPC - T - 50 Terms and Definitions for
Interconnecting and Packaging
1 Scope
Electronic Circuits
This standard establishes the generic and specific
IPC - MF - 150 Metal Foil for Printed Wiring
guidelines for the design of metallic conductors in
Applications
organic printed boards and other material that may
IPC - TM - 650 Test Methods Manual
be homogeneous, reinforced, or used in
combination with inorganic materials. IPC - 4102
IPC - 4104
1.1 Purpose
IPC - ET-652 Guidelines and Requirements for
This document is intended as a guide to Electrical Testing of Unpopulated Printed Boards
understanding the implications of applying current
IPC - 2141 Controlled Impedance Circuits
to any metallic conductor in a printed board
Boards and High Speed Logic
design. The concepts can be applied to any
Design
metallic conductor printed on any media.
IPC - 4101 Laminate/Prepreg Materials
Interpretation -- "Shall," the imperative form of the
Standard for Printed Boards
verb, is used throughout this standard whenever a
requirement is intended to express a provision that IPC - 2227
is mandatory. Deviation from a "shall" requirement
IPC - 4902
may be considered if sufficient data is supplied to
justify the exception.
1
The Institute for Interconnecting and Packaging Electronic
The words "should" and "may" are used whenever Circuits
6
it is necessary to express non-mandatory IEEE

provisions. "Will" is used to express a declaration

of purpose.

4
2 Conductor Design Overview conductor current required, and the maximum
permissible conductor temperature rise. This
A process is presented for sizing electrical
method was derived from experimental results on
conductors that allows full flexibility to the
external traces performed by the National Bureau
application that is being designed. Sizing
of Standards in 1956, Reference 1. This
conductors is no longer limited to current,
document was established when the printed circuit
temperature rise and cross-sectional area. Charts
industry was in its infancy and when a guide for
similar to the existing current-carrying internal and
sizing conductors was first required.
external charts are a starting point for conductor
sizing. Appendix A contains the original charts that were
developed for determining current-carrying
Optimizing the size of any conductor requires an
capacity for external printed conductors for printed
understanding of the energy generated by the flow
wiring boards. The original charts were developed
of electrical current through the metallic conductor
from two different board materials, primarily XXXP
and the resulting power dissipated by the
(phenolic) and epoxy. These boards were 1/16
conductor. Using that understanding along with
and 1/32 inch thick, had ½ oz, 1 oz, 2 oz and 3 oz
computer aided thermal analysis software will
copper conductors and some of the boards had
allow the optimization of any design.
copper planes on one side of the board. All of the
Designers shall understand what the design
boards were double–sided boards.
guideline represents. The process for evaluating
Board material property, board thickness, copper
design decisions is presented in Section 10,
weight and copper planes all influence trace
Design Process for Conductor Sizing. Using this
temperatures. Since all of these variables were
process allows full design flexibility.
lumped into a single chart the guidelines have
A conservative method of sizing conductors
produced mixed results. Designers have
remains the same as previously with the exception
questioned the charts for years because of
of new charts. The new charts are based on test
misunderstandings as to their origin.
data that is described in Section 11, Test Data.
2.2 Conductor Sizing Based on Cross-
Sectional Relationship
2.1 Earlier Concepts of Conductor Sizing
Conductor sizing using cross-sectional area,
and Current Carrying Capacity
applied current and temperature rise, as shown in
Prior to the publication of this document, the Figure 3.1 is a generic case for sizing conductors.
minimum width and thickness of conductors on the This method is applicable to the charts that have
finished board were determined on the basis of the been added in Section 6.

