FULLY AUTOMATIC
DICING SAW
DFD6362
DFD6362
This document is Disco confidential and is intended for specific customers.
It must not be copied, disclosed, or transferred to third parties.
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
Contents 2/29
Machine Outline
Machine Layout & Workflow
Advantages
Lower CoO
Improved yield
Improved User Friendliness
Summary
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
Machine Outline 3/29
• Φ8-inch,φ300-mm wafer processing
• Lower CoO based on improved productivity and
Target utilization
• Improved yield based on particle control
• Facing-dual machine
• Newly developed high-speed X, Y, Z-axes
• Newly developed high-speed handling
Machine • Newly developed high-speed rotation spindle (Option)
Structure • Small footprint (Same as DFD6361)
• Automatic Blade Changer support (Option)
• Number of options for particle control
• New utility software installed
• Employs a user friendly GUI
Operability • Safety (Plan to acquire CE marking, Conforms to Semi
S2-0703 or S8-1103)
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
Machine Layout & Workflow 4/29
Spinner
table
Pre-alignment
Z1-axis
stage
Chuck
table
Z2-axis
Cassette
elevator
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
Advantages 5/29
1. Lower CoO
2. Improved yield
3. Improved User Friendliness
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
6/29
1. Lower CoO
A. Improved productivity
B. Improved utilization
2. Improved yield
3. Improved User Friendliness
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
A．Improved productivity 7/29
Shorter processing time
Higher mechanical efficiency
1) Both axes have faster return speeds
2) Shorter distance between Z1/Z2 blades
3) Faster handling
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
1) Both axes have faster return speeds 8/29
The return speed of each axis is substantially faster
→ Shorter processing time
In particular for smaller indexes the throughput is greatly
improved.
DFD6362 DFD6361 Company A
Maximum X (mm/sec) 1,000 600 1,000
axis Y (mm/sec) 250 200 250
speed Z (mm/sec) 80 50 60
Note: The numerical values for DFD6362 are target values. Will
measure the effect on UPH.
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
2) Shorter distance between blades 9/29
Newly designed thin flange wheel cover
→ Improved throughput based on shorter distance between
Z1 and Z2 axes
Greatly improved throughput for bevel cut/step cut, and
short indexes
DFD6361
Distance between
blades: 30 mm
20% reduction
DFD6362
Distance between
blades: 24mm
Note: Plan to measure the effect on UPH.
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
3) Faster handling 10/29
Faster handling due to ball screw mechanisms
=> Shortens the workpiece exchange by over by 50%
From 7.2 sec => 3.6 sec (target)
Upper arm
２. From C/T to S/T
２
Lower arm
１. From cassette to pre-alignment
stage
３. From S/T to cassette
１
３
Note: Plan to measure effect on UPH
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
B．Improved utilization 11/29
Option
Automatic Blade Changer (ABC) Function
=> Lowers down time and contributes to unmanned,
automatic operation
Blade replacement time: about 5 min (manual) => 60 sec
Blade case bar
ABC Unit is installed in code reader
the machine’s side panel
ABC Unit
Blade stocker stores a
DFD6361 Photograph maximum of five blades
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
12/29
1. Lower CoO
2. Improved yield
A. Enhanced particle control
B. High rotation speed spindle
3. Improved User Friendliness
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
A．Enhanced Particle Control 13/29
Ample options available for particle control to improve yields
Cleaning / Removing
Remove particles during and after processing
1) Cut area atomizing nozzle spray mechanism
2) Spinner unit atomizing nozzle cleaning mechanism
Particle Channeling
Controls the path that the cutting debris
(particles) takes during cutting
3) Particle control wheel cover
Adhesion Prevention
Prevents particles from adhering to the workpiece
4) Chuck table water curtain
5) StayClean
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
1) Cleaning/Removing: Removal during cutting 14/29
Option
Cutting area atomizing nozzle spray mechanism
=> Particles removed before adhering to the workpiece
Shower nozzle:
3 o’clock direction,
φ2mm
Forced
exhaust
duct Cutting area
atomizing nozzle
spray
DFD6361 Photograph
Si nozzle: Downward direction 60 deg,
Cutting area atomizing nozzle spray structure Width: 0.2mm, Length: 0.9mm, Five slits
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
2) Cleaning/Removing: Strengthen cleaning capability
15/29
Option
Spinner unit atomizing nozzle cleaning mechanism
=> Significantly improves cleaning strength during the
cleaning process
Moment of impact
Impact & Mist (droplets)
