Lmx37 3-Terminal Adjustable Regulators: 1 Features 3 Description
Lmx37 3-Terminal Adjustable Regulators: 1 Features 3 Description
LM237, LM337
SLVS047L – NOVEMBER 1981 – REVISED JANUARY 2015
4 Simplified Schematic
LM237
or
LM337
VI INPUT OUTPUT VO
ADJUSTMENT
R1
C1 C2
+ +
R2
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM237, LM337
SLVS047L – NOVEMBER 1981 – REVISED JANUARY 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Design Schematic ..................................................... 8
2 Applications ........................................................... 1 8.4 Feature Description................................................... 8
3 Description ............................................................. 1 8.5 Device Functional Modes.......................................... 8
4 Simplified Schematic............................................. 1 9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
5 Revision History..................................................... 2
9.2 Typical Application ................................................... 9
6 Pin Configuration and Functions ......................... 3
10 Power Supply Recommendations ..................... 10
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ..................................... 4 11 Layout................................................................... 11
11.1 Layout Guidelines ................................................. 11
7.2 ESD Ratings.............................................................. 4
11.2 Layout Example .................................................... 11
7.3 Recommended Operating Conditions...................... 4
7.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 11
7.5 Electrical Characteristics.......................................... 5 12.1 Related Links ........................................................ 11
7.6 Electrical Characteristics.......................................... 5 12.2 Trademarks ........................................................... 11
7.7 Typical Characteristics .............................................. 6 12.3 Electrostatic Discharge Caution ............................ 11
12.4 Glossary ................................................................ 11
8 Detailed Description .............................................. 7
8.1 Overview ................................................................... 7 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ......................................... 7
Information ........................................................... 11
5 Revision History
Changes from Revision K (November 2007) to Revision L Page
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Deleted Ordering Information table. ....................................................................................................................................... 1
INPUT
OUTPUT
INPUT OUTPUT
INPUT
INPUT
ADJUSTMENT
ADJUSTMENT
OUTPUT OUTPUT
INPUT
INPUT
INPUT INPUT
ADJUSTMENT ADJUSTMENT
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
Adjustment pin for the output voltage. Connect two external
ADJUSTMENT 1 I
resistors to adjust the output voltage.
Input voltage. The input voltage and current will be
INPUT 2 I
designated VI and II respectively.
Output voltage. The output voltage and current will be
OUTPUT 3 O
designated VO and IO respectively.
7 Specifications
7.1 Absolute Maximum Ratings
over operating temperature ranges (unless otherwise noted) (1)
MIN MAX UNIT
VI – VO Input-to-output differential voltage –40 V
TJ Operating virtual junction temperature 150 °C
Lead temperature 1.6 mm (1/16 in) from case for 10 s 260 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
IO = 10 mA to 1.5 A, |VO| ≤ 5 V 25 50 mV
TJ = 25°C |VO| ≥ 5 V 0.3% 0.5% 0.3% 1% —
Output regulation
|VO| ≤ 5 V 50 70 mV
IO = 10 mA to 1.5 A
|VO| ≥ 5 V 1% 1.5% —
Output-voltage change with
TJ = MIN to MAX 0.6% 0.6% —
temperature
Output-voltage long-term drift After 1000 h at TJ = MAX and VI – VO = –40 V 0.3% 1% 0.3% 1% —
Output noise voltage f = 10 Hz to 10 kHz, TJ = 25°C 0.003% 0.003% —
(1) Unless otherwise noted, the following test conditions apply: |VI – VO| = 5 V and IO = 0.5 A. For conditions shown as MIN or MAX, use
the appropriate value specified under recommended operating conditions. All characteristics are measured with a 0.1-μF capacitor
across the input and a 1-μF capacitor across the output. Pulse-testing techniques are used to maintain the junction temperature as close
to the ambient temperature as possible. Thermal effects must be taken into account separately.
(2) Input regulation is expressed here as the percentage change in output voltage per 1-V change at the input.
(1) Unless otherwise noted, the following test conditions apply: |VI – VO| = 5 V and IO = 0.5 A. All characteristics are measured with a 0.1-
μF capacitor across the input and a 1-μF capacitor across the output. Pulse-testing techniques are used to maintain the junction
temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately.
(2) Input regulation is expressed here as the percentage change in output voltage per 1-V change at the input.