5
2.2.1.1.1

Figure 1 Conductor thickness and width for external layers

6
 regions containing greater molecular kinetic
3 Thermal Management
energy to pass this energy to regions with
The temperature of a conductor in a circuit less kinetic energy. In other words, regions
board is dependent upon a number of of high temperature transfer energy to
variables. Some of these variables are the regions of low temperature.
board material, thickness of the board,
Several material properties serve to change
number of copper planes in the board, and
the heat transferred between two regions at
the environment. The environment
differing temperatures. Examples include
considers how the board is mounted and
thermal conductivities, specific heats,
what it is mounted to, as well as if it is
material densities, fluid velocities, fluid
exposed to air, another gas or in Space
viscosities, surface emissivities, and more.
(vacuum).
Taken together, these properties serve to
There is no simple way to define the make the solution of many heat transfer
temperature rise of a conductor. One problems an involved process.
method is to set a baseline for the
3.1.1 Conduction
temperature rise of a conductor and then
optimize the conductor size based on the Conduction heat transfer occurs in any

specific design. The optimization is highly material whether solid, liquid or gas. This

dependent on the variables that determine phenomenon is driven by a difference in the

the conductor’s temperature rise. Aside temperature within the material and is

from electrical performance, this dependent on the material thermal

optimization becomes a thermal conductivity. In electronics this value can

management problem to be solved. range from 398 W/m-K for copper to 0.03
W/m-K for FR4 laminate material. The
3.1 Basics of Heat Transfer
conductivity may not be constant in all
In the simplest of terms, the discipline of directions particularly in a circuit board,
heat transfer is concerned with only two where the copper layers play a critical part in
things: temperature, and the flow of heat. the heat spreading.
Temperature represents the amount of
3.1.2 Convection
thermal energy available, whereas heat flow
represents the movement of thermal energy Convection heat transfer is defined as

from place to place. energy transport by a moving fluid such as

gas or liquid. The amount of heat
On a microscopic scale, thermal energy is
transferred by convection from a solid to a
related to the kinetic energy of molecules,
fluid depends on the velocity and the
the greater a material's temperature the
temperature of the fluid. The convective
greater the thermal agitation of its
flow is often described as being laminar (low
constituent molecules. It is natural for
7
velocity) or turbulent (high velocity). In 3.1.4 Heat transfer problem
turbulent flow there is a lot of mixing that
An example will be discussed to pull the
occurs within the fluid and increases the
heat transfer concepts into perspective. A
amount of heat transfer.
circuit board has an electrical conductor
Convection is a critical part in the design of embedded into the board on layer six of a
electronic systems. It is often characterized twelve-layer FR4 circuit board.
as forced or natural convection.
This is a conservative configuration, that
Forced convection occurs when fans or represents trace testing, where there is only
pumps are used. Natural convection is one trace in the board. The trace is six
characterized by a change in the fluid inches long, 0.254 mm [0.01 inches] wide
density with temperature. and 0.0343 mm [0.00135 inch] thick (1-oz
copper). The circuit board is 355.6 mm [14
There is no convection in space
inch] long, 203.2 mm [8 inch] tall and 1.57
environments because there is no air or fluid
mm [0.062 inch] thick. The trace runs
that surrounds the electronics. With the
horizontally across the center of the board
exception of heat pipes and specially
and the board is suspended in still air. The
designed structures the only heat transfer
air temperature is 25oC and there is 1.12
that exists in space is conduction and
amps applied to the trace.
radiation.
Under these conditions the trace peaks at
3.1.3 Radiation
35.50C under steady state conditions.
Radiative heat transfer is defined as radiant
The trace has a resistance of 0.328 Ohms.
energy emitted by a surface and is
When 1.12 Amps flows through the trace
dependent on its temperature. Radiant
there is 0.409 watts of power generated in
energy is transferred between two surfaces
the trace. This causes the trace to heat up.
proportionally to the difference of the fourth
As the trace heats up the energy conducts
power of the surface temperatures.
away from the trace into the circuit board.
All materials radiate thermal energy in
The heat spreads out into the circuit board
amounts determined by their temperature,
heating it up.
where the energy is carried by photons of
The board starts to heat the air around the
light in the infrared and visible portions of
hot spot on the board. As the air heats up
the electromagnetic spectrum. When
(hot air rises) the air starts to move. As the
temperatures are uniform there is essentially
air moves it starts to carry some of that
no radiative flow of energy between the
energy (heat) away from the board. The
objects. Radiation heat transfer occurs from
energy is transferred to the air by
surfaces of higher to surfaces of lower
convection.
temperature.

