bq24190, bq24192

bq24192I, bq24193
www.ti.com SLUSAW5A – JANUARY 2012 – REVISED OCTOBER 2012

I2C Controlled 4.5A Single Cell USB/Adapter Charger

With Narrow VDC Power Path Management and USB OTG
Check for Samples: bq24190, bq24192, bq24192I, bq24193

1FEATURES • High Accuracy (0°C to 125°C)

2• High Efficiency 4.5A Switch Mode Charger – ±0.5% Charge Voltage Regulation
– 92% Charge Efficiency at 2A, 90% at 4A – ±7% Charge Current Regulation
– Accelerate Charge Time by Battery Path – ±7.5% Input Current Regulation
Impedance Compensatioin – ±2% Output Regulation in Boost Mode
• Highest Battery Discharge Efficiency with • High Integration
12mΩ Battery Discharge MOSFET up to 9A – Power Path Management
Discharge Current
– Synchronous Switching MOSFETs
• Single Input USB-compliant/Adapter Charger
– Integrated Current Sensing
– USB Host or Charging Port D+/D- Detection
– Bootstrap Diode
Compatible to USB Battery Charger Spec
1.2 – Internal Loop Compensation
– Input Voltage and Current Limit Supports • Safety
USB2.0 and USB 3.0 – Battery Temperature Sensing and Charging
– Input Current Limit: 100mA, 150mA, 500mA, Safety Timer
900mA, 1.2A, 1.5A, 2A and 3A – JEITA Guideline Compliant (bq24193)
• 3.9V–17V Input Operating Voltage Range – Thermal Regulation and Thermal Shutdown
– Support All Kinds of Adapter with Input – Input System Over-Voltage Protection
Voltage DPM Regulation – MOSFET Over-Current Protection
• USB OTG 5V at 1.3A Synchronous Boost • Charge Status Outputs for LED or Host
Converter Operation Processor
– 93% 5V Boost Efficiency at 1A • Low Battery Leakage Current and Support
• Narrow VDC (NVDC) Power Path Management Shipping Mode
– Instant-on Works with No Battery or Deeply • 4mm x 4mm QFN-24 Package
Discharged Battery
– Ideal Diode Operation in Battery APPLICATIONS
Supplement Mode • Tablet PC
• 1.5MHz Switching Frequency for Low Profile • Smart Phone
Inductor • Portable Audio Speaker
• Autonomous Battery Charging with or without • Portable Media Players
Host Management • Internet Devices
– Battery Charge Enable
– Battery Charge Preconditioning
– Charge Termination and Recharge

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
bq24190, bq24192
bq24192I, bq24193
SLUSAW5A – JANUARY 2012 – REVISED OCTOBER 2012 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION
The bq24190, bq24192, bq24192I, and bq24193 are highly-integrated switch-mode battery charge management
and system power path management devices for single cell Li-Ion and Li-polymer battery in a wide range of
tablet and other portable devices. Its low impedance power path optimizes switch-mode operation efficiency,
reduces battery charging time and extends battery life during discharging phase. The I2C serial interface with
charging and system settings makes the device a truly flexible solution.
The device supports a wide range of input sources, including standard USB host port, USB charging port and
high power DC adapter. To set the default input current limit, the bq24190 detects the input source following the
USB battery charging spec 1.2, and the bq24192, bq24192I, and bq24193 takes the results from detection circuit
in the system, such as USB PHY device. The bq24190,192,192I, and 193 are compliant with USB 2.0 and USB
3.0 power specifications with input current and voltage regulation. Meanwhile, the bq24190, bq24192, bq24192I,
and bq24193 meets USB On-the-Go operation power rating specification by supplying 5V on the VBUS with a
current limit up to 1.3A.
The power path management regulates the system slightly above battery voltage but does not drop below 3.5V
minimum system voltage (programmable). With this feature, the system maintains operation even when the
battery is completely depleted or removed. When the input current limit or voltage limit is reached, the power
path management automatically reduces the charge current to zero. As the system load continues to increase,
the power path discharges the battery until the system power requirement is met. This supplement mode
operation prevents overloading the input source.
The devices initiate and complete a charging cycle without software control. It automatically detects the battery
voltage and charges the battery in three phases: pre-conditioning, constant current and constant voltage. At the
end of the charging cycle, the charger automatically terminates when the charge current is below a preset limit in
the constant voltage phase. When the full battery falls below the recharge threshold, the charger will
automatically start another charging cycle.
The bq24190, bq24192, bq24192I, and bq24193 provide various safety features for battery charging and system
operation, including dual pack negative thermistor monitoring, charging safety timer and over-voltage/over-
current protections. The bq24193 supports JEITA guideline compliant temperature profile. The thermal regulation
reduces charge current when the junction temperature exceeds 120°C (programmable).
The STAT output reports the charging status and any fault conditions. The PG output in the bq24192, bq24192I,
and bq24193 indicates if a good power source is present. The INT immediately notifies the host when a fault
occurs.
The bq24190, bq24192, bq24192I, and bq24193 are available in a 24-pin, 4x4 mm2 thin QFN package.

bq2419x Family Table

bq24190 bq24192 bq24192I bq24193
2
I C Address 6BH 6BH 6BH 6BH
USB Detection D+/D– PSEL PSEL PSEL
Default VINDPM 4.36V 4.36V 4.44V 4.36V
Default Battery Voltage 4.208V 4.208V 4.112V 4.208V
Default Charge Current 2.048A 2.048A 1.024A 2.048A
Default Adapter Current 1.5A 3A 1.5A 3A
Limit
Maximum Pre-charge 2.048A 2.048A 640mA 2.048A
Current
Charging Temperature Cold/Hot Cold/Hot Cold/Hot JEITA
Profile 2 TS pins 2 TS pins 2 TS pins 1 TS pin
Status Output STAT STAT, PG STAT, PG STAT, PG
STAT During Fault Blinking @ 1Hz Blinking @ 1Hz 10k to ground Blinking @ 1Hz

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 bq24190, bq24192
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ORDERING INFORMATION
PART NUMBER PART MARKING PACKAGE ORDERING NUMBER QUANTITY
bq24190RGER 3000
bq24190 bq24190 24-pin 4mmx4mm VQFN
bq24190RGET 250
bq24192RGER 3000
bq24192 bq24192 24-pin 4mmx4mm VQFN
bq24192RGET 250
bq24192IRGER 3000
bq24192I bq24192I 24-pin 4mmx4mm VQFN
bq24192IRGET 250
bq24193RGER 3000
bq24193 bq24193 24-pin 4mmx4mm VQFN
bq24193RGET 250

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APPLICATION DIAGRAM

bq24190 1μH SYS: 3.5V-4.35V

5V USB SDP/DCP
VBUS SW
1μF PMID 10μF 10μF 10μF 10μF
47nF
6.8μF
USB BTST
D+ REGN
4.7μF
D–
SYS PGND

2.2kW
STAT SYS
VREF
BAT
10kW 10kW 10kW 353W 10μF
(1.5A max)
SDA ILIM
SCL
Host REGN
INT
OTG 5.52kW
CE TS1
TS2
31.23kW 10kW
(103-AT)
Power Pad

Figure 1. bq24190 with D+/D- Detection and USB On-The-Go (OTG)

bq24192 2.2μH SYS: 3.5V-4.35V

5V USB or SW
VBUS
5V Adapter PMID
1μF 47nF
6.8μF 10μF 10μF
BOOT
REGN
4.7μF
SYS
PGND

2.2kW
SYS
VREF PG
STAT BAT
10kW 10kW 10kW 177W 10μF
(3A max)
SDA
ILIM
Host SCL
REGN
INT
OTG 5.52kW
CE TS1
TS2
31.23kW 10kW
PHY PSEL
(103-AT)
Power Pad

Figure 2. bq24192 with PSEL and USB On-The-Go (OTG)

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bq24192I, bq24193
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bq24192I 2.2μH SYS: 3.5V-4.35V

5V USB VBUS SW
15V Adapter 1μF PMID 47nF
6.8μF 10μF 10μF
BOOT
REGN
4.7μF
SYS
PGND

2.2kW
SYS
VREF PG
STAT BAT
10kW 10kW 10kW 353W 10μF
(1.5A max)
SDA ILIM
Host SCL
REGN
INT
OTG 10kW
CE TS1
TS2
10kW
PHY PSEL
Power Pad

Figure 3. bq24192I with PSEL, USB On-The-Go (OTG), No Thermistor Connections

bq24193 2.2μH SYS: 3.5V-4.35V

12V Adapter VBUS SW
1μF PMID 47nF 10μF 10μF
10μF
BOOT
REGN
1μF

SYS
PGND

2.2kW
SYS
VREF PG
STAT BAT
10kW 10kW 10kW 265W 10μF
(2A max)
SDA ILIM
Host SCL
INT REGN
OTG 2.27kW
CE
TS1
TS2
10kW
PSEL 6.86kW
(103-AT)
Power Pad

Figure 4. bq24193 with PSEL, USB On-The-Go (OTG) and Support JEITA Profile

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FUNCTIONAL BLOCK DIAGRAM

VBUS
PMID

3.8V Q1
UVLO
Q1 Gate
VBATz +80mV
Control
SLEEP REGN REGN
LDO
EN_HIZ
ACOV
18V BTST
FBO

VBUS VBUS_OVP_BOOST
5.4V

I(Q2) Q2_UCP_BOOST
VINDPM 100mA
SW
I(Q3) Q3_OCP_BOOST
IINDPM 3.2A CONVERTER Q2
CONTROL
BAT BATOVP REGN
IC TJ 104%xVBAT_REG
BAT
TREG
VBAT_REG 100mA
UCP I(Q2)
Q3 PGND
SYS I(Q3) Q2_OCP
7A
VSYSMIN
ICHG_REG EN_HIZ V(BTST-SW)
EN_CHARGE REFRESH
4.2V
EN_BOOST

SYS

ICHG

VBAT_REG
ICHG_REG Q4 Gate
REF
DAC Control
30mA
BAD_SRC
IDC Q4
ILIM CONVERTER BAT
CONTROL IC TJ
STATE TSHUT
D+ (190) TSHUT
USB Host MACHINE
D– (190) Adapter BAT
Detection USB BAT_GD
PSEL(192/192I/193) Adapter
1.5A
3.6V bq2419x
OTG 4.1V
RECHRG
BAT
INT
ICHG
TERMINATION BATTERY
CHARGE ITERM
bq24190/192/193 THERMISTER TS1
CONTROL
STAT SUSPEND SENSING
STATE
2.8V (bq24190/192/
bq24192I MACHINE BATLOWV
192I Hot/Cold) TS2
BAT
I2C (bq24193 JEITA)
PG(192/192I/193) 2V
Interface BATSHORT
BAT

SCL SDA CE

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PINOUTS

REGN

REGN
VBUS
VBUS

BTST
BTST

PMID
PMID

SW

SW
SW

SW
24 23 22 21 20 19 24 23 22 21 20 19

VBUS 1 18 PGND VBUS 1 18 PGND

D+ 2 17 PGND PSEL 2 17 PGND

bq24192
D– 3 16 SYS PG 3 16 SYS
bq24190 bq24192I
STAT 4 15 SYS STAT 4 bq24193 15 SYS

