GDM-based Generation of AXE Core Switching Devices: Jan Hopfinger and Björn Sundelin
GDM-based Generation of AXE Core Switching Devices: Jan Hopfinger and Björn Sundelin
switching devices
Jan Hopfinger and Björn Sundelin
The generic device magazine concept was developed to fully exploit the • Extension terminal (ET) products for pri-
advantages of the rationalized group switch and AXE core switching mary rate transmission.
devices. The idea of a standard, equipped magazine has evolved to promote • Signaling and tone-handling equipment.
a flexible and economical use of generic device magazines. The advantage • No. 7 signaling terminals.
of GDMs is that they can be fully assembled and tested at the factory. They • Announcement service terminals (AST).
To these, two new families will soon be
can then be mounted into standard cabinets which, when fully assembled,
added; namely,
can also be tested in-house. As a consequence, entire nodes can be assem- • high-speed extension terminal products
bled and tested before delivery. To the customer, this means that the dura- for 155 Mbit/s transmission;
tion of on-site installation and testing can be reduced from several weeks to • high-speed no. 7 signaling terminals.
as little as one day, depending on the size of the node. Additional core switching devices include:
The authors describe AXE core switching devices, explaining the evolution pulse-code devices (PCD), digital PCD
of exchange terminal circuits and introducing the latest generation of (PCD-D) and equipped magazines. Core
Ericsson’s tone-handling and signaling products, including the PDSPL-2H, switching devices do not comprise their own
RMS and no. 7 signaling terminals. subsystem within AXE, but belong to sev-
eral subsystems, such as
• the trunk and signaling subsystem (TSS);
• the subscriber switching subsystem (SSS);
• the operation and maintenance subsystem
AXE core switching (OMS);
devices • the common channel signaling subsystem
(CCS);
AXE core switching products fall into two • the extended switching subsystem;
different categories: products that belong to • the remote measurement subsystem
the group switch subsystem (GSS) and AXE (RMS).
core switching devices, which consist of
APT devices and extended switching sub- System evolution
system (ESS) products. The new group
switch was described in Ericsson Review no. The current generation of AXE core switch-
2, 1997. Our article covers a similar evolu- ing devices has evolved around four key fac-
tion of AXE core switching devices. tors:
Two salient features of AXE core switch- • digital link interface 3 (DL3);
ing devices may be pointed out. They are • generic device magazines (GDM);
connected to the group switch—via digital • smaller footprint;
link interfaces—and they belong to the APT • hardware platforms.
part of AXE. Today, core switching devices Together, these factors yield the largest evo-
fall into four families: lution of core switching devices since AXE
Figure 1 was created in the mid-1970s.
APT devices.
DL3 interface and the
PDSPL ET-PDH GDM concept
• CSR R2 • TRU • 2 Mbit/s ETSI The introduction of the new internal DL3
• CSR R1 Mu-law • CCD • 1.5 Mbit/s ANSI interface constituted a big improvement in
• CSR R1 A-law • CSKD • 2 Mbit/s TTC
• CSR No. 5 • KRDD the AXE core switching part. The DL3 suc-
• CSR AON • CSFSKD ceeds the digital link 2 (DL2). Serving as an
• CSR MFP1/2 • TCD IBSD
• CAT internal interface that carries up to 512
• No 5 line signaling
speech channels, it carries sixteen times as
RMS6 much traffic per cable.
GSS
ET-SDH The DL3 interface greatly reduces inter-
RPG-2
nal cabling and also makes it possible to mix
• ET155 – ETSI traffic from different devices in the interface
• C7 – ITU-T to the time switch module (TSM) part in the
GDM • S7 – ANSI
switching subsystem. The generic device
S7 DS0A
magazine concept was developed to fully ex-
Non-GDM
ploit the advantages of the DL3. A generic
AST
device magazine is a magazine whose archi-
Part-GDM S7 V.35 tecture permits different devices to be
mixed/mounted very freely (Figure 2).