8
The hot sections of the board radiate energy noticed when the temperature does not
away from the board and transfer energy change under a given set of conditions.
from the board to the surroundings.
The material property that is considered
Eventually, the amount of energy being when determining the steady state
transferred by conduction, convection and temperature is the thermal conductivity of
radiation reach equilibrium. Another word the material.
for equilibrium is steady state. In this case,
3.2.2 Transient ( add fusing)
the temperature of the trace stabilizes at
Thermal conductivity, specific heat and
density for time dependent temperatures

Add mass issues

Work in fusing topic

3.2.3 Mounting Configurations

Sample of a card not mounted to anything

Sample of a card mounted to a chassis with

0
35.5 C. wedge-locks

Figure 3.1 Heat Transfer Example Sample of a card bolted to a heat sink

Although this may seem like an unrealistic Sample of a card not mounted to anything
case for a circuit board it is real for with a convective environment with a
conductor heating. In fact, this is what the velocity of X.
conductor charts represent. For further 3.2.4 Altitude Effects
information in regard to what the charts
At increasing altitudes above sea level the
represent read Section 9, Test Method.
density of air steadily decreases. As the
3.2 Temperature Rise density of air decreases the amount of
When a temperature rise of a conductor is energy transferred through convection to the
considered there are two conditions that can surrounding air becomes less. At a high
be discussed, steady state temperatures enough altitude the environment is
and transient temperatures. considered a vacuum or Space environment
with essentially no convection. At this time
3.2.1 Steady State
there are no charts to represent various
The conductor sizing design charts are only altitudes, therefore at high altitudes it is
concerned with steady state temperatures. recommended to review both Earth and
Steady state refers to a situation where the Space charts.
energy entering a system and leaving a
system is in equilibrium. This condition is

9
3.3 Power Dissipation Considerations Density

Typically, the power dissipation from the

electrical components on a circuit board is
4 General Circuit Features
the concern that is addressed in a thermal
analysis. There is power dissipated by the A circuit board trace, depending on its size
internal power planes in the circuit board and the manufacturing process, is not
and there is power dissipated by the circuit necessarily rectangular in shape. For
traces. It is recommended that example Figure 4.1 shows a typical cross
consideration be given to the total power section of a trace.
dissipated by all of the sources,
(components, planes and traces) in a
design.

3.3.1 Individual Component Power

Dissipation

It is suggested to consider the conductor

sizing in areas of high power dissipating
components. The high power components
are going to operate at high temperatures Figure 4.1 Conductor Cross Section
and therefore as a design consideration it
The average thickness of a conductor is
may be helpful to lower the temperature rise
assumed to be as described in Table 4.1.
of the traces in regions of high power
components to minimize the local Table 4.1 Conductor Thickness

temperature rise in the board.

UL Numbers
3.3.2 Board Material Properties
Oz/ft2 Inch Microns
Thermal Properties
1/4 oz 0.00035 9
Thermal property discussion
3/8 oz 0.00051 12
Laminate properties
1/2 oz 0.0007 18
Resin
1 0.00135 35
Fiber weave, content
2 0.00027 70
Thermal conductivity
3 0.0041 105
Table of Thermal Properties
4 0.0054 140
Thermal conductivity
5 0.0068 175