SCL 5 14 BAT SCL 5 14 BAT

SDA 6 13 BAT SDA 6 13 BAT

7 8 9 10 11 12 7 8 9 10 11 12

TS1
ILIM
CE
OTG

TS2
INT
TS1
ILIM
OTG

CE

TS2
INT

PIN FUNCTIONS
PIN
TYPE DESCRIPTION
NAME NO.
VBUS 1,24 P Charger Input Voltage. The internal n-channel reverse block MOSFET (RBFET) is connected between VBUS and PMID
with VBUS on source. Place a 1µF ceramic capacitor from VBUS to PGND and place it as close as possible to IC. (Refer
to Application Information Section for details)
D+ 2 I Positive line of the USB data line pair. D+/D– based USB host/charging port detection. The detection includes data
(bq24190) Analog contact detection (DCD) and primary detection in bc1.2.
PSEL – I Power source selection input. High indicates a USB host source and Low indicates an adapter source.
(bq24192 Digital
bq24192I
bq24193)
D– 3 I Negative line of the USB data line pair. D+/D– based USB host/charging port detection. The detection includes data
(bq24190) Analog contact detection (DCD) and primary detection in bc1.2.
PG – O Open drain active low power good indicator. Connect to the pull up rail via 10kohm resistor. LOW indicates a good input
(bq24192 Digital source if the input voltage is between UVLO and ACOV, above SLEEP mode threshold, and current limit is above 30mA.
bq24192I
bq24193)
STAT 4 O Open drain charge status output to indicate various charger operation. Connect to the pull up rail via 10kohm. LOW
Digital indicates charge in progress. HIGH indicates charge complete or charge disabled. When any fault condition occurs, STAT
pin in bq24190, bq24192, bq24193 blinks at 1Hz, and STAT pin in bq24192I has a 10kΩ resistor to ground.
SCL 5 I I2C Interface clock. Connect SCL to the logic rail through a 10kΩ resistor.
Digital
SDA 6 I/O I2C Interface data. Connect SDA to the logic rail through a 10kΩ resistor.
Digital
INT 7 O Open-drain Interrupt Output. Connect the INT to a logic rail via 10kΩ resistor. The INT pin sends active low, 256us pulse
Digital to host to report charger device status and fault.
OTG 8 I USB current limit selection pin during buck mode, and active high enable pin during boost mode.
Digital In buck mode with USB host (PSEL=High), when OTG = High, IIN limit = 500mA and when OTG = Low, IIN limit =
100mA.
The boost mode is activated when the REG01[5:4]=10 and OTG pin is High.
CE 9 I Active low Charge Enable pin. Battery charging is enabled when REG01[5:4]=01 and CE pin = Low. CE pin must be
Digital pulled high or low.
ILIM 10 I ILIM pin sets the maximum input current limit by regulating the ILIM voltage at 1V. A resistor is connected from ILIM pin to
Analog ground to set the maximum limit as IINMAX = (1V/RILIM) × 530. The actual input current limit is the lower one set by ILIM
and by I2C REG00[2:0]. The minimum input current programmed on ILIM pin is 500mA.

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PIN FUNCTIONS (continued)

PIN
TYPE DESCRIPTION
NAME NO.
TS1 11 I Temperature qualification voltage input #1. Connect a negative temperature coefficient thermistor. Program temperature
Analog window with a resistor divider from REGN to TS1 to GND. Charge suspends when either TS pin is out of range.
Recommend 103AT-2 thermistor. TS1 and TS2 pins have to be shorted together in bq24193.
TS2 12 I Temperature qualification voltage input #2. Connect a negative temperature coefficient thermistor. Program temperature
Analog window with a resistor divider from REGN to TS2 to GND. Charge suspends when either TS pin is out of range.
Recommend 103AT-2 thermistor. TS1 and TS2 pins have to be connected together in bq24193.
BAT 13,14 P Battery connection point to the positive terminal of the battery pack. The internal BATFET is connected between BAT and
SYS. Connect a 10uF closely to the BAT pin.
SYS 15,16 P System connection point. The internal BATFET is connected between BAT and SYS. When the battery falls below the
minimum system voltage, switch-mode converter keeps SYS above the minimum system voltage. (Refer to Application
Information Section for inductor and capacitor selection)
PGND 17,18 P Power ground connection for high-current power converter node. Internally, PGND is connected to the source of the n-
channel LSFET. On PCB layout, connect directly to ground connection of input and output capacitors of the charger. A
single point connection is recommended between power PGND and the analog GND near the IC PGND pin.
SW 19,20 O Switching node connecting to output inductor. Internally SW is connected to the source of the n-channel HSFET and the
Analog drain of the n-channel LSFET. Connect the 0.047µF bootstrap capacitor from SW to BTST.
BTST 21 P PWM high side driver positive supply. Internally, the BTST is connected to the anode of the boost-strap diode. Connect
the 0.047µF bootstrap capacitor from SW to BTST.
REGN 22 P PWM low side driver positive supply output. Internally, REGN is connected to the cathode of the boost-strap diode. For
VBUS above 6V, connect 1-µF ceramic capacitor from REGN to analog GND. For VBUS below 6V, connect a 4.7-μF
(10V rating) ceramic capacitor from REGN to analog GND. The capacitor should be placed close to the IC. REGN also
serves as bias rail of TS1 and TS2 pins.
PMID 23 O Connected to the drain of the reverse blocking MOSFET and the drain of HSFET. Given the total input capacitance,
Analog connect a 1-µF capacitor on VBUS to PGND, and the rest all on PMID to PGND. (Refer to Application Information Section
for details)
PowerPAD – P Exposed pad beneath the IC for heat dissipation. Always solder PowerPAD™ to the board, and have vias on the Power
Pad plane star-connecting to PGND and ground plane for high-current power converter.

ABSOLUTE MAXIMUM RATINGS

VALUE
VBUS –2 V – 20 V
PMID, STAT, PG –0.3 V –20 V
BTST –0.3 V – 26 V
SW –2 V – 20 V
Voltage range (with respect to GND)
BAT, SYS (converter not switching) –0.3 V – 6 V
SDA, SCL, INT, OTG, ILIM, REGN, TS1, TS2, CE, PSEL, D+, D– –0.3 V – 7 V
BTST TO SW –0.3 V – 7 V
PGND to GND –0.3 V – 0.3 V
Output sink current INT, STAT, PG 6mA
Junction temperature –40°C to 150°C
Storage temperature –65°C to 150°C

RECOMMENDED OPERATING CONDITIONS

MIN MAX UNIT
VIN Input voltage 3.9 17 (1) V
IIN Input current 3 A
ISYS Output current (SYS) 4.5 A
VBAT Battery voltage 4.4 V

(1) The inherent switching noise voltage spikes should not exceed the absolute maximum rating on either the BTST or SW pins. A tight
layout minimizes switching noise.
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RECOMMENDED OPERATING CONDITIONS (continued)

MIN MAX UNIT
Fast charging current 4.5 A

IBAT 6 (continuous)
Discharging current with internal MOSFET 9 (peak) A
(up to 1 sec duration)
TA Operating free-air temperature range –40 85 °C

THERMAL INFORMATION
RGE PACKAGE
THERMAL METRIC (1) UNITS
24-PIN
θJA Junction-to-ambient thermal resistance 32.2
θJCtop Junction-to-case (top) thermal resistance 29.8
θJB Junction-to-board thermal resistance 9.1
°C/W
ψJT Junction-to-top characterization parameter 0.3
ψJB Junction-to-board characterization parameter 9.1
θJCbot Junction-to-case (bottom) thermal resistance 2.2

space
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

ELECTRICAL CHARACTERISTICS
VVBUS_UVLOZ < VVBUS < VACOV and VVBUS > VBAT + VSLEEP, TJ = –40°C to 125°C and TJ = 25°C for typical values unless other
noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
QUIESCENT CURRENTS
VVBUS < VUVLO, VBAT = 4.2 V, leakage between
5 µA
BAT and VBUS
High-Z Mode, or no VBUS, BATFET disabled
IBAT Battery discharge current (BAT, SW, SYS) 12 20 µA
(REG07[5] = 1)
High-Z Mode, or no VBUS, REG07[5] = 0, –40°C –
32 55 µA
85°C
VVBUS = 5 V, High-Z mode 15 30 µA
VVBUS = 17 V, High-Z mode 30 50 µA
VVBUS > VUVLO, VVBUS > VBAT, converter not
1.5 3 mA
switching
IVBUS Input supply current (VBUS)
VVBUS > VUVLO, VVBUS > VBAT, converter switching,
4 mA
VBAT=3.2V, ISYS=0A
VVBUS > VUVLO, VVBUS > VBAT, converter switching,
15 mA
VBAT=3.8V, ISYS=0A
VBAT=4.2V, Boost mode, IVBUS = 0A, converter
IOTGBOOST Battery Discharge Current in boost mode 4 mA
switching
VBUS/BAT POWER UP
VVBUS_OP VBUS operating range 3.9 17 V
VVBUS_UVLOZ VBUS for active I2C, no battery VVBUS rising 3.6 V
VSLEEP Sleep mode falling threshold VVBUS falling, VVBUS-VBAT 35 80 120 mV
VSLEEPZ Sleep mode rising threshold VVBUS rising, VVBUS-VBAT 170 250 300 mV
VACOV VBUS over-voltage rising threshold VVBUS rising 17.4 18 V
VACOV_HYST VBUS Over-Voltage Falling Hysteresis VVBUS falling 700 mV
VBAT_UVLOZ Battery for active I2C, no VBUS VBAT rising 2.3 V
VBAT_DPL Battery depletion threshold VBAT falling 2.4 2.6 V
VBAT_DPL_HY Battery depletion rising hysteresis VBAT rising 170 230 mV
VVBUSMIN Bad adapter detection threshold VVBUS falling 3.8 V
IBADSRC Bad adapter detection current source 30 mA
tBADSRC Bad source detection duration 30 ms

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ELECTRICAL CHARACTERISTICS (continued)

VVBUS_UVLOZ < VVBUS < VACOV and VVBUS > VBAT + VSLEEP, TJ = –40°C to 125°C and TJ = 25°C for typical values unless other
noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
POWER PATH MANAGEMENT
Isys = 0A, Q4 off, VBAT up to 4.2 V,
VSYS_RANGE System regulation voltage 3.5 4.35 V
REG01[3:1]=101, VSYSMIN = 3.5 V
VSYS_MIN System voltage output REG01[3:1]=101, VSYSMIN = 3.5 V 3.55 3.65 V
Internal top reverse blocking MOSFET on-
RON(RBFET) Measured between VBUS and PMID 23 38 mΩ
resistance

Internal top switching MOSFET on- TJ = –40°C – 85°C 27 35

RON(HSFET) mΩ
resistance between PMID and SW TJ = -40°C – 125°C 27 45

Internal bottom switching MOSFET on- TJ = –40°C – 85°C 32 45

RON(LSFET) mΩ
resistance between SW and PGND TJ = -40°C – 125°C 32 48
BATFET forward voltage in supplement
VFWD BAT discharge current 10mA 30 mV
mode
VSYS_BAT SYS/BAT Comparator VSYS falling 90 mV
VBATGD Battery good comparator rising threshold VBAT rising 3.4 3.55 3.7 V
VBATGD_HYST Battery good comparator falling threshold VBAT falling 100 mV
BATTERY CHARGER
VBAT_REG_ACC Charge voltage regulation accuracy VBAT = 4.112V and 4.208V –0.5% 0.5%
VBAT = 3.8V, ICHG = 1792mA, TJ = 25°C –4% 4%
IICHG_REG_ACC Fast charge current regulation accuracy
VBAT = 3.8V, ICHG = 1792mA, TJ = –20°C – 125°C –7% 7%
ICHG_20pct Charge current with 20% option on VBAT = 3.1V, ICHG = 104mA, REG02=03 75 100 125 mA
VBATLOWV Battery LOWV falling threshold Fast charge to precharge, REG04[1] = 1 2.6 2.8 2.9 V
VBATLOWV_HYST Battery LOWV rising threshold Precharge to fast charge, REG04[1] = 1 2.8 3.0 3.1 V
IPRECHG_ACC Precharge current regulation accuracy VBAT = 2.6V, ICHG = 256mA –20% 20%
ITERM_ACC Termination current accuracy ITERM = 256mA, ICHG = 960mA –20% 20%
VSHORT Battery Short Voltage VBAT falling 1.8 V
VSHORT_HYST Battery Short Voltage hysteresis VBAT rising 200 mV
ISHORT Battery short current VBAT<2.2V 100 mA
VRECHG Recharge threshold below VBAT_REG VBAT falling, REG04[0] = 0 100 mV
tRECHG Recharge deglitch time VBAT falling, REG04[0]=0 20 ms
TJ = 25°C 12 15
RON_BATFET SYS-BAT MOSFET on-resistance mΩ
TJ = –40°C – 125°C 12 20
INPUT VOLTAGE/CURRENT REGULATION
VINDPM_REG_ACC Input voltage regulation accuracy –2% 2%
USB100 85 100 mA