V(REF)
±1.260
0 300 600 900 1200 1500
Load current (mA) C001
8 Detailed Description
8.1 Overview
The LMx37 devices are adjustable 3-terminal negative-voltage regulators capable of supplying in excess of –1.5
A over an output voltage range of –1.2 V to –37 V. They are exceptionally easy to use, requiring only two
external resistors to set the output voltage and one output capacitor for frequency compensation. The current
design is optimized for excellent regulation and low thermal transients. In addition, LM237 and LM337 feature
internal current limiting, thermal shutdown, and safe-area compensation, making them virtually immune to failure
by overloads. The LMx37 devices serve a wide variety of applications, including local on-card regulation,
programmable output-voltage regulation, and precision current regulation.
OUTPUT
IADJ
+ Over temp
& over
current
protection
+ 1.25 V
ADJUST
INPUT
ADJUSTMENT
OUTPUT
INPUT
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
RS IOUT
VI INPUT OUTPUT VO
ADJUSTMENT
1.25 V
RS =
ILIMIT
This application uses the LMx37 device's reference voltage, combined with the series resistor RS, to limit the
current to 1.25 V ÷ RS
VI INPUT OUTPUT VO
ADJUSTMENT
R1
C1 C2
+ +
R2
80
CADJ = 10 µF
70 CADJ = 0 µF
60
Ripple Rejection (dB)
50
40
30
20
10
0
10 100 1k 10k 100k 1m
Frequency (Hz) D001
Figure 4. Ripple Rejection Over Frequency
11 Layout
1-PF tantalum or
10-PF aluminum
OUTPUT
Thicker traces for
1.5 A
INPUT
12.2 Trademarks
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 6-Feb-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM237KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free SN N / A for Pkg Type -25 to 150 LM237
(RoHS)
LM337KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free SN N / A for Pkg Type 0 to 125 LM337
(RoHS)
LM337KTTR ACTIVE DDPAK/ KTT 3 500 Green (RoHS SN Level-3-245C-168 HR 0 to 125 LM337
TO-263 & no Sb/Br)
LM337KTTRG3 ACTIVE DDPAK/ KTT 3 500 Green (RoHS SN Level-3-245C-168 HR 0 to 125 LM337
TO-263 & no Sb/Br)
LM337KVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS SN Level-3-260C-168 HR 0 to 125 LM337
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2020
Pack Materials-Page 2
PACKAGE OUTLINE
KVU0003A SCALE 1.500
TO-252 - 2.52 mm max height
TO-252
10.41
9.40
6.22 1.27
B A
5.97 0.89
2.29
6.70
2 5.460 6.35
4.58
4.953
3
0.890 1.02
3X NOTE 3
0.635 0.61 OPTIONAL
0.25 C A B
0.61
2.52 MAX C
0.46
0.61
0.46
SEE DETAIL A 5.21 MIN
4.32
2 4 MIN
EXPOSED 0.51
THERMAL PAD GAGE PLANE
NOTE 3
0.13
0 -8 1.78 0.00
1.40
A 7.000
DETAIL A
TYPICAL
4218915/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Shape may vary per different assembly sites.
4. Reference JEDEC registration TO-252.
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EXAMPLE BOARD LAYOUT
KVU0003A TO-252 - 2.52 mm max height
TO-252
2X (2.75)
(6.15)
2X (1)
1
4 SYMM
(4.58)
(5.55)
PKG
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
4218915/A 02/2017
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
KVU0003A TO-252 - 2.52 mm max height
TO-252
(1.18) TYP
2X (2.75)
2X (1) (0.14)
1
(R0.05)
(1.33) TYP
SYMM
(4.58)
4
20X (1.13)
(4.2) 20X (0.98)
PKG
EXPOSED PAD
65% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
4218915/A 02/2017
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
KCS0003B SCALE 0.850
TO-220 - 19.65 mm max height
TO-220
4.7
4.4
10.36 1.32
2.9 1.22 8.55
9.96
2.6 8.15
6.5
(6.3)
6.1
( 3.84) 12.5
12.1
19.65 MAX
9.25
9.05
3X
3.9 MAX
13.12
12.70
1 3
0.90 0.47
3X 0.34
0.77
2.79
2X 2.54
2.59
1.36
3X
1.23
5.08
4222214/B 08/2018
NOTES:
1. Dimensions are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-220.
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EXAMPLE BOARD LAYOUT
KCS0003B TO-220 - 19.65 mm max height
TO-220
(1.7)
1 2 3 0.07 MAX
R (0.05) (2.54) ALL AROUND
4222214/B 08/2018
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