Specific heat

10
 6 0.0081 210 UL746E). WE NEED TO PUT THE
VALUES FROM UL 746E in here.
7 0.0095 245

For ease of manufacturing and durability in

8 0.0108 280
usage, conductor width and spacing
9 0.0122 315
requirements should be maximized while
10 0.0135 350 maintaining the minimum desired spacing
requirements. The minimum or nominal
finished conductor width shall be shown on
Even though these are average values a the master drawing.
significant amount of variation is allowed for
Table 4.1.1-1 Internal Layer Foil
the copper thickness. The amount of
Thicknesses After Processing
variation is dependent upon whether the
conductor is internal or external. Copper Minimum
Foil
4.1.1 Conductor Width and Thickness

+ - 5-10% tolerance on trace width is 1/8 oz 3.5 µm 0.000138 in

acceptable.
¼ oz 6.0 µm 0.000236 in

The width and thickness of conductors on 3/8 oz 8.0 µm 0.000315 in

the finished printed board shall be
determined on the basis of the signal ½ oz 12.0 µm 0.000472 in

characteristics, current carrying capacity

1 oz 25.0 µm 0.000984 in
required and the maximum allowable
temperature rise. The charts in Section 7.3
2 oz 56.0 µm 0.002205 in
are a baseline configuration. The designer
shall understand what these charts 3 oz 91.0 µm 0.003583 in
represent. The designer should recognize
that processing will vary the thickness of 4 oz 122.0 µm 0.004803 in
copper on circuit layers. See Tables 4.1.1-1
and 4.1.1-2.
Above 4 13 µm
oz below
The minimum finished conductor width used
minimum
on the finished board shall not be less than
thickness
0.1 mm and, when the Underwriters
listed for
Laboratories (UL) requirements are
that foil
imposed, within the limits approved by UL
thickness
for the printed board manufacturer (see
in IPC-MF-

11
 150 copper, shall be shown on the master
drawing for a typical conductor of that
nominal width.

Table 4.1.2-3 Conductor Width Tolerances

Table 4.1.1-2 External Layer Foil Thickness for 46 µm Copper
After Plating
Feature Level A Level B Level C
Copper Minimum
Foil
Without ±0.06 ±0.04 ±0.015
Plating mm mm mm
1/8 oz 20 µm 0.000787
With ±0.01 ±0.08 ±0.05
¼ oz 20 µm 0.000787 Plating mm mm mm

3/8 oz 25 µm 0.000984 If tolerances in Table 4.1.2-3 are too broad,

tighter tolerances than Table 4.1.2-3 can be
½ oz 33 µm 0.001299 agreed to between the user and supplier
and shall be stated on the master drawing
1 oz 46 µm 0.001811
and considered Level C. Table 4.1.2-3
values are bilateral tolerances for finished
2 oz 76 µm 0.002992
conductors.
3 oz 107 µm 0.004213 The width of the conductor should be as
uniform as possible over its length; however,
4 oz 137 µm 0.005394
it may be necessary because of design
restraints to “neck down” a conductor to
Above 4 For each
allow it to be routed between restricted
oz succeeding
areas, e.g., between two plated-through
ounce of
holes. The use of “necking down” such as
copper foil,
that shown in Figure 4.1.2-1 can also be
increase
viewed as “beefing up.” Single width, having
minimum
a thin conductor throughout the board, as
conductor
opposed to the thin/thick approach is less
thickness
desirable from a manufacturing point of view
by 30µm
as the larger width conductor is less
When bilateral tolerances are required on rejectable due to edge defects rated as a
the conductor, the nominal finished percentage of the total width.
conductor width and the tolerances shown in In any event, if the conductor width change
Table 2-3, which are typical for 46 µm is used, the basic design requirements

12
defined herein shall not be violated at the 5.1.1 Power Density
necking down location.
5.1.2 Electrical Resistance
When necking down a conductor it is
The electrical resistance of a conductor
recommended that the guidelines for
would be expected to be greater for a longer
conductor modeling be followed to evaluate
conductor, less for a conductor of larger
the temperature rise in the reduced trace
cross sectional area, and would be expected
width.
to depend upon the material out of which the
conductor is made. Equations 5.1.2-1 and
5.1.3-1 relate the necessary terms for the
calculation of resistance. The resistance
can then be used to calculate the conductor
power dissipation.