USB Input current regulation limit, VBUS = USB150 125 150 mA

IUSB_DPM
5V, current pulled from SW USB500 440 500 mA
USB900 750 900 mA
IADPT_DPM Input current regulation accuracy Input current limit 1.5A 1.4 1.5 1.6 A
IIN_START Input current limit during system start up VSYS<2.2V 100 mA
KILIM IIN = KILIM/RILIM IINDPM = 1.5A 440 485 530 AxΩ
D+/D- DETECTION
VD+_SRC D+ voltage source 0.5 0.6 0.7 V
ID+_SRC D+ connection check current source 7 14 µA
ID–_SINK D– current sink 50 100 150 µA
D–, switch open –1 1 µA
ID_LKG Leakage current into D+/D–
D+, switch open –1 1 µA
VD+_LOW D+ Low comparator threshold 0.7 0.8 V
VD–_LOWdatref D– Low comparator threshold 250 400 mV
RD–_DWN D– Pulldown for connection check 14.25 24.8 kΩ
Charging timer with 100mA USB host in
tSDP_DEFAULT 45 mins
default mode

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ELECTRICAL CHARACTERISTICS (continued)

VVBUS_UVLOZ < VVBUS < VACOV and VVBUS > VBAT + VSLEEP, TJ = –40°C to 125°C and TJ = 25°C for typical values unless other
noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
BAT OVER-VOLTAGE PROTECTION
VBATOVP Battery over-voltage threshold VBAT rising, as percentage of VBAT_REG 104%
VBATOVP_HYST Battery over-voltage hysteresis VBAT falling, as percentage of VBAT_REG 2%
Battery over-voltage deglitch time to disable
tBATOVP 1 µs
charge
THERMAL REGULATION AND THERMAL SHUTDOWN
TJunction_REG Junction temperature regulation accuracy REG06[1:0] = 11 115 120 125 °C
TSHUT Thermal shutdown rising temperature Temperature increasing 160 °C
TSHUT_HYS Thermal shutdown hysteresis 30 °C
Thermal shutdown rising deglitch Temperature increasing delay 1 ms
Thermal shutdown falling deglitch Temperature decreasing delay 1 ms
COLD/HOT THERMISTER COMPARATOR (bq24190,bq24192,bq24192I)
Cold temperature threshold, TS pin voltage
VLTF Charger suspends charge. As Percentage to VREGN 73% 73.5% 74%
rising threshold
Cold temperature hysteresis, TS pin voltage
VLTF_HYS As Percentage to VREGN 0.2% 0.4% 0.6%
falling
Hot temperature TS pin voltage falling
VHTF As Percentage to VREGN 46.6% 47.2% 48.8%
threshold
Cut-off temperature TS pin voltage falling
VTCO As Percentage to VREGN 44.2% 44.7% 45.2%
threshold
Deglitch time for temperature out of range
VTS > VLTF, or VTS < VTCO, or VTS < VHTF 10 ms
detection
JEITA THERMISTER COMPARATOR (bq24193)
T1 (0°C) threshold, Charge suspended T1
VT1 VTS rising, As Percentage to VREGN 70.2% 70.8% 71.4%
below this temperature.
Charge back to ICHG/2 and 4.2V above this
VT1_HYS Hysteresis, VTS falling 0.6%
temperature
T2 (10°C) threshold, Charge back to ICHG/2
VT2 VTS rising, as percentage of VREGN 68.0% 68.6% 69.2%
and 4.2V below this temperature
Charge back to ICHG and 4.2V above this
VT2_HYS Hysteresis, VTS falling 0.8%
temperature
T3 (45°C) threshold, Charge back to ICHG
VT3 VTS falling, as percentage of VREGN 55.5% 56.1% 56.7%
and 4.05V above this temperature
Charge back to ICHG and 4.2V below this
VT3_HYS Hysteresis, VTS rising 0.8%
temperature
T5 (60°C) threshold, charge suspended
VT5 VTS falling, as percentage of VREGN 47.6% 48.1% 48.6%
above this temperature
Charge back to ICHG and 4.05V below this
VT5_HYS Hysteresis, VTS rising 1.2%
temperature
CHARGE OVER-CURRENT COMPARATOR
IHSFET_OCP HSFET over-Current threshold 5.3 7 A
IBATFET_OCP System over load threshold 9 A
CHARGE UNDER-CURRENT COMPARATOR (CYCLE-BY-CYCLE)
LSFET charge under-current falling
VLSFET_UCP From sync mode to non-sync mode 100 mA
threshold
PWM OPERATION
FSW PWM Switching frequency, and digital clock 1300 1500 1700 kHz
DMAX Maximum PWM duty cycle 97%
VBTST-VSW when LSFET refresh pulse is
3.6
requested, VBUS=5V
VBTST_REFRESH Bootstrap refresh comparator threshold V
VBTST-VSW when LSFET refresh pulse is
4.2
requested, VBUS>6V

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ELECTRICAL CHARACTERISTICS (continued)

VVBUS_UVLOZ < VVBUS < VACOV and VVBUS > VBAT + VSLEEP, TJ = –40°C to 125°C and TJ = 25°C for typical values unless other
noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
BOOST MODE OPERATION
VOTG_REG OTG output voltage I(VBUS) = 0 5.00 V
VOTG_REG_ACC OTG output voltage accuracy I(VBUS) = 0 –2% 2%
REG01[0] = 0 0.5 A
IOTG OTG mode output current
REG01[0] = 1 1.3 A
VOTG_OVP OTG over-voltage threshold 5.3 5.5 V
VOTG_ILIM LSFET cycle-by-cycle current limit 3.2 4.6 A
VOTG_HSZCP HSFET under current falling threshold 100 mA
REG01[0] = 1 1.4 1.8 2.7
IRBFET_OCP RBFET over-current threshold A
REG01[0] = 0 0.6 1.1 1.8
REGN LDO
VVBUS = 10V, IREGN = 40mA 5.6 6 6.4 V
VREGN REGN LDO output voltage
VVBUS = 5V, IREGN = 20mA 4.75 4.8 4.85 V
IREGN REGN LDO current limit VVBUS = 10V, VREGN = 3.8V 50 mA
LOGIC I/O PIN CHARACTERISTICS (OTG, CE, PSEL, STAT, PG)
VILO Input low threshold 0.4 V
VIH Input high threshold 1.3 V
VOUT_LO Output low saturation voltage Sink current = 5 mA 0.4 V
IBIAS High level leakage current Pull up rail 1.8V 1 µA
I2C INTERFACE (SDA, SCL, INT)
VIH Input high threshold level VPULL-UP = 1.8V, SDA and SCL 1.3 V
VIL Input low threshold level VPULL-UP = 1.8V, SDA and SCL 0.4 V
VOL Output low threshold level Sink current = 5mA 0.4 V
IBIAS High-level leakage current VPULL-UP = 1.8V, SDA and SCL 1 µA
fSCL SCL clock frequency 400 kHz
DIGITAL CLOCK AND WATCHDOG TIMER
fHIZ Digital crude clock REGN LDO disabled 15 35 50 kHz
fDIG Digital clock REGN LDO enabled 1300 1500 1700 kHz
tWDT REG05[5:4]=11 REGN LDO enabled 136 160 sec

TYPICAL CHARACTERISTICS
Table 1. Tables of Figures
FIGURE NO.
CHARGING EFFICIENCY vs. CHARGING CURRENT Figure 5
SYSTEM LIGHT LOAD EFFICIENCY vs SYSTEM LOAD CURRENT Figure 6
BOOST MODE EFFICIENCY vs VBUS LOAD CURRENT Figure 7
SYS VOLTAGE REGULATION vs SYSTEM LOAD Figure 8
BOOST MODE VBUS VOLTAGE REGULATION vs VBUS LOAD CURRENT Figure 9
SYS VOLTAGE vs TEMPERATURE Figure 10
BAT VOLTAGE vs TEMPERATURE Figure 11
INPUT CURRENT LIMIT vs TEMPERATURE Figure 12
CHARGE CURRENT vs TEMPERATURE Figure 13
Power Up from USB100mA (VBAT 3.2V) Figure 14
Power Up with Charge Disabled (VBAT 3.2V) Figure 15
Power Up with Charge Enabled Figure 16
Charge Enable (VBUS 5V) Figure 17
Charge Disable (VBUS 12V) Figure 18
Input Current DPM Response without Battery (VBUS 5V, IIN 3A, Charge Disable) Figure 19

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TYPICAL CHARACTERISTICS (continued)

Table 1. Tables of Figures (continued)
FIGURE NO.
Load Transient during Supplement Mode (VBUS 9V, IIN 1.5A, VBAT 3.8V) Figure 20
PWM Switching Waveform (VBUS 12V, VBAT 3.8V, ICHG 3A) Figure 21
PFM Switching Waveform (VBUS 9V, No Battery, ISYS 10 mA, Charge Disable) Figure 22
Boost Mode Switching Waveform (VBAT 3.8V, ILOAD 1A) Figure 23
Boost Mode Load Transient (VBAT 3.8V) Figure 24

CHARGING EFFICIENCY SYSTEM LIGHT LOAD EFFICIENCY

vs vs
CHARGING CURRENT SYSTEM LOAD CURRENT
95 95
VBUS = 5 V
VBUS = 7 V
93 VBUS = 9 V 90
VBUS = 12 V

Efficiency (%)
Efficiency (%)

91 85

89 80

87 75 VBUS = 5 V

VBUS = 9 V
85 70
0 1 2 3 4 5 0 100 200 300 400 500 600
Load Current (A) C011 Load Current (mA) C012

Figure 5. Figure 6.

BOOST MODE EFFICIENCY SYS VOLTAGE REGULATION

vs vs
VBUS LOAD CURRENT SYSTEM LOAD
100 3.70
VBAT = 3.2 V
VBAT = 3.8 V
3.68
95
SYS Voltage (V)
Efficiency (%)

3.66
90
3.64

85
3.62
VBUS = 5 V
VBUS = 17 V
80 3.60
0 500 1000 1500 0 1 2 3 4 5
VBUS Load Current (A) C013 System Load Current (A) C014

Figure 7. Figure 8.