Box A
Abbreviations
ANSI American National Standards GDM-F Full-size GDM RAM Random access memory
Institute GDM-H Half-size GDM RMS Remote measurement sub-
ASIC Application-specific integrated circuit GRETA Group switch and exchange ter- system
AST Announcement service terminal minal adapter RMS6 Sixth-generation remote measure-
BSC Base station controller GSS Group switch subsystem ment subsystem
CAS Channel associated signaling IOG Input/output (I/O) group RMS6-F Sixth-generation full-size RMS
CAT Code answer and tone sender IOG11 I/O system 11 RP Regional processor
CCD Conference call device IOG20 I/O system 20 RP4 Fourth-generation RP
CCS Common channel signaling (sub- ISDN Integrated services digital network RPB-S Serial RP bus
system) ITU-T International Telecommunication RPG RP with group switch interface
CMOS Complementary metal-oxide semi- Union – Telecommunications Sector RPG-2 Second-generation RPG
conductor KRD Keyset receiver device RPP RP with PCI interface (RPP is used
CRC Cyclic redundancy check MSC Mobile switching center for datacom applications)
CSK Code sender for DTMF tones NTT Nippon Telegraph and Telephone SCSI Small computer system interface
CSR Code sender/receiver Corporation SDH Synchronous digital hierarchy
CSR R2 Code sender/receiver, signaling OC-1 Optical carrier, 51 Mbit/s link SDI Serial device interface
system R2 OC-3 Optical carrier, 155 Mbit/s link SP Support processor
DL2, DL3 Digital link 2, digital link 3 OMS Operation and maintenance sub- SSM Synchronization status message
DP Device processor system SSS Subscriber switch subsystem
DRAM Dynamic RAM PCD Pulse-code device STP Signal transfer point
DS0A Digital signal (level 0) A PCD-D Digital PCD T1 Physical 1.5 Mbit/s link, ANSI
DSP Digital signal processor PCI Peripheral component intercon- standard
DTMF Dual-tone multifrequency nect TCD Trunk continuity check device
EM Extension module PCM Pulse code modulation TSM Time switch module
ESS Extended switching subsystem PDSPL Pooled digital signaling platform TRH Transceiver handler
ET Exchange terminal PDSPL-2H Second generation, half-size TT Test telephone
ETC Exchange terminal circuit PDSPL TTC Telecommunications Technology
ETSI European Telecommunications PLL Phase-locked loop Council (Japan)
Standards Institute PRA Primary rate access TSS Trunk and signaling subsystem
GDM Generic device magazine PROM Programmable read-only memory VLSI Very large-scale integrated circuit
Box C
Transmission hierarchies
ETSI standard toring transmission. Robbed bit signaling is
used (CAS); otherwise, one of the speech chan-
64 kbit/s nels may be used for signaling purposes (CCS).
One speech channel. Resulting 8-bit sampling
of analog speech signal with sampling fre- 51 Mbit/s OC-1
quency 8 kHz. A-law coded. ETSI denomina- Lowest level in the SONET hierarchy. Contains
tions are P0 = logical 64 kbit/s; 28 DS1s and other information, mostly for
E0 = electrical P0. monitoring transmission.
D-
GSNIC Group switching network interface RDIP DIP
TANK
interface • 1,544 kbit/s ANSI standard.
circuit
PMP Physical monitor points ETC 5 • 2,048 kbit/s Japan-specific standard.
RDIP Receive DIP Front Discrete on- Board Exchange terminal circuits have been de-
connectors board parts; such identification
SDI Signaling device interface
as DIP, EM, & indication
veloped for each of the standards and intro-
SDIP Send DIP and DL interfaces interface duced in the BYB 501.
ETC 32
The ETC 32—the exchange terminal cir-
cuit that complies with the ETSI standard—
is a high-volume product of which several
hundred thousand examples are manufac-
tured each year. The huge market volumes
have made it necessary to improve and ra-
• In-band signaling device. tionalize the product several times. The lat-
• Test telephones (TT). est version, which has been introduced in
• Regional processors with PCI interface the BYB 501, is called ETC 5.