R = ρv L/A Equation 5.1.2-1

Where:

Figure 4.1.2-1 Example of Conductor Neck- ρv = 1.92 E-05 ohm-mm @ 25C for ½ oz.
down or Beef-up Copper

5 Power Dissipation = 1.80 E-05 ohm-mm @ 25C for 1 oz. and

over.
When calculating a conductors power
dissipation one is required to determine the L= mm

resistance of the conductor and the current R = Ohms

that is flowing through it. A circuit may have
A = Area in mm2.
direct current (DC) or alternating current
(AC). If the circuit is using AC a root mean
square of the current, Irms, must be 5.1.3 Temperature dependence
determined. If the circuit is using DC the
R = R 1 [1 + α 1 (t − t1 )] Equation 5.1.3-1
amperage can be used as it is.

The power dissipation is then determined by Where:

the following equation: R = Resistance of conductor when adjusted
2
P=I R DC circuit or in terms for temperature.
of voltage P = VI R1= Initial resistance of conductor at
P = Irms2R AC circuit or in terms reference temperature (t1).
of voltage P = VrmsIrms t = Temperature of conductor that
resistance ( R ) is being calculated.

13
α1 = 1/(234.5 + t1) = Temperature coefficient
Platinum 10.6 x10-5 0.003927
of resistance of the conductor at reference
temperature (t1). Iron 9.71 x10-5 0.00651

t1= Reference temperature; the ambient

The resistivity
temperature at which R1 is determined.
of copper at
Reference: Giancoli,
20 C is about
Douglas C., Physics, 4th
5.1.4 Volume Resistivity
Ed, Prentice Hall, (1995).
The factor in the resistance, which takes into
account the nature of the material, is the
resistivity, ρv.

R = ρv L/A 5.1.5 Current

Although it is temperature dependent, it can Electric current is the rate of charge flow
be used at a given temperature to calculate past a given point in an electric circuit,
the resistance of a conductor of given measured in coulombs/second, which is
geometry. named amperes.

The inverse of electrical resistivity is called 5.1.5.1 Direct Current

electrical conductivity.
In DC electric circuits the current in the
circuit is related to voltage and resistance by
Ohm's law.
Electrical conductivity = σ = 1/ρ
Ohms Law I = V/R
Resistivity at 20C I = current

Material Ohm-mm Temp Coef V = voltage

o
C-1 R = resistance

Copper (pure) 5.1.5.2 Alternating Current

1.68 10-5 0.00385 at
Copper ½ oz 25oC Circuit currents and voltages in AC circuits
1.92 10-5
are generally stated as root-mean-square or
Copper 1 oz -5
1.80 10 rms values rather than by quoting the
and greater
maximum values. The root-mean-square for

Silver 1.59 x10-5 0.0061 a current is defined by

Aluminum 2.65 x10-5 0.00429 I rms = (I )

2
avg

Tungsten 5.6 x10-5 0.0045 That is, you take the square of the current
and average it, then take the square root.
14
This is just the effective value needed in the distribution in power planes is discussed in
expression for average power to put the AC Section 7.5.1.
power in the same form as the expression
for DC power in a resistor.
5.2 High Speed Design Considerations
As in the case with DC power, the
There is no simple measure (such as RMS
instantaneous electric power in an AC circuit
amplitude) that can possibly capture all the
is given by P = I2R, but the current is
information that is needed to completely
continuously varying. Almost always the
characterize the resistance,
desired power in an AC circuit is the
as the effective resistance depends greatly
average power, which is given by:
not only on the size of the
Pavg = I2rmsR
AC fluctuations, but also on their frequency.
Where:
If you can establish an upper bound on the
I is understood to be the effective or RMS frequency content of your signals (such as is
value of the current. easily the case for most RF problems) and if
you use that highest frequency for the
5.1.6 Transient Current Pulses
calculation of skin effect depth then the
A transient (time dependent) condition is
conductor-sizing formulas should always be
when current is applied for a time period
safe.
less than steady state. Under these
5.2.1 Skin Effect and Skin Depth
conditions the power dissipation must be
calculated for multiple time steps over the I have a section that I’m working on that will
period of the applied current. A multiple go in here.
step process is recommended to solve the
temperature rise for a transient current
pulse.