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BOOST MODE VBUS VOLTAGE REGULATION SYS VOLTAGE

vs vs
VBUS LOAD CURRENT TEMPERATURE
5.04 3.80
SYSMIN 3.5 V
5.02 3.75

5.00
VBUS Voltage (V)

SYS Voltage (V)

3.70
4.98
3.65
4.96
3.60
4.94
VBAT = 3.2 V
4.92 3.55
VBAT = 3.8 V
VBAT = 4.2 V
4.90 3.50
0 200 400 600 800 1000 1200 1400 ±50 0 50 100 150
VBUS Load Current (A) C005 Temperature (ƒC) C001

Figure 9. Figure 10.

BAT VOLTAGE INPUT CURRENT LIMIT

vs vs
TEMPERATURE TEMPERATURE
4.25 2000

1800
4.21
Input Current Limit (A)

1600
BAT Voltage (V)

4.17 1400

1200
4.13 1000
IIN = 500 mA
800 IIN = 1.5 A
4.09 VREG = 4.112 V
600 IIN = 2 A
VREG = 4.208 V
4.05 400
±50 0 50 100 150 ±50 0 50 100 150
Temperture (ƒC) C002 Temperature (ƒC) C003

Figure 11. Figure 12.

CHARGE CURRENT
vs
TEMPERATURE bq24190 Power Up from USB100mA (VBAT 3.2V)
5
4.5
VBUS
4 5V/div
Charge Current (A)

3.5
REGN
3 5V/div

2.5
2
SYS
1.5 2V/div

1
TREG 80 C IIN
0.5 200mA/div
TREG 120 C
0
40 50 60 70 80 90 100 110 120 130 100ms/div

Temperture (ƒC) C009

Figure 13. Figure 14.

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bq24192 Power Up with Charge Disabled (VBAT 3.2V) bq24193 Power Up with Charge Enabled

VBUS VBUS
5V/div 5V/div

REGN REGN
5V/div 5V/div

SYS SYS
2V/div 2V/div

/PG IBAT
2V/div 2A/div

40ms/div 100ms/div
Figure 15. Figure 16.

Charge Enable (VBUS 5V) Charge Disable (VBUS 12V)

STAT STAT
2V/div 2V/div

/CE /CE
5V/div 5V/div

SW SW
5V/div 10V/div

IBAT
1A/div IBAT
2A/div

400us/div 4us/div
Figure 17. Figure 18.

Input Current DPM Response without Battery Load Transient during Supplement Mode
(VBUS 5V, IIN 3A, Charge Disable) (VBUS 9V, IIN 1.5A, VBAT 3.8V)
SYS SYS
3.4V Offset 3.4V offset
200mV/div 200mV/div

ISYS
5A/div

IIN IIN
2A/div 1A/div

IBAT
ISYS 2A/div
2A/div

2ms/div 2ms/div
Figure 19. Figure 20.

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PWM Switching Waveform PFM Switching Waveform

(VBUS 12V, VBAT 3.8V, ICHG 3A) (VBUS 9V, No Battery, ISYS 10 mA, Charge Disable)
SYS
3.4V offset
100mV/div
SW
5V/div

SW
5V/div

IL
1A/div

IL
1A/div

0
400ns/div 4us/div
Figure 21. Figure 22.

Boost Mode Switching Waveform

(VBAT 3.8V, ILOAD 1A) Boost Mode Load Transient(VBAT 3.8V)

VBUS
5V offset
SW 200mV/div
5V/div
IBAT
500mA/div

IL
1A/div IVBUS
500mA/div

400ns/div 4ms/div

Figure 23. Figure 24.

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I2C Registers
Address: 6BH. REG00-07 support Read and Write. REG08-0A are read only.
Input Source Control Register REG00 (bq24190, bq24192, bq24193 default 00110000, or 30; bq24192I default 00111000, or 38)
BIT DESCRIPTION
Bit 7 EN_HIZ 0 – Disable, 1 – Enable Default: Disable (0)
Input Voltage Limit
Bit 6 VINDPM[3] 640mV Offset 3.88V, Range: 3.88V-5.08V
Bit 5 VINDPM[2] 320mV Default:
bq24190/bq24192/bq24193: 4.36V (0110)
Bit 4 VINDPM[1] 160mV
bq24192i: 4.44V (0111)
Bit 3 VINDPM[0] 80mV
Input Current Limit (Actual input current limit is the lower of I2C and ILIM)
Bit 2 IINLIM[2] 000 – 100mA, 001 – 150mA, 010 – 500mA, Default SDP: 100mA (000)(OTG pin=0) or 500mA (010)
Bit 1 IINLIM[1] 011 – 900mA, 100 – 1.2A, 101 – 1.5A, (OTG pin=1)
Bit 0 IINLIM[0] 110 – 2A, 111 – 3A Default DCP/CDP:
bq24190/bq24192I: 1.5A (101),
bq24192/bq24193: 3A (111)

Power-On Configuration Register REG01 (default 00011011, or 1B)

BIT DESCRIPTION NOTE
Bit 7 Register Reset 0 – Keep current register setting, Default: Keep current register setting (0)
1 – Reset to default Back to 0 after register reset
Bit 6 I2C Watchdog 0 – Normal ; 1 – Reset Default: Normal (0)
Timer Reset Back to 0 after timer reset
Charger Configuration
Bit 5 CHG_CONFIG[1] 00 – Charge Disable, 01 – Charge Battery, Default: Charge Battery (01)
Bit 4 CHG_CONFIG[0] 10/11 – OTG
Minimum System Voltage Limit
Bit 3 SYS_MIN[2] 0.4V Offset: 3.0V, Range 3.0V-3.7V
Bit 2 SYS_MIN[1] 0.2V Default: 3.5V (101)
Bit 1 SYS_MIN[0] 0.1V
Boost Mode Current Limit
Bit 0 BOOST_LIM 0 – 500mA, 1 – 1.3A Default: 1.3A (1)

Charge Current Control Register REG02 (bq24190, bq24192, bq24193 default 01100000, or 60; bq24192I default 00100000, or 20)
BIT DESCRIPTION NOTE
Fast Charge Current Limit
Bit 7 ICHG[5] 2048mA Offset: 512mA
Bit 6 ICHG[4] 1024mA Range: 512-4544mA
Bit 5 ICHG[3] 512mA Default:
bq24190, bq24192, bq24193: 2048mA (011000),
Bit 4 ICHG[2] 256mA
bq24192I: 1024mA (001000)
Bit 3 ICHG[1] 128mA
Bit 2 ICHG[0] 64mA
Bit 1 Reserved 0 - Reserved
Bit 0 FORCE_20PCT 0 – ICHG as REG02[7:2] programmed Default: ICHG as REG02[7:2] programmed (0)
1 – ICHG as 20% of REG02[7:2] programmed

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Pre-Charge/Termination Current Control Register REG 03 (default 00010001, or 11)

BIT DESCRIPTION NOTE
Pre-Charge Current Limit
Bit 7 IPRECHG[3] 1024mA Offset: 128mA,
Bit 6 IPRECHG[2] 512mA Range:
Bit 5 IPRECHG[1] 256mA bq24190, bq24192, bq24193: 128mA – 2048mA
bq24192I: 128mA – 640mA(0100)
Bit 4 IPRECHG[0] 128mA
Default: 256mA (0001)
Termination Current Limit
Bit 3 ITERM[3] 1024mA Offset: 128mA
Bit 2 ITERM[2] 512mA Range: 128mA – 2048mA
Bit 1 ITERM[1] 256mA Default: 256mA (0001)
Bit 0 ITERM[0] 128mA

Charge Voltage Control Register REG04 (bq24190, bq241192, bq241193 default: 10110010, or B2; bq24192I default 10011010, or
9A)
BIT DESCRIPTION NOTE
Charge Voltage Limit
Bit 7 VREG[5] 512mV Offset: 3.504V
Bit 6 VREG[4] 256mV Range: 3.504V – 4.400V (111000)
Bit 5 VREG[3] 128mV Default:
bq24190, bq24192, bq24193: 4.208V (101100)
Bit 4 VREG[2] 64mV
bq24192I: 4.112V (100110)
Bit 3 VREG[1] 32mV
Bit 2 VREG[0] 16mV
Battery Precharge to Fast Charge Threshold
Bit 1 BATLOWV 0 – 2.8V, 1 – 3.0V Default: 3.0V (1)
Battery Recharge Threshold (below battery regulation voltage)
Bit 0 VRECHG 0 – 100mV, 1 – 300mV Default: 100mV (0)

Charge Termination/Timer Control Register REG05 (default 10011010, or 9A)

BIT DESCRIPTION NOTE
Charging Termination Enable
Bit 7 EN_TERM 0 – Disable, 1 – Enable Default: Enable termination (1)
Termination Indicator Threshold
Bit 6 TERM_STAT 0 – Match ITERM, Default Match ITERM (0)
1 – STAT pin high before actual termination
when charge current below 800 mA
I2C Watchdog Timer Setting
Bit 5 WATCHDOG[1] 00 – Disable timer, 01 – 40s, 10 – 80s, 11 – Default: 40s (01)
Bit 4 WATCHDOG[0] 160s
Charging Safety Timer Enable
Bit 3 EN_TIMER 0 – Disable, 1 – Enable Default: Enable (1)
Fast Charge Timer Setting
Bit 2 CHG_TIMER[1] 00 – 5 hrs, 01 – 8 hrs, 10 – 12 hrs, 11 – 20 Default: 8hours (01)
Bit 1 CHG_TIMER[0] hrs (See Charging Safety Timer for details)
JEITA Low Temperature Current Setting
Bit 0 JEITA_ISET 0 – 50%, 1 – 20% Percentage w.r.t ICHG REG02[7:2]
(0°C-10°C) Default: 50% (0)

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IR Compensation / Thermal Regulation Control Register REG06 (default 00000011, or 03)

BIT DESCRIPTION NOTE
IR Compensation Resistor Setting
Bit 7 BAT_COMP[2] 40mΩ Range: 0 – 70mΩ
Bit 6 BAT_COMP[1] 20mΩ Default: 0Ω (000)
Bit 5 BAT_COMP[0] 10mΩ
IR Compensation Voltage Clamp (above regulation voltage)
Bit 4 VCLAMP[2] 64mV Range: 0 – 112 mV
Bit 3 VCLAMP[1] 32mV Default: 0mV (000)
Bit 2 VCLAMP[0] 16mV
Thermal Regulation Threshold
Bit 1 TREG[1] 00 – 60°C, 01 – 80°C, 10 – 100°C, 11 – Default: 120°C (11)
Bit 0 TREG[0] 120°C

Misc Operation Control Register REG07 (default 01001011, or 4B)

BIT DESCRIPTION NOTE
Force DPDM detection (bq24190) or set default input current limit from PSEL/OTG pins (bq24192, bq24192I, bq24193)
Bit 7 DPDM_EN 0 – Not in D+/D– detection; Default: Not in D+/D– detection (0), Back to 0
1 – Force D+/D– detection after detection complete
Safety Timer Setting during Input DPM and Thermal Regulation
Bit 6 TMR2X_EN 0 – Safety timer not slowed by 2X during input DPM Default: Safety timer slowed by 2X (1)
or thermal regulation,
1 – Safety timer slowed by 2X during input DPM or
thermal regulation
Force BATFET Off
Bit 5 BATFET_Disable 0 – Allow Q4 turn on, 1 – Turn off Q4 Default: Allow Q4 turn on(0)
Bit 4 JEITA_VSET (45°C- 0 – 4.05V, 1 – 4.2V Default: 4.05V (0)
60°C)
Bit 3 Reserved 1 - Reserved
Bit 2 Reserved 0 - Reserved
Bit 1 INT_MASK[1] 0 – No INT during CHRG_FAULT, 1 – INT on Default: INT on CHRG_FAULT (1)
CHRG_FAULT
Bit 0 INT_MASK[0] 0 – No INT during BAT_FAULT, 1 – INT on Default: INT on BAT_FAULT (1)
BAT_FAULT

