820 HP Specf
820 HP Specf
Overview
HP EliteBook 820 G2 Notebook PC
Front/Left
Overview
Right
Overview
Bottom
Overview
AT A GLANCE
Windows 10 versions, Windows 8.1versions, Windows 7 versions, Ubuntu Linux or FreeDOS 2.0
Magnesium chassis, HP DuraFinish, HP DisplaySafe frame, HP duraKeys, precision aluminum drop hinge, aluminum palm
rest
4-step Soft-touch paint process
Patent-pending Drop-jaw Ethernet port
EasyAccess door to quickly access most components for easy serviceability
Full-sized spill-resistant keyboard; optional back-lit keyboard keeps you productive in low-light settings
Choice of 5th Generation Intel® Core™ i7, i5 and i3 processors
Memory options up to 16 GB
Weight starting at 2.94 lbs/1.33 kg
Storage options up to 1 TB Hard Drives, 512 GB Solid State Drives, or 256GB PCIe Solid State Drive
M.2 32GB Flash Cache for Intel Smart Response Technology installed in the factory
M.2 120GB Solid State Drive & 256GB PCIe Solid State Drive can be configured as primary storage or combined with a SATA
drive for dual storage performance
Choice of Touch or Non Touch 12.5” diagonal displays
Easily hot dock with the UltraSlim Docking Station
DisplayPort for high resolution support
Touchpad with scroll zone, on/off button with LED indicator
Enhanced security features including HP Sure Start self-healing BIOS, HP Client Security and optional HP Fingerprint
Reader
Optional HD webcam with dual-microphone array for video conferencing
HD Audio with DTS Studio Sound™ optimized for high fidelity audio
Wireless and speaker mute buttons
Supports a broad range of wireless LAN and wireless WAN options, including 4G LTE, for connectivity on the go
UEFI BIOS Compliant with 2.3.1 UEFI Specification
NOTE: See important legal disclosures for all listed specs in their respective features sections.
Features
PRODUCT NAME
OPERATING SYSTEM
Preinstalled Windows 10 Pro 64*
Windows 10 Home 64*
Windows 8.1 Pro 64*
Windows 8.1 64*
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)***
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro)***
Windows 7 Professional 64 (available through downgrade rights form Windows 8.1 Pro)**
Windows 7 Professional 32 (available through downgrade rights form Windows 8.1 Pro)**
Windows 7 Professional 64*
Windows 7 Professional 32*
Ubuntu Linux
FreeDOS 2.0
* Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is
automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for
updates. See http://http://www.microsoft.com
** This system is preinstalled with Windows 7 Professional software and also comes with a license and media for Windows 8 Pro
software. You may only use one version of the Windows software at a time. Switching between versions will require you to
uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and
installing operating systems to avoid loss of your data.
***This system is preinstalled with Windows 7 Professional software and also comes with a license and media for Windows 10
Pro software. You may only use one version of the Windows software at a time. Switching between versions will require you to
uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and
installing operating systems to avoid loss of your data.
Features
PROCESSOR
5th Generation Intel® Core™ i3-5010U 2.1 GHz 3-MB L3 Cache, 15W
5th Generation Intel® Core™ i5-5200U 2.2 GHz (max turbo frequency 2.7-GHz), 3 MB L3 cache, 15W
5th Generation Intel® Core™ i5-5300U 2.3 GHz (max turbo frequency 2.9-GHz), 3 MB L3 Cache, 15W
5th Generation Intel® Core™ i7-5500U 2.4 GHz (max turbo frequency 3.0-GHz), 4 MB L3 Cache, 15W
5th Generation Intel® Core™ i7-5600U 2.6 GHz (max turbo frequency 3.2-GHz), 4 MB L3 Cache, 15W
* Multi-Core is designed to improve performance of certain software products. Not all customers or software applications
will necessarily benefit from use of this technology. 64-bit computing on Intel® architecture requires a computer system
with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will
vary depending on your hardware and software configurations. Intel's numbering is not a measurement of higher
performance.
** Not available with Intel iAMT (*Not available with vPro)
NOTE: Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization
mode.
Using Turbo Boost while powered from battery might impact battery cycle life. Cycle life describes how long the battery will
last before it needs to be replaced. A cycle refers to one complete charge/discharge cycle of the battery. Because Turbo Boost
causes extra stress on the battery, it often shortens the lifetime of the battery.
HP decided not to enable Turbo Boost when powered from battery. This decision was based on the desire to give customers
the greatest battery cycle life possible. Turbo Boost is enabled when powered from AC adapter.
Based on customer requests, HP will provide an option to enable Turbo Boost while powered from battery. For the 2013
platform, it will be an F10 option. Turbo Boost will be available for devices powered from battery by the end of the year. The
additional performance might cause a slight reduction in battery cycle life, but will not void the battery warranty.