Section 3.2.2 includes a discussion on

modeling the transient temperature rise of a
conductor.

5.1.7 Power Dissipation in Copper

Planes 6 Conductor Temperature Rise

The power dissipation in a copper plane There are many variables that affect the
temperature rise of a conductor. Board
is not a trivial problem to be solved. Many
thickness, board material, internal copper
times the copper plane is of irregular shape
planes, mounting configuration, convective
and has multiple through-holes almost giving
environment and whether the board is
it a Swiss-cheese appearance. An
operated on Earth or in Space. Due to the
approach to solving the temperature

15
 complicated nature of determining the state simulation results.
temperature rise of a conductor a basic
Figure 6.1.1 Board Thickness Effects
configuration is used to describe a baseline
6.2 Influence of Board Material
temperature rise for a conductor. This
Property
baseline is determined by following the
guidelines in IPC-TM-650, 2.5.4.1a, The circuit board material property is a
Reference 5. secondary effect on the temperature rise of
the conductor. The exception to this case is
It is important to acknowledge the variables
when the thermal conductivity of the
that affect the temperature rise of the
laminate material is significantly higher than
conductor. Understanding that there is more
standard laminate materials such as FR4
to the temperature response of the
and polyamide. An additional exception is to
conductor than just current and cross-
when the conductor size is based on
sectional area provides flexibility when
something other than test data, such as half
designing circuit boards. Using thermal
the current from the external conductor data.
modeling techniques allows the design to be
optimized by taking advantage of the
positive aspects that these variables
150
provide. Although without being able to take Current
(Amps)

OFF THE SCALE!

120
advantage of these techniques a designer 90 0.88
1.2
∆T (C)

must have safe design guidelines to layout a 60 1.44

1.8
30
circuit board. 2.05
0
Thermally Polyimide FR-4 XXXP Internal 2221
6.1 Influence of Board Thickness Conductive
PWB

Figure 6.2.1 Board Material

The thickness of the board has some affect
on the conductor temperature rise. Figure 6.3 Influence of Internal Copper
6.1.1 shows results from both test data and Plane(s)
thermal model simulations. The 1.78 mm
(70 mil) thick PCB represents test data and 80
OFF THE SCALE!

the other thicknesses, 1.27 (50), 0.508 (20),

60
and 0.254 mm (10 mil), are from steady
∆T (C)

40

20

30
0
Plane No Plane IPC

Figure 6.3.1 Internal Copper (Replace

20
∆T (C)

this one) remove IPC

10

0
70 50 20 10

PCB Thickness (mils) 16

6.4 Influence of Mounting 8 Charts
Configurations
The following charts are a subset of the
charts that will be included over time. In the
past, a single external and internal chart
6.5 Influence of Convective
were used for sizing conductors. As
Environments
mentioned in previous sections these charts
are based on test data collected following
6.6 Influence of Space Environments the procedures in Reference 5.

Reference 5 provides a conservative

50 method for determining the temperature rise
40 Current
(Amps) of a conductor. Conservative in this case
∆T (C)