System Status Register REG08

BIT DESCRIPTION
Bit 7 VBUS_STAT[1] 00 – Unknown (no input, or DPDM detection incomplete), 01 – USB host, 10 – Adapter port, 11 – OTG
Bit 6 VBUS_STAT[0]
Bit 5 CHRG_STAT[1] 00 – Not Charging, 01 – Pre-charge (<VBATLOWV), 10 – Fast Charging, 11 – Charge Termination Done
Bit 4 CHRG_STAT[0]
Bit 3 DPM_STAT 0 – Not DPM, 1 – VINDPM or IINDPM
Bit 2 PG_STAT 0 – Not Power Good, 1 – Power Good
Bit 1 THERM_STAT 0 – Normal, 1 – In Thermal Regulation
Bit 0 VSYS_STAT 0 – Not in VSYSMIN regulation (BAT>VSYSMIN), 1 – In VSYSMIN regulation (BAT<VSYSMIN)

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Fault Register REG09

BIT DESCRIPTION
Bit 7 WATCHDOG_FAULT 0 – Normal, 1- Watchdog timer expiration
Bit 6 BOOST_FAULT 0 – Normal, 1 – VBUS overloaded (OCP), or VBUS OVP in boost mode
Bit 5 CHRG_FAULT[1] 00 – Normal, 01 – Input fault (VBUS OVP or VBAT<VBUS<3.8V), 10 - Thermal shutdown,
Bit 4 CHRG_FAULT[0] 11 – Charge Safety Timer Expiration
Bit 3 BAT_FAULT 0 – Normal, 1 – BATOVP
Bit 2 NTC_FAULT[2] bq24190, bq24192, bq24192I: 000 – Normal, 001 – TS1 Cold, 010 – TS1 Hot, 011 – TS2 Cold,
Bit 1 NTC_FAULT[1] 100 – TS2 Hot, 101 – Both Cold, 110 – Both Hot
Bit 0 NTC_FAULT[0] bq24193: 000 – Normal, 010 – Warm, 011 – Cool, 101 – Cold, 110 – Hot

Vender / Part / Revision Status Register REG0A

BIT DESCRIPTION
Bit 7 Reserved 0 - Reserved
Bit 6 Reserved 0 - Reserved
Device Configuration
Bit 5 PN[2] bq24190 – 100, bq24192, bq24193 – 101, bq24192I – 011
Bit 4 PN[1]
Bit 3 PN[0]
Bit 2 TS_PROFILE 0 – Cold/Hot window (bq24190, bq24192, bq24192I), 1 – JEITA profile (bq24193)
Bit 1 DEV_REG[0] 11
Bit 0 DEV_REG[1]

DETAILED DESCRIPTION
The bq24190, bq24192, bq24192I, bq24193 is an I2C controlled power path management device and a single
cell Li-Ion battery charger. It integrates the input reverse-blocking FET (RBFET, Q1), high-side switching FET
(HSFET, Q2), low-side switching FET (LSFET, Q3), and BATFET (Q4) between system and battery. The device
also integrates the bootstrap diode for the high-side gate drive.

Device Power Up

Power-On-Reset (POR)
The internal bias circuits are powered from the higher voltage of VBUS and BAT. When VBUS or VBAT rises
above UVLOZ, the sleep comparator, battery depletion comparator and BATFET driver are active. I2C interface
is ready for communication and all the registers are reset to default value. The host can access all the registers
after POR.

Power Up from Battery without DC Source

If only battery is present and the voltage is above depletion threshold (VBAT_DEPL), the BATFET turns on and
connects battery to system. The REGN LDO stays off to minimize the quiescent current. The low RDSON in
BATFET and the low quiescent current on BAT minimize the conduction loss and maximize the battery run time.
The device always monitors the discharge current through BATFET. When the system is overloaded or shorted,
the device will immediately turn off BATFET and keep BATFET off until the input source plugs in again.

BATFET Turn Off

The BATFET can be forced off by the host through I2C REG07[5]. This bit allows the user to independently turn
off the BATFET when the battery condition becomes abnormal during charging. When BATFET is off, there is no
path to charge or discharge the battery.
When battery is not attached, the BATFET should be turned off by setting REG07[5] to 1 to disable charging and
supplement mode.

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Shipping Mode
When end equipment is assembled, the system is connected to battery through BATFET. There will be a small
leakage current to discharge the battery even when the system is powered off. In order to extend the battery life
during shipping and storage, the device can turn off BATFET so that the system voltage is zero to minimize the
leakage.
In order to keep BATFET off during shipping mode, the host has to disable the watchdog timer (REG05[5:4]=00)
and disable BATFET (REG07[5]=1) at the same time.
Once the BATFET is disabled, the BATFET can be turned on by plugging in adapter.

Power Up from DC Source

When the DC source plugs in, the bq24190, bq24192, bq24192I, bq24193 checks the input source voltage to
turn on REGN LDO and all the bias circuits. It also checks the input current limit before starts the buck converter.

REGN LDO
The REGN LDO supplies internal bias circuits as well as the HSFET and LSFET gate drive. The LDO also
provides bias rail to TS1/TS2 external resistors. The pull-up rail of STAT and PG can be connected to REGN as
well.
The REGN is enabled when all the conditions are valid.
1. VBUS above UVLOZ
2. VBUS above battery + VSLEEPZ in buck mode or VBUS below battery + VSLEEPZ in boost mode
3. After typical 220ms delay (100ms minimum) is complete
If one of the above conditions is not valid, the device is in high impedance mode (HIZ) with REGN LDO off. The
device draws less than 50µA from VBUS during HIZ state. The battery powers up the system when the device is
in HIZ.

Input Source Qualification

After REGN LDO powers up, the bq24190, bq24192, bq24192I, bq24193 checks the current capability of the
input source. The input source has to meet the following requirements to start the buck converter.
1. VBUS voltage below 18V (not in ACOV)
2. VBUS voltage above 3.8V when pulling 30mA (poor source detection)
Once the input source passes all the conditions above, the status register REG08[2] goes high and the PG pin
(bq24192, bq24192I, bq24193) goes low. An INT is asserted to the host.
If the device fails the poor source detection, it will repeat the detection every 2 seconds.

Input Current Limit Detection

The USB ports on personal computers are convenient charging source for portable devices (PDs). If the portable
device is attached to a USB host, the USB specification requires the portable device to draw limited current
(100mA/500mA in USB 2.0, and 150mA/900mA in USB 3.0). If the portable device is attached to a charging port,
it is allowed to draw up to 1.5A.
After the PG is LOW or REG08[2] goes HIGH, the charger device always runs input current limit detection when
a DC source plugs in unless the charger is in HIZ during host mode.
The bq24190 follows battery charging specification 1.2 (bc1.2) to detect input source through USB D+/D– lines.
The bq24192, bq24192I, bq24193 sets input current limit through PSEL and OTG pins.
After the input current limit detection is done, the host can write to REG00[2:0] to change the input current limit.

D+/D– Detection Sets Input Current Limit in bq24190

The bq24190 contains a D+/D– based input source detection to program the input current limit. The D+/D-
detection has two steps: data contact detect (DCD) followed by primary detection.

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D+

VDP_SRC

VLGC_HI
IDP_SRC

CHG_DET
VDAC_REF

IDM_SINK

D-

RDM_DWN

Figure 25. USB D+/D- Detection

DCD (Data Contact Detection) uses a current source to detect when the D+/D– pins have made contact during
an attach event. The protocol for data contact detect is as follows:
• Detect VBUS present and REG08[2]=1 (power good)
• Turn on D+ IDP_SRC and the D– pull-down resistor RDM_DWN for 40ms
• If the USB connector is properly attached, the D+ line goes from HIGH to LOW, wait up to 0.5 sec.
• Turn off IDP_SRC and disconnect RDM_DWN
The primary detection is used to distinguish between USB host (Standard Down Stream Port, or SDP) and
different type of charging ports (Charging Down Stream Port, or CDP, and Dedicated Charging Port, or DCP).
The protocol for primary detection is as follows:
• Turn on VDP_SRC on D+ and IDM_SINK on D– for 40ms
• If PD is attached to a USB host (SDP), the D– is low. If PD is attached to a charging port (CDP or DCP), the
D– is high
• Turn off VDP_SRC and IDM_SINK
Table 2 shows the input current limit setting after D+/D– detection.

Table 2. bq24190 USB D+/D– Detection

D+/D– DETECTION OTG INPUT CURRENT LIMIT REG08[7:6]
0.5 sec timer expired in DCD — 100 mA 00
(D+/D- floating)
USB Host LOW 100 mA 01
USB Host HIGH 500 mA 01
Charging Port — 1.5 A 10

PSEL/OTG Pins Set Input Current Limit in bq24192, bq24192I, bq24193

The bq24192, bq24192I, bq24193 has PSEL instead of D+/D–. It directly takes the USB PHY device output to
decide whether the input is USB host or charging port.

Table 3. bq24192, bq24192I, bq24193 Input Current Limit Detection

PSEL OTG INPUT CURRENT LIMIT REG08[7:6]
HIGH LOW 100 mA 01
HIGH HIGH 500 mA 01

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Table 3. bq24192, bq24192I, bq24193 Input Current Limit Detection (continued)

PSEL OTG INPUT CURRENT LIMIT REG08[7:6]
1.5A (bq24192I)
LOW — 10
3A (bq24192, bq24193)

HIZ State wth 100mA USB Host

In battery charging spec, the good battery threshold is the minimum charge level of a battery to power up the
portable device successfully. When the input source is 100mA USB host, and the battery is above bat-good
threshold (VBATGD), the device follows battery charging spec and enters high impedance state (HIZ). In HIZ state,
the device is in the lowest quiescent state with REGN LDO and the bias circuits off. The charger device sets
REG00[7] to 1, and the VBUS current during HIZ state will be less than 30µA. The system is supplied by the
battery.
Once the charger device enters HIZ state in host mode, it stays in HIZ until the host writes REG00[7]=0. When
the processor host wakes up, it is recommended to first check if the charger is in HIZ state.
In default mode, the charger IC will reset REG00[7] back to 0 when input source is removed. When another
source plugs in, the charger IC will run detection again, and update the input current limit.

Force Input Current Limit Detection

The host can force the charger device to run input current limit detection by setting REG07[7]=1. After the
detection is complete, REG07[7] will return to 0 by itself.

Converter Power-Up
After the input current limit is set, the converter is enabled and the HSFET and LSFET start switching. If battery
charging is disabled, BATFET turns off. Otherwise, BATFET stays on to charge the battery.
The bq24190, bq24192, bq24192I, bq24193 provides soft-start when ramp up the system rail. When the system
rail is below 2.2V, the input current limit is forced to 100mA. After the system rises above 2.2V, the charger
device sets the input current limit set by the lower value between register and ILIM pin.
As a battery charger, the bq24190, bq24192, bq24192I, bq24193 deploys a 1.5MHz step-down switching
regulator. The fixed frequency oscillator keeps tight control of the switching frequency under all conditions of
input voltage, battery voltage, charge current and temperature, simplifying output filter design.
A type III compensation network allows using ceramic capacitors at the output of the converter. An internal saw-
tooth ramp is compared to the internal error control signal to vary the duty cycle of the converter. The ramp
height is proportional to the PMID voltage to cancel out any loop gain variation due to a change in input voltage.
In order to improve light-load efficiency, the device switches to PFM control at light load when battery is below
minimum system voltage setting or charging is disabled. During the PFM operation, the switching duty cycle is
set by the ratio of SYS and VBUS.