(RPP, used in applications that do not re- The ETC 5 was designed to be a single,
quire Ethernet). half-size board for the GDM-H. It is only
The objective is to design all core switching half as large as its predecessor, the ETC 4.
devices as half-size boards in the GDM-H Its diminutive size was achieved mainly by
(apart from low-volume products, such as reducing the number of application-
the RMS6 and ETC J32). specific integrated circuits (ASIC) from five,
The following devices can be mounted in in the ETC 4, to one in the ETC 5 (Figure
the GDM-F: 4). Combined with advanced board design
ETC 24
The ETC 24 complies with the ANSI stan-
dard for exchange terminal circuits. It is
used in North America, Egypt, and certain
countries in Southeast Asia (Hong Kong,
South Korea and Japan).
ETC-T1F
The ETC 24 has a long history of evolution.
In 1986, it was implemented in a single-
board solution.1 Later, in 1996, a new ETC ETC-T1F
24—called the ETC-T1—was introduced
DC/DC SDI
with support for monitoring performance converter
and functionality for the Japanese CRC. As Device ASIC
processor
introduced in the BYB 501, the ETC 24 is MC 68302
EM6C
PMP
very similar, in terms of functionality, to the
ETC-T1. Designers have added board iden- ASIC ASIC
DIP inter-
face
GSNIC
TSH EM6CI2
tification and indication functionality (a
ASIC
ETC-T1H
Merely porting such an important product DC/DC
converter SDI
as the ETC 24 to the BYB 501 was not Figure 6
enough, however. Instead, engineers have ASIC PMP
Evolution of the ETC T1F into the ETC T1H.
HOMER DC/DC Direct current/direct current
continued to refine its design. The latest ver- DIP DIP Digital path
sion, named ETC-T1H, is contained on a interface DL Digital link
single, half-size board in the GDM-H. The EM6C Extension module circuit
ETC-T1H integrates into one ASIC the ETC-T1H GSNIC Group switching network interface
circuit
functionality that had previously been im- Discrete on- Board Front
PMP Protected monitor points
board parts, such identification connectors
plemented in nine separate circuits on the as DIP, EM, & indication SDI Signaling device interface
ETC-T1F. Furthermore, power dissipation and DL interfaces interface VCO Voltage controlled oscillator
Japanese ETC 32
Figure 9 MF tones
The ETC J32, which was developed for the
Several tone-based systems for inter- ET CSR Japanese standard, is solely used in mobile
CSR ET
exchange signaling are implemented on the
PDSPL platform; for example, R1, R2 and no. applications in Japan. In the BYB 501, it
MF tones
5 (ISBD is a special board used for no. 5 line has the same functionality as its predecessor
signaling). IBSD IBSD with the addition of board identification and
indication functionality.
DC/DC
5V
The three digital signal processors are con- DL2
LPF EMB IDB
nected to a 2 Mbit/s time-slot bus that en-
ables them to be freely allocated for sending
SRAM SRAM GSNIC
data to, or receiving data from, any time slot.
EEPROM
EM6C
Firmware is stored in flash programma-
ble read-only memory (PROM). When DSP 0
320C542
reset, the device processor part is copied into
dynamic RAM (DRAM) and the DSP part
is downloaded into internal memory. Two Osc.
EMIF
ASICs are used for interfacing the micro- DSP 1 32 MHz
320C542
processor with the EM bus. A third ASIC is
used for interfacing the time slot bus with 16 MHz
the group-switch DL2 interface in the 12C I/O
GDM-H backplane. DSP 2
320C542
The applications that run on the PDSPL Flash
DRAM
PROM
were designed on top of a firmware platform DP
that contains functions for inter-processor 68302
Div 2
Daughter board 8 MHz 16 MHz
LED
Figure 12
PDSPL hardware block diagram.
Figure 13
Photograph of the PDSPL-2H, a double-width,
half-size board to be placed in the GDM-H.
Operating Scheduler
RP system
commun-
ication Algorithm
protocol Mainten- Mainten-
ance ance
HW drivers HW drivers
Reference
1 Mårtensson, L., Nyström, B. and
Samuelsson, A.: New exchange termi-
nal circuit and MF signalling equipment
in AXE 10. Ericsson Review 64
(1987):2, pp. 74-84.