30 0.77
1.01 means that, in most cases, the conductor
20 1.29
1.53 temperature rise will be less than defined by
10
the use of these charts. Because these
0
Air Vacuum
charts are provided as a general guideline
Figure 6.6.1 Air vs. Vacuum
they must set a baseline for conductor
6.7 Derating Factors sizing. When the baseline is understood,
then specific designs can take advantage of
Derating factors are multiplication factors for
the variables that affect the temperature rise
reducing a value. For example, the charts
and optimize the conductor size.
are based on a board thickness of 0.07 inch.
If the board thickness is 0.03 inch this Section 9, Test Data, discusses the test
affects the temperature rise of the conductor configuration and the data used to create
and a derating factor is provided to reduce the charts.
the current.
Charts will be included up to 30 oz copper
weights. These will be added, as they are
7 Vias
collected over time. Requests by industry
The calculations used to size the cross-
will drive the priority and inclusion of new
sectional area for current carrying capacity
charts for heavier copper and lighter copper
in vias and micro-vias is the same as for
weights.
conductors. Typically, a via cross section is
8.1 Parallel Conductors and Coils
larger than the cross section of a trace
entering or leaving it. The calculations for The charts may also be used for the
the cross sectional area is as follows: determination of temperature rise for other
than single conductor applications, such as
parallel conductors and coils. Tests on a
limited number of samples show that the
temperature rise of closely spaced parallel

17
conductors may be estimated by using an Figure 7.1.2 Single Conductor 0.160” metric
equivalent cross section and current
Figure 7.1.3 shows the two conductors with
condition based on the summations of the
two of the same size conductors in parallel
cross sections and currents involved, and
with metric, [0.07”], spacing. Conductor are
interpolating directly from the charts.
separated to distances that exceed they
The following figures are presented to help temperature gradients that surround the
illustrate the spacing that defines parallel heated conductor will the parallel rules.
conductors. The spacing is dependent upon
the amount of heat spreading that occurs in
a specific design. Each of the figures below
represents a board configuration similar to
that described in Reference 5.

Working on sections below

Figure 7.1.1 Single Conductor

Figure 7.1.3 Parallel Conductors

The model in Figure 7.1.1 illustrates a metric

units, 0.08 inch, conductor with current
applied to it. Now, the rules for parallel
conductors are illustrated. Two conductors
Spacing
of the same size as in Figure 7.1.1 are
In the case of coils, estimates become
desired, so the current is added and the
somewhat more difficult owing to possible
conductor is sized for the total current. That
variations in conductor sizes, configurations,
conductor is shown in Figure 7.1.2.
panel areas, and heat transfer from one part
of the coil to another. Thermocouple
measurements on a number of coils ranging
in size from 0.350 inch to 1.5 inch diameter
showed that safe estimates in temperature
rise of the hottest portion may be made from

18
the charts by utilization of equivalent cross particularly true in view of the inherent
sections an currents based on a factor of 2n, difficulties in obtaining accurate cross-
where n is equal to the number of turns in sectional estimates from measurements due
the coil. Here again, while the temperature to variations in copper thickness,
rise estimates are generally on the high undercutting during etching, variations in the
side, it is felt that little would be gained by pattern, etc.
introduction of correction factors of a
8.2 Table 1. Conductor Current
complicated nature. This is considered
Derating Values

Category (Internal Derating Value

Conductors)

Board
Thickness

0.10” [ mm]

0.08” [ mm] An equation

for each
0.06” [ mm]
material in
0.05” [ mm] addition to the
0.04” [ mm] derating
factor.
0.03” [ mm]

Board Material

19
8.3 Air/Earth Environments Charts

This section will be updated on a periodic basis depending on the demand for a given conductor
thickness. The following is based on test data for polyamide test boards.