Boost Mode Operation from Battery

The bq24190, bq24192, bq24192I, bq24193 supports boost converter operation to deliver power from the battery
to other portable devices through USB port. The boost mode output current rating meets the USB On-The-Go
500mA output requirement. The maximum output current is 1.3A. The boost operation can be enabled if the
following conditions are valid:
1. BAT above BATLOWV threshold (VBATLOWV set by REG04[1])
2. VBUS less than BAT+VSLEEP (in sleep mode)
3. Boost mode operation is enabled (OTG pin HIGH and REG01[5:4]=10)
4. After 220ms delay from boost mode enable
In boost mode, the bq24190, bq24192, bq24192I, bq24193 employs a 1.5MHz step-up switching regulator.
Similar to buck operation, the device switches from PWM operation to PFM operation at light load to improve
efficiency.
During boost mode, the status register REG08[7:6] is set to 11, the VBUS output is 5V and the output current
can reach up to 500mA or 1.3A, selected via I2C (REG01[0]).

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Any fault during boost operation, including VBUS over-voltage or over-current, sets the fault register REG09[6] to
1 and an INT is asserted.

Power Path Management

The bq24190, bq24192, bq24192I, bq24193 accommodates a wide range of input sources from USB, wall
adapter, to car battery. The device provides automatic power path selection to supply the system (SYS) from
input source (VBUS), battery (BAT), or both.

Narrow VDC Architecture

The device deploys Narrow VDC architecture (NVDC) with BATFET separating system from battery. The
minimum system voltage is set by REG01[3:1]. Even with a fully depleted battery, the system is regulated above
the minimum system voltage (default 3.5V).
When the battery is below minimum system voltage setting, the BATFET operates in linear mode (LDO mode),
and the system is 150mV above the minimum system voltage setting. As the battery voltage rises above the
minimum system voltage, BATFET is fully on and the voltage difference between the system and battery is the
VDS of BATFET.
When the battery charging is disabled or terminated, the system is always regulated at 150mV above the
minimum system voltage setting. The status register REG08[0] goes high when the system is in minimum system
voltage regulation.
4.5

4.3
Charge Enabled
4.1
Charge Disabled
SYS
3.9
(V)
3.7

3.5
Minimum System Voltage
3.3

3.1
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3

BAT (V)
Figure 26. V(SYS) vs V(BAT)

Dynamic Power Management

To meet maximum current limit in USB spec and avoid over loading the adapter, the bq24190, bq24192,
bq24192I, bq24193 features Dynamic Power Management (DPM), which continuously monitors the input current
and input voltage.
When input source is over-loaded, either the current exceeds the input current limit (REG00[2:0]) or the voltage
falls below the input voltage limit (REG00[6:3]). The device then reduces the charge current until the input current
falls below the input current limit and the input voltage rises above the input voltage limit.
When the charge current is reduced to zero, but the input source is still overloaded, the system voltage starts to
drop. Once the system voltage falls below the battery voltage, the device automatically enters the supplement
mode where the BATFET turns on and battery starts discharging so that the system is supported from both the
input source and battery.
During DPM mode (either VINDPM or IINDPM), the status register REG08[3] will go high.
Figure 27 shows the DPM response with 9V/1.2A adapter, 3.2V battery, 2.8A charge current and 3.4V minimum
system voltage setting.

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Voltage
VBUS
9V

SYS
3.6V
3.4V
3.2V BAT
3.18V

Current
4A
3.2A ICHG
2.8A ISYS

1.2A IIN
1.0A
0.5A

-0.6A
DPM DPM
Supplement

Figure 27. DPM Response

Supplement Mode
When the system voltage falls below the battery voltage, the BATFET turns on and the BATFET gate is
regulated the gate drive of BATFET so that the minimum BATFET VDS stays at 30mV when the current is low.
This prevents oscillation from entering and exiting the supplement mode. As the discharge current increases, the
BATFET gate is regulated with a higher voltage to reduce RDSON until the BATFET is in full conduction. At this
point onwards, the BATFET VDS linearly increases with discharge current. Figure 28 shows the V-I curve of the
BATFET gate regulation operation. BATFET turns off to exit supplement mode when the battery is below battery
depletion threshold.
4.5

4.0

3.5
CURRENT (A)

3.0

2.5

2.0

1.5

1.0

0.5

0
0 5 10 15 20 25 30 35 40 45 50 55

V(BAT-SYS) (mV)

Figure 28. BATFET V-I Curve

Battery Charging Management

The bq24190, bq24192, bq24192I, bq24193 charges 1-cell Li-Ion battery with up to 4.5A charge current for high
capacity tablet battery. The 12mΩ BATFET improves charging efficiency and minimizes the voltage drop during
discharging.

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Autonomous Charging Cycle

With battery charging enabled at POR (REG01[5:4]=01), the bq24190, bq24192, bq24192I, bq24193 can
complete a charging cycle without host involvement. The device default charging parameters are listed in
Table 4.

Table 4. Charging Parameter Default Setting

DEFAULT MODE bq24190, bq24192 bq24192I bq24193
Charging Voltage 4.208 V 4.112 V 4.208 V
Charging Current 2.036 A 1.012 A 2.036 A
Pre-charge Current 256 mA 256 mA 256 mA
Termination Current 256 mA 256 mA 256 mA
Temperature Profile Hot/Cold Hot/Cold JEITA
Safety Timer 8 hours (1) 8 hours (1) 8 hours (1)

(1) See section Charging Safety Timer for more information.

A new charge cycle starts when the following conditions are valid:
• Converter starts
• Battery charging is enabled by I2C register bit (REG01[5:4]) = 01 and CE is low
• No thermistor fault on TS1 and TS2
• No safety timer fault
• BATFET is not forced to turn off (REG07[5])
The charger device automatically terminates the charging cycle when the charging current is below termination
threshold and charge voltage is above recharge threshold. When a full battery voltage is discharged below
recharge threshold (REG04[0]), the bq24190, bq24192, bq24192I, bq24193 automatically starts another charging
cycle.
The STAT output indicates the charging status of charging (LOW), charging complete or charge disable (HIGH)
or charging fault (Blinking). The status register REG08[5:4] indicates the different charging phases: 00-charging
disable, 01-precharge, 10-fast charge (constant current) and constant voltage mode, 11-charging done. Once a
charging cycle is complete, an INT is asserted to notify the host.
The host can always control the charging operation and optimize the charging parameters by writing to the
registers through I2C.

Battery Charging Profile

The device charges the battery in three phases: preconditioning, constant current and constant voltage. At the
beginning of a charging cycle, the device checks the battery voltage and applies current.

Table 5. Charging Current Setting

VBAT CHARGING CURRENT REG DEFAULT SETTING REG08[5:4]
<2V 100mA – 01
2V-3V REG03[7:4] 256mA 01
>3V REG02[7:2] 2048mA (bq24190/192/193) 1024mA (bq24192I) 10

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If the charger device is in DPM regulation or thermal regulation during charging, the actual charging current will
be less than the programmed value. In this case, termination is temporarily disabled and the charging safety
timer is counted at half the clock rate.

Regulation Voltage
(3.5V – 4.4V)
Battery Voltage
Fast Charge Current
(500mA-4020mA)

Charge Current

VBAT_LOWV (2.8V/3V)

VBAT_SHORT (2V)

IPRECHARGE (128mA-2048mA)
ITERMINATION (128mA-2048mA)
IBATSHORT (100mA)
Trickle Charge Pre-charge Fast Charge and Voltage Regulation Safety Timer
Expiration

Figure 29. Battery Charging Profile

Battery Path Impedance IR Compensation

To speed up the charging cycle, we would like to stay in constant current mode as long as possible. In real
system, the parasitic resistance, including routing, connector, MOSFETs and sense resistor in the battery pack,
may force the charger device to move from constant current loop to constant voltage loop too early, extending
the charge time.
The bq24190, bq24192, bq24192I, bq24193 allows the user to compensate for the parasitic resistance by
increasing the voltage regulation set point according to the actual charge current and the resistance. For safe
operation, the user should set the maximum allowed regulation voltage to REG06[4:2], and the minimum trace
parasitic resistance (REG06[7:5]).
(
VBATREG_ACTUAL = VBATREG_I2C + lower of ICHRG_ACTUAL × RCOMP and VCLAMP ) (1)

Thermistor Qualification
The high capacity battery usually has two or more single cells in parallel. The bq24190, bq24192, bq24192I
provides two TS pins to monitor the thermistor (NTC) in each cell independently. The bq24193 applies JEITA
profile with TS1/TS2 shorted.

Cold/Hot Temperature Window (bq24190, bq24192, bq24192I)

The bq24190, bq24192, bq24192I continuously monitors battery temperature by measuring the voltage between
the TS pins and ground, typically determined by a negative temperature coefficient thermistor and an external
voltage divider. The device compares this voltage against its internal thresholds to determine if charging is
allowed. To initiate a charge cycle, the battery temperature must be within the VLTF to VHTF thresholds. During the
charge cycle the battery temperature must be within the VLTF to VTCO thresholds, else the device suspends
charging and waits until the battery temperature is within the VLTF to VHTF range.

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REGN

bq2419x RT1

TS

RT2 RTH
103AT

Figure 30. TS Resistor Network

When the TS fault occurs, the fault register REG09[2:0] indicates the actual condition on each TS pin and an INT
is asserted to the host. The STAT pin indicates the fault when charging is suspended.
TEMPERATURE RANGE TO TEMPERATURE RANGE
INITIATE CHARGE DURING A CHARGE CYCLE
VREF VREF

CHARGE SUSPENDED CHARGE SUSPENDED

VLTF VLTF

VLTFH VLTFH

CHARGE at full C CHARGE at full C

VHTF
VTCO
CHARGE SUSPENDED
CHARGE SUSPENDED
AGND AGND

Figure 31. TS Pin Thermistor Sense Thresholds

Assuming a 103AT NTC thermistor is used on the battery pack Figure 31, the value RT1 and RT2 can be
determined by using the following equation:
æ 1 1 ö
VVREF ´ RTHCOLD ´ RTHHOT ´ ç - ÷
è VLTF VTCO ø
 RT2 =
æV ö æV ö
RTHHOT ´ ç VREF - 1÷ - RTHCOLD ´ ç VREF - 1÷
è VTCO ø è VLTF ø

VVREF
-1
VLTF
RT1 =
1 1
+
RT2 RTHCOLD (2)
Select 0°C to 45°C range for Li-ion or Li-polymer battery,
RTHCOLD = 27.28 kΩ
RTHHOT = 4.911 kΩ
RT1 = 5.52 kΩ
RT2 = 31.23 kΩ

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JEITA Guideline Compliance (bq24193)

To improve the safety of charging Li-ion batteries, JEITA guideline was released on April 20, 2007. The guideline
emphasized the importance of avoiding a high charge current and high charge voltage at certain low and high
temperature ranges.
To initiate a charge cycle, the voltage on TS pin must be within the VT1 to VT5 thresholds. If TS voltage exceeds
the T1–T5 range, the controller suspends charging and waits until the battery temperature is within the T1 to T5
range. At cool temperature (T1–T2), JEITA recommends the charge current to be reduced to at least half of the
charge current or lower. At warm temperature (T3–T5), JEITA recommends charge voltage less than 4.1V.
The bq24193 provides flexibility voltage/current settings beyond the JEITA requirement. The voltage setting at
warm temperature (T3–T5) can be 4.2V or 4.05V (REG07 bit[4]). The current setting at cool temperature (T1–T2)
can be further reduced to 20% of fast charge current (REG05 bit[0]).