expansion wave
After impact Jet water flow
Particle
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
3) Channeling: Control cutting water 16/29
Option
Improved wheel cover
=> Controls dispersal of particles around the
processing point
Improved Wheel Cover
Spray duct
Forced
V-nozzle (Special
exhaust duct
shower nozzle)
Six hole spray
Side flow nozzle nozzle
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
4) Adhesion prevention: Form a water film on the workpiece
17/29
Option
Chuck table water curtain
=> Prevents particles from drying to the workpiece
surface
X direction Hydrophilic condition
Condition of mist viewed
from the side
Water repellent condition
Condition of mist viewed
from the side
Particularly effective for devices that have
a repellent surface and dry easily, such
as image sensors
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
5) Adhesion prevention: Add a solution to the cutting water
18/29
Option
Additive “StayClean” for cutting water
=> Prevents particles in the cutting water from
contacting the workpiece surface
Water soluble polymer
Effective against corrosion and cutting debris
adhering to inorganic objects, such as aluminum
contact pads
StayCean is added to
the cutting water using
a liquid injector unit
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
Under
B．High Rotation Speed Spindle Development
19/29
Option
High rotation speed spindle (Max: 80000 min-1)
=> Lowers side cracking when dicing thin wafers
Test Side crack (um) Side
[avg. / max.]
Test S-23 4 / 16
Conditions:
ZH05-SD4800-
N1-50 BD Patterned wafer
80,000 min-1 Diameter: 8 inch
DFD6361
Thickness: 25 um
Finish: Poli
Test S-24 12 / 25
Flow rate:
ZH05-SD4800- shower 0.8 L/min
N1-50
BD
blade 1.5 L/min
50,000 min-1 Feed speed: 10
DFD6450 mm/s
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
20/29
1. Lower CoO
2. Improved yield
3. Improved User Friendliness
A. Improved usability
B. Conforms to safety and environmental specifications
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
３．Improved User Friendliness 21/29
A. Improved usability
1) Improved utility software
2) Improved management
Host system – DicerNet
3) Enhanced options
B. Conforms to safety and environmental specifications
Safety
1) CE marking : will be acquired in Feb. 2008
2) SEMI S2-0200 : will be acquired in Feb. 2008
3) SEMI S8-0600 : will be acquired in Feb. 2008
Environment
1) Considering RoHS compliant parts (partially not compliant material is used)
2) Lower power consumption
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
1) Improved operability: New utility software 1 22/29
Newly added graphic display function
=> Improved operability
XIS mode Wafer map – line mode
Able to visually
confirm the cut line
according to each
situation
Wafer map – Work mode
Able to directly manipulate Able to instantly move
the displayed microscope the image to a specific
image with simple operations position on the
workpiece
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
1) Improved operability: New utility software 2 23/29
Analog time-line graph New kerf recognition function
Street Kerf
Kerf edge
Kerf edge
including
chipping
Improves recognition precision
Can be used as an analysis tool during kerf check by employing a
when errors occur by graphically unique algorithm
displaying the change of the analog
sensor values in the machine
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
2) Improved management: Host system 24/29
Option
DicerNet: A host system that coordinates dicers and
blades
=> Simplifies dicer management
DicerNet Structure Image
1) Able to track various machine operations in Office environment
real time
File server and & Web server
– Traceability function
– Understanding MTBF
– Number of data save functions User client
2) Blade management
– Simplified blade information input
– Blade inventory control Clean room environment
– Easy to manage and recycle used
blades
3) Kerf width analysis function
– Eliminates variation in the initial blade
thickness from the data.
Dicer, blade and bar code reader
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
3) Enhanced Options (special accessories) 25/29
Option
• Improved process stability: NCS, UPS, Ionizer
• Improved processing precision: DTU1531, CO2 injector
• Support for various work pieces
– 1.8 kW spindle
– 2.2 kW spindle
– 3-inch hub mount (for 2.2 kW spindle)
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
Summary 26/29
Lower CoO
Improved throughput
Improved utilization
Improved yield
Better control of particles
High rotation speed spindle
Improved User Friendliness
Improved usability
Conforms to safety and environmental
specifications
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
27/29
Machine
Application
Blade
Fin.
DISCO CONFIDENTIAL ©2007 DISCO CORPORATION All rights reserved