8.3.1 ½ oz Air

8.3.1.1 ½ oz fine line Air

8.3.2 1 oz Air

8.3.2.1 1 oz fine line Air

8.3.3 2 oz Air

8.3.3.1 2 oz fine line Air

8.3.4 3 oz Air

8.3.4.1 3 oz fine line Air

8.3.5 External 2 oz Air

8.3.5.1 External 2 oz fine line Air

8.3.6 External 3 oz Air

8.3.6.1 External 2 oz fine line Air

8.4 Vacuum/Space Environments

8.4.1 1/2 oz Internal VAC

8.4.1.1 1/2 oz fine line Internal VAC

8.4.2 1 oz Internal VAC

8.4.2.1 1 oz fine line Internal VAC

8.4.3 2 oz Internal VAC

8.4.3.1 2 oz fine line Internal VAC

8.4.4 3 oz Internal VAC

8.4.4.1 3 oz fine line Internal VAC

8.4.5 2 oz External VAC

8.4.5.1 2 oz fine line External VAC

8.4.6 3 oz External VAC

20
 Heat flux (Watts) Current (Amps)

9 Thermal Modeling
Resistance Resistance (ohms or
Optimizing the size of conductors and (Degrees/Watt) 1/Mohs)
achieving their desired temperature rise is
difficult. There is no simple chart that can
take into account the internal copper planes, 9.1.1.1 Modeling geometry
board thickness, board material, mounting
There is a direct correlation for linear
configuration and environmental conditions.
dimensions, so when a voltage-drop model
An approach is presented
is created, the actual dimensions for the
As electronics design optimization continues problem are modeled.
to be pursued for the sake of cost savings it
9.1.1.2 Voltage sources
is important to take into account all sources
of energy that are present in a design. The A voltage source in a PCB model is defined

conductors, embedded passives, power and as a point where the user defines the

ground planes are power sources in the voltage (temperature). This would typically

board. be a power supply. This is analogous to

defining a boundary temperature.
9.1.1 Power Planes
9.1.1.3 Current source (or sink)
A computer aided modeling tool is
recommended for solving the temperature A point in the model where a defined

rise in planes. amount of current is added or removed can

be represented as a heat load. If a
Prior to a model being solved with a
component removes a specified current at a
computer aided analysis tool, all geometric
point in the PCB model, the current would
elements must be converted into thermal
be represented as a negative heat load at
resistances. There is a direct analogy
that point. If a voltage source acts as a
between thermal resistance and electrical
constant current source as opposed to a
resistance. Because of this, some analysis
constant voltage source, it would be
tools can be used to calculate voltage drop
represented as a positive heat load.
as opposed to temperature drop. The
following summarizes the correlations 9.1.1.4 Electrical conductivity

between thermal and voltage analysis. For geometric elements, plates, bricks and
tetrahedrons, thermal conductivity should be
Item Is analogous to:
in units of Mohs/length where Mohs equals

Temperature Voltage (Volts) 1/Ohm. Units of length must be consistent

(Degrees) with those used in the rest of the model.

21
9.1.2 Embedded Passives [1] National Bureau of Standards Progress
Report No. 4283, titled “Characterization of
Embedded passives represent capacitors
Metal-Insulator Laminates”, by D. S.
and resistors that are embedded into the
Hoynes, dated May 1, 1956
circuit board. Resistors are of primary
concern as power dissipating components. [2] J. L. Sloan, Design and Packaging of
The power dissipated by these components Electronic Equipment, New York: Van
should not be ignored. Nostrand Reinhold Company Inc., 1985

9.1.3 Conductor Sizing [3] J. P. Holman, Heat Transfer, Forth

Edition, New York: McGraw-Hill Book
The optimization of conductor
Company, 1976
10 Test Data
[4] Frank Kreith, Principles of Heat Transfer,
All test data collected and used to create the Third Edition New York: Intext Educational
charts in this document are based on Publishers, 1976
following the test method described in IPC-
[5] IPC-M-650, 2.5.4.1, Conductor
TM-650. IPC-TM-650, 2.5.4.1, Conductor
Temperature Rise Due to Current Changes
Temperature Rise Due to Current Changes
in Conductors.
in Conductors, has many of the same
[6] Harvard Thermal, Thermal Analysis
An independent research group compiled
Software, Thermal Analysis System (TAS)
data on ½ oz, 1 oz, 2 oz and 3 oz internal
Help Documentation for Voltage Drop
conductors. 2 oz and 3 oz external
Analysis.
conductor data was collected.

11 Test Method

References:

22