bq2419x Charging Current bq2419x Charging Voltage

1ICHG 4.2V
VSET=1
4.10V
0.5ICHG 4.05V
ISET=1
VSET=0
0.2ICHG
ISET=0

T1 T2 T3 T5 T1 T2 T3 T5
00C 100C 450C 60 0C 00C 100C 450C 600C
The resistor bias network has been updated as below.
æ 1 1 ö
VVREF ´ RTHCOLD ´ RTHHOT ´ ç - ÷
 RT2 = è VT1 VT5 ø
æ VVREF ö æ VVREF ö
RTHHOT ´ ç - 1÷ - RTHCOLD ´ ç - 1÷
è VT5 ø è VT1 ø

VVREF
-1
RT1 = VT1
1 1
+
RT2 RTHCOLD (3)
Select 0°C to 60°C range for Li-ion or Li-polymer battery,
RTHT1 = 27.28 kΩ
RTHT5 = 3.02 kΩ
RT1 = 2.27 kΩ
RT2 = 6.86 kΩ

Charging Termination
The bq24190, bq24192, bq24192I, bq24193 terminates a charge cycle when the battery voltage is above
recharge threshold, and the current is below termination current. After the charging cycle is complete, the
BATFET turns off. The converter keeps running to power the system, and BATFET can turn back on to engage
supplement mode.
When termination occurs, the status register REG09[5:4] is 11, and an INT is asserted to the host. Termination is
temporarily disabled if the charger device is in input current/voltage regulation or thermal regulation. Termination
can be disabled by writing 0 to REG05[7].

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Termination when REG02[0] = 1

When REG02[0] is HIGH to reduce the charging current by 80%, the charging current could be less than the
termination current. The charger device termination function should be disabled. When the battery is charged to
fully capacity, the host disables charging through CE pin or REG01[5:4].

Termination when REG05[6] = 1

Usually the STAT bit indicates charging complete when the charging current falls below termination threshold.
Write REG05[6]=1 to enable an early “charge done” indication on STAT pin. The STAT pin goes high when the
charge current reduces below 800mA. The charging cycle is still on-going until the current falls below the
termination threshold.

Charging Safety Timer

The bq24190, bq24192, bq24192I, bq24193 has safety timer to prevent extended charging cycle due to
abnormal battery conditions.
In default mode, the device keeps charging the battery with 5-hour fast charging safety timer regardless of
REG05[2:1] default value. At the end of the 5 hours, the EN_HIZ (REG00[7]) is set to signal the buck converter
stops and the system load is supplied by the battery. The EN_HIZ bit can be cleared to restart the buck
converter.
In host mode, the device keeps charging the battery until the fast charging safety timer expired. The duration of
safety timer can be set by the REG05[2:1] bits (default = 8 hours). At the end of safety timer, the EN_HIZ
(REG00[7]) is cleared to signal the buck converter continues to operation to supply system load.
The safety timer is 1 hour when the battery is below BATLOWV threshold. The user can program fast charge
safety timer through I2C (REG05[2:1]). When safety timer expires, the fault register REG09[5:4] goes 11 and an
INT is asserted to the host. The safety timer feature can be disabled via I2C (REG05[3]).
The following actions restart the safety timer:
• At the beginning of a new charging cycle
• Toggle the CE pin HIGH to LOW to HIGH (charge enable)
• Write REG01[5:4] from 00 to 01 (charge enable)
• Write REG05[3] from 0 to 1 (safety timer enable)
• Write REG01[7] to 1 (software reset)
During input voltage/current regulation or thermal regulation, the safety timer counts at half clock rate since the
actual charge current is likely to be below the register setting. For example, if the charger is in input current
regulation (IINDPM) throughout the whole charging cycle, and the safety time is set to 5 hours, the safety timer
will expire in 10 hours. This feature can be disabled by writing 0 to REG07[6].

USB Timer when Charging from USB100mA Source

The total charging time in default mode from USB100mA source is limited by a 45-min max timer. At the end of
the timer, the device stops the converter and goes to HIZ.

Host Mode and Default Mode

The bq24190, bq24192, bq24192I, bq24193 is a host controlled device, but it can operate in default mode
without host management. In default mode, bq24190, bq24192, bq24192I, bq24193 can be used as an
autonomous charger with no host or with host in sleep.
When the charger is in default mode, REG09[7] is HIGH. When the charger is in host mode, REG09[7] is LOW.
After power-on-reset, the device starts in watchdog timer expiration state, or default mode. All the registers are in
the default settings.

Any write command to bq24190, bq24192, bq24192I, bq24193 transitions the device from default mode to host
mode. All the device parameters can be programmed by the host. To keep the device in host mode, the host has
to reset the watchdog timer by writing 1 to REG01[6] before the watchdog timer expires (REG05[5:4]), or disable
watchdog timer by setting REG05[5:4]=11.

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POR
watchdog timer expired
Reset registers
I2C interface enabled

Y Host Mode
I2C Write? Start watchdog timer
Host programs registers

Default Mode
Reset watchdog timer Reset REG01 Y
Reset registers bit[6]?

N Y N
I2C Write?

Y Watchdog Timer N
Expired?

Figure 32. Watchdog Timer Flow Chart

Plug in USB100mA Source with Good Battery

When the input source is detected as 100mA USB host, and the battery voltage is above batgood threshold
(VBATGD), the charger device enters HIZ state to meet the battery charging spec requirement.
If the charger device is in host mode, it will stay in HIZ state even after the USB100mA source is removed, and
the adapter plugs in. During the HIZ state, REG00[7] is set HIGH and the system load is supplied from battery. It
is recommended that the processor host always checks if the charger IC is in HIZ state when it wakes up. The
host can write REG00[7] to 0 to exit HIZ state.
If the charger is in default mode, when the DC source is removed, the charger device will get out of HIZ state
automatically. When the input source plugs in again, the charger IC runs detection on the input source and
update the input current limit.

USB Timer when Charging from USB100mA Source

The total charging time in default mode from USB100mA source is limited by a 45-min max timer. At the end of
the timer, the device stops the converter and goes to HIZ.

Status Outputs (PG, STAT, and INT)

Power Good Indicator (PG)

In bq24192, bq24192I, bq24193, PG goes LOW to indicate a good input source when:
1. VBUS above UVLO
2. VBUS above battery (not in sleep)
3. VBUS below ACOV threshold
4. VBUS above 3.8V when 30mA current is applied (not a poor source)

Charging Status Indicator (STAT)

The bq24190, bq24192, bq24192I, bq24193 indicates charging state on the open drain STAT pin. The STAT pin
can drive LED as the application diagram shows.

Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 31

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bq24190, bq24192
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Table 6. STAT Pin State

CHARGING STATE STAT
Charging in progress (including recharge) LOW
Charging complete HIGH
Sleep mode, charge disable HIGH
Charge suspend (Input over-voltage, TS fault, timer fault, input or system over- blinking at 1Hz (bq24190, bq24192, bq24193)
voltage) or 10kΩ pull down (bq24192I)

When a fault occurs, instead of blinking, the STAT pin in bq24192I has a 10kΩ pull-down resistor to ground.
When the pull-up resistor is 30kΩ, the STAT voltage during fault is 1/4 of the pull-up rail.

Interrupt to Host (INT)

In some applications, the host does not always monitor the charger operation. The INT notifies the system on the
device operation. The following events will generate 256us INT pulse.
• USB/adapter source identified (through PSEL or DPDM detection, with OTG pin)
• Good input source detected
– not in sleep
– not in ACOV
– current limit above 30mA
• Input removed or ACOV
• Charge Complete
• Any FAULT event in REG09
When a fault occurs, the charger device sends out INT and latches the fault state in REG09 until the host reads
the fault register. Before the host reads REG09, the charger device would not send any INT upon new faults
except NTC fault (REG09[2:0]). The NTC fault is not latched and always reports the current thermistor
conditions. In order to read the current fault status, the host has to read REG09 two times consecutively. The 1st
reads fault register status from the last INT and the 2nd reads the current fault register status.

Protections

Input Current Limit on ILIM

For safe operation, the bq24190, bq24192, bq24192I, bq24193 has an additional hardware pin on ILIM to limit
maximum input current on ILIM pin. The input maximum current is set by a resistor from ILIM pin to ground as:
1V
 IINMAX = ´ 530
RILIM (4)
The actual input current limit is the lower value between ILIM setting and register setting (REG00[2:0]). For
example, if the register setting is 111 for 3A, and ILIM has a 353Ω resistor to ground for 1.5A, the input current
limit is 1.5A. ILIM pin can be used to set the input current limit rather than the register settings.
The device regulates ILIM pin at 1V. If ILIM voltage exceeds 1V, the device enters input current regulation (Refer
to Dynamic Power Path Management section).
The voltage on ILIM pin is proportional to the input current. ILIM pin can be used to monitor the input current
following Equation 5:
V
I IN = ILIM ´ IINMAX
1V (5)
For example, if ILIM pin sets 2A, and the ILIM voltage is 0.6V, the actual input current 1.2A. If ILIM pin is open,
the input current is limited to zero since ILIM voltage floats above 1V. If ILIM pin is short, the input current limit is
set by the register.

32 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated

Product Folder Links: bq24190 bq24192 bq24192I bq24193

 bq24190, bq24192
bq24192I, bq24193
www.ti.com SLUSAW5A – JANUARY 2012 – REVISED OCTOBER 2012

Thermal Regulation and Thermal Shutdown

The bq24190, bq24192, bq24192I, bq24193 monitors the internal junction temperature TJ to avoid overheat the
chip and limits the IC surface temperature. When the internal junction temperature exceeds the preset limit
(REG06[1:0]), the device lowers down the charge current. The wide thermal regulation range from 60°C to 120°C
allows the user to optimize the system thermal performance.
During thermal regulation, the actual charging current is usually below the programmed battery charging current.
Therefore, termination is disabled, the safety timer runs at half the clock rate, and the status register REG08[1]
goes high.
Additionally, the device has thermal shutdown to turn off the converter. The fault register REG09[5:4] is 10 and
an INT is asserted to the host.

Voltage and Current Monitoring in Buck Mode

The bq24190, bq24192, bq24192I, bq24193 closely monitors the input and system voltage, as well as HSFET
and LSFET current for safe buck mode operation.

Input Over-Voltage (ACOV)

The maximum input voltage for buck mode operation is 18V. If VBUS voltage exceeds 18V, the device stops
switching immediately. During input over voltage (ACOV), the fault register REG09[5:4] will be set to 01. An INT
is asserted to the host.

System Over-Voltage Protection (SYSOVP)

The charger device monitors the voltage at SYS. When system over-voltage is detected, the converter is stopped
to protect components connected to SYS from high voltage damage.

Voltage and Current Monitoring in Boost Mode

The bq24190, bq24192, bq24192I, bq24193 closely monitors the VBUS voltage, as well as HSFET and LSFET
current to ensure safe boost mode operation.

VBUS Over-Voltage Protection

The boost mode regulated output is 5V. When an adapter plugs in during boost mode, the VBUS voltage will rise
above regulation target. Once the VBUS voltage exceeds 5.3V, the bq24190, bq24192, bq24192I, bq24193 stops
switching and the device exits boost mode. The fault register REG09[6] is set high to indicate fault in boost
operation. An INT is asserted to the host.

Battery Protection

Battery Over-Current Protection (BATOVP)

The battery over-voltage limit is clamped at 4% above the battery regulation voltage. When battery over voltage
occurs, the charger device immediately disables charge. The fault register REG09[5] goes high and an INT is
asserted to the host.

Charging During Battery Short Protection

If the battery voltage falls below 2V, the charge current is reduced to 100mA for battery safety.

System Over-Current Protection

If the system is shorted or exceeds the over-current limit, the BATFET is latched off. DC source insertion on
VBUS is required to reset the latch-off condition and turn on BATFET.

Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 33

Product Folder Links: bq24190 bq24192 bq24192I bq24193
bq24190, bq24192
bq24192I, bq24193
SLUSAW5A – JANUARY 2012 – REVISED OCTOBER 2012 www.ti.com

Serial Interface
The bq24190, bq24192, bq24192I, bq24193 uses I2C compatible interface for flexible charging parameter
programming and instantaneous device status reporting. I2CTM is a bi-directional 2-wire serial interface
developed by Philips Semiconductor (now NXP Semiconductors). Only two bus lines are required: a serial data
line (SDA) and a serial clock line (SCL). Devices can be considered as masters or slaves when performing data
transfers. A master is the device which initiates a data transfer on the bus and generates the clock signals to
permit that transfer. At that time, any device addressed is considered a slave.
The device operates as a slave device with address 6BH, receiving control inputs from the master device like
micro controller or a digital signal processor. The I2C interface supports both standard mode (up to 100kbits), and
fast mode (up to 400kbits).
Both SDA and SCL are bi-directional lines, connecting to the positive supply voltage via a current source or pull-
up resistor. When the bus is free, both lines are HIGH. The SDA and SCL pins are open drain.

Data Validity
The data on the SDA line must be stable during the HIGH period of the clock. The HIGH or LOW state of the
data line can only change when the clock signal on the SCL line is LOW. One clock pulse is generated for each
data bit transferred.

SDA

SCL

Data line stable; Change

Data valid of data
allowed
Figure 33. Bit Transfer on the I2C Bus

START and STOP Conditions

All transactions begin with a START (S) and can be terminated by a STOP (P). A HIGH to LOW transition on the
SDA line while SCl is HIGH defines a START condition. A LOW to HIGH transition on the SDA line when the
SCL is HIGH defines a STOP condition.
START and STOP conditions are always generated by the master. The bus is considered busy after the START
condition, and free after the STOP condition.

SDA SDA

SCL SCL

START (S) STOP (P)

Figure 34. START and STOP conditions

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Byte Format
Every byte on the SDA line must be 8 bits long. The number of bytes to be transmitted per transfer is
unrestricted. Each byte has to be followed by an Acknowledge bit. Data is transferred with the Most Significant
Bit (MSB) first. If a slave cannot receive or transmit another complete byte of data until it has performed some
other function, it can hold the clock line SCL low to force the master into a wait state (clock stretching). Data
transfer then continues when the slave is ready for another byte of data and release the clock line SCL.
Acknowledgement Acknowledgement
signal from slave signal from receiver

MSB
SDA

SCL S or Sr 1 2 7 8 9 1 2 8 9 P or Sr
START or ACK ACK
STOP or
Repeated
Repeated
START START

Figure 35. Data Transfer on the I2C Bus

Acknowledge (ACK) and Not Acknowledge (NACK)

The acknowledge takes place after every byte. The acknowledge bit allows the receiver to signal the transmitter
that the byte was successfully received and another byte may be sent. All clock pulses, including the
acknowledge 9th clock pulse, are generated by the master.
The transmitter releases the SDA line during the acknowledge clock pulse so the receiver can pull the SDA line
LOW and it remains stable LOW during the HIGH period of this clock pulse.
When SDA remains HIGH during the 9th clock pulse, this is the Not Acknowledge signal. The master can then
generate either a STOP to abort the transfer or a repeated START to start a new transfer.

Slave Address and Data Direction Bit

After the START, a slave address is sent. This address is 7 bits long followed by the eighth bit as a data direction
bit (bit R/W). A zero indicates a transmission (WRITE) and a one indicates a request for data (READ).

SDA

SCL S 1-7 8 9 1-7 8 9 1-7 8 9 P

START ADDRESS R/W ACK DATA ACK DATA ACK STOP

Figure 36. Complete Data Transfer

Single Read and Write

1 7 1 1 8 1 8 1 1

S Slave Address 0 ACK Reg Addr ACK Data Addr ACK P

Figure 37. Single Write

1 7 1 1 8 1 1 7 1 1

S Slave Address 0 ACK Reg Addr ACK S Slave Address 1 ACK

8 1 1

Data NCK P

Figure 38. Single Read

Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 35
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If the register address is not defined, the charger IC send back NACK and go back to the idle state.

Multi-Read and Multi-Write

The charger device supports multi-read and multi-write on REG00 through REG08.

1 7 1 1 8 1

S Slave Address 0 ACK Reg Addr ACK

8 1 8 1 8 1 1

Slave Address ACK Data to Addr+1 ACK Data to Addr+1 ACK P

Figure 39. Multi-Write

1 7 1 1 8 1 1 7 1 1

S Slave Address 0 ACK Reg Addr ACK S Slave Address 1 ACK

8 1 8 1 8 1 1

Data @ Addr ACK Data @ Addr+1 ACK Data @ Addr+1 ACK P

Figure 40. Multi-Read

The fault register REG09 locks the previous fault and only clears it after the register is read. For example, if
Charge Safety Timer Expiration fault occurs but recovers later, the fault register REG09 reports the fault when it
is read the first time, but returns to normal when it is read the second time. To verify real time fault, the fault
register REG09 should be read twice to get the real condition. In addition, the fault register REG09 does not
support multi-read or multi-write.

36 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated

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 bq24190, bq24192
bq24192I, bq24193
www.ti.com SLUSAW5A – JANUARY 2012 – REVISED OCTOBER 2012

APPLICATION INFORMATION

Inductor Selection
The bq24190, bq24192, bq24192I, bq24193 has 1.5 MHz switching frequency to allow the use of small inductor
and capacitor values. The Inductor saturation current should be higher than the charging current (ICHG) plus half
the ripple current (IRIPPLE):
ISAT ³ ICHG + (1/ 2 ) IRIPPLE (6)
The inductor ripple current depends on input voltage (VBUS), duty cycle (D = VBAT/VVBUS), switching frequency
(fs) and inductance (L):
V ´ D ´ (1 - D)
 IRIPPLE = IN
¦s ´ L (7)
The maximum inductor ripple current happens with D = 0.5 or close to 0.5. Usually inductor ripple is designed in
the range of (20–40%) maximum charging current as a trade-off between inductor size and efficiency for a
practical design. Typical inductor value is 2.2µH.

Input Capacitor
Input capacitor should have enough ripple current rating to absorb input switching ripple current. The worst case
RMS ripple current is half of the charging current when duty cycle is 0.5. If the converter does not operate at
50% duty cycle, then the worst case capacitor RMS current ICIN occurs where the duty cycle is closest to 50%
and can be estimated by the following equation:
I CIN = ICHG ´ D ´ (1 - D) (8)
For best performance, VBUS should be decouple to PGND with 1μF capacitance. The remaining input capacitor
should be place on PMID.
Low ESR ceramic capacitor such as X7R or X5R is preferred for input decoupling capacitor and should be
placed to the drain of the high side MOSFET and source of the low side MOSFET as close as possible. Voltage
rating of the capacitor must be higher than normal input voltage level. 25V rating or higher capacitor is preferred
for 15V input voltage.

Output Capacitor
Output capacitor also should have enough ripple current rating to absorb output switching ripple current. The
output capacitor RMS current ICOUT is given:
I
I COUT = RIPPLE » 0.29 ´ IRIPPLE
2´ 3 (9)
The output capacitor voltage ripple can be calculated as follows:
VOUT æç VOUT ö÷
DVO = 1 -
8LC¦ s2 çè VIN ÷
ø (10)
At certain input/output voltage and switching frequency, the voltage ripple can be reduced by increasing the
output filter LC.
The charger device has internal loop compensator. To get good loop stability, the resonant frequency of the
output inductor and output capacitor should be designed between 15kHz and 25kHz. With 2.2µH inductor, the
typical output capacitor value is 20µF. The preferred ceramic capacitor is 6V or higher rating, X7R or X5R.

Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 37

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bq24190, bq24192
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PCB Layout
The switching node rise and fall times should be minimized for minimum switching loss. Proper layout of the
components to minimize high frequency current path loop (see Figure 41) is important to prevent electrical and
magnetic field radiation and high frequency resonant problems. Here is a PCB layout priority list for proper
layout. Layout PCB according to this specific order is essential.
1. Place input capacitor as close as possible to PMID pin and GND pin connections and use shortest copper
trace connection or GND plane.
2. Place inductor input terminal to SW pin as close as possible. Minimize the copper area of this trace to lower
electrical and magnetic field radiation but make the trace wide enough to carry the charging current. Do not
use multiple layers in parallel for this connection. Minimize parasitic capacitance from this area to any other
trace or plane.
3. Put output capacitor near to the inductor and the IC. Ground connections need to be tied to the IC ground
with a short copper trace connection or GND plane.
4. Route analog ground separately from power ground. Connect analog ground and connect power ground
separately. Connect analog ground and power ground together using power pad as the single ground
connection point. Or using a 0Ω resistor to tie analog ground to power ground.
5. Use single ground connection to tie charger power ground to charger analog ground. Just beneath the IC.
Use ground copper pour but avoid power pins to reduce inductive and capacitive noise coupling.
6. Decoupling capacitors should be placed next to the IC pins and make trace connection as short as possible.
7. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB ground.
Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground plane on the
other layers.
8. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the QFN
information, refer to SCBA017 and SLUA271.

Figure 41. High Frequency Current Path

38 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated

Product Folder Links: bq24190 bq24192 bq24192I bq24193

 PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Top-Side Markings Samples
(1) Drawing Qty (2) (3) (4)

BQ24190RGER ACTIVE VQFN RGE 24 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ24190
& no Sb/Br)
BQ24190RGET ACTIVE VQFN RGE 24 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ24190
& no Sb/Br)
BQ24192IRGER ACTIVE VQFN RGE 24 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ
& no Sb/Br) 24192I
BQ24192IRGET ACTIVE VQFN RGE 24 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ
& no Sb/Br) 24192I
BQ24192RGER ACTIVE VQFN RGE 24 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ24192
& no Sb/Br)
BQ24192RGET ACTIVE VQFN RGE 24 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ24192
& no Sb/Br)
BQ24193RGER ACTIVE VQFN RGE 24 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ24193
& no Sb/Br)
BQ24193RGET ACTIVE VQFN RGE 24 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ24193
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Jan-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ24190RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24190RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24192IRGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24192IRGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24192RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24192RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24193RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
BQ24193RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Jan-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ24190RGER VQFN RGE 24 3000 367.0 367.0 35.0
BQ24190RGET VQFN RGE 24 250 210.0 185.0 35.0
BQ24192IRGER VQFN RGE 24 3000 367.0 367.0 35.0
BQ24192IRGET VQFN RGE 24 250 210.0 185.0 35.0
BQ24192RGER VQFN RGE 24 3000 367.0 367.0 35.0
BQ24192RGET VQFN RGE 24 250 210.0 185.0 35.0
BQ24193RGER VQFN RGE 24 3000 367.0 367.0 35.0
BQ24193RGET VQFN RGE 24 250 210.0 185.0 35.0

Pack Materials-Page 2
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