*Implementing Turbo Boost in F10 option is only allowed for batteries over 40WHr. Intel® Turbo Boost technology requires a
PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost performance varies depending on hardware, software
and overall system configuration. See www.intel.com/technology/turboboost for more information.
CHIPSET
Chipset integrated with processor
Features
network, isolate infected systems, and update PCs regardless of their power state.
*Requires a Windows operating system, network hardware and software, connection with a power source, and a direct (non-
VPN) corporate network connection which is either cable or wireless LAN.
NOTE: Some functionality of this technology, such as Intel® Active management technology and Intel Virtualization
technology, requires additional 3rd party software in order to run. Availability of future "virtual appliances" applications for
Intel vPro technology is dependent on 3rd party software providers. Microsoft Windows required.
GRAPHICS
Integrated:
Intel® HD* Graphics 5500
DISPLAY
HP EliteBook 820 G2 Notebook PC
Internal
Non Touch
12.5" diagonal LED-backlit HD* anti-glare SVA flat (1366x768)
12.5" diagonal LED-backlit HD* anti-glare SVA flat (1366x768) with camera
12.5" diagonal LED-backlit FHD anti-glare UWVA ultra slim (1920 x 1080)
12.5" diagonal LED-backlit FHD anti-glare UWVA ultra slim (1920 x 1080) with camera
External
Up to 32-bit per pixel color depth
VGA
Port supports resolutions up to 1920 x 1200 external resolution @75 Hz
DisplayPort
Supports resolutions up to 3840 x 2160 @ 60Hz. Supports Multi-Stream Transport (MST) where three displays can be daisy
chained with digital displays through DisplayPort Only. The full resolution of each display will be limited as you reach 3
displays due to the bandwidth limitations with a maximum resolution of:
Features
Hard Drives*
320 GB 7200rpm SATA Hard Drive
500 GB 7200rpm SATA Hard Drive
500 GB 7200rpm Self-Encrypting Drive
500 GB 5400 rpm Self Encrypting Drive (FIPS-140-2)
500 GB 5400rpm + 8GB NAND SATA Hybrid Hard Drive
1TB 5400rpm SATA Hard Drive
*For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB
(for Windows 7) and up to 30 GB (for Windows 8 and 10) of system disk is reserved for the system recovery software.
FLASH CACHE
32 GB M.2 (NGFF)
Optional 32 GB M.2 flash cache module support for Intel Smart Response Technology.
Available only with standard non-SED hard drive.)
MEMORY
Standard
DDR3L-1600 (Transfer rates up to 1600 MT/s)
Two SODIMM slots supporting dual-channel memory
Maximum
Upgradeable to 16 GB with optional 8 GB SODIMMs in slots 1 and 2*
Dual-channel
Features
Maximized dual-channel performance requires SODIMMs of the same size and speed in both memory slots.
* Maximum memory capacities assume Windows 64-bit operating systems or Linux. With Windows 32-bit operating systems,
memory above 3 GB may not all be available due to system resource requirements.
NOTE: Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.
NETWORKING/COMMUNICATIONS
Wireless
Support for a broad range of secure, integrated wireless LAN and wireless WAN options featuring support for the latest
industry standards. Broadband Wireless (WWAN) requires a Windows operating system and is available in select countries as a
standard, factory configurable feature only. Integrated Bluetooth is also available (factory configurable only) and can be
combined with any of the supported wireless LAN and wireless WAN options.
*Wireless access point and Internet service is required and is not included. Availability of public wireless access points limited.
**4G LTE WWAN is an optional feature, not available on all products, in all regions and requires separately purchased service
contract. Check with service provider for coverage and availability. Connection speeds will vary due to location, environment,
network conditions, and other factors.
Communications
Intel® I218LM Gigabit* Network Connection (10/100/1000 NIC)
* The term "10/100/1000" or "Gigabit" Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet, and
does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server and
network infrastructure is required.
AUDIO/MULTIMEDIA
Audio
HD Audio with DTS Studio Sound™
2 Integrated stereo speakers
Integrated dual-microphone array; located in the display
Function keys for microphone mute, volume up, volume down
Stereo headphone/line out
Stereo microphone/line in
Webcam
Optional* 720p HD** webcam
Features
HD format (widescreen)
Supports videoconferencing (non-HD) and still image capture
High quality fixed focus lens
Video capture at various resolutions up to 1280x720 resolution (720p) and up to 30fps
M-JPEG compression supports higher frame rates for video capture and videoconferencing
Improved low light sensitivity
Improved dynamic range
Skype-ready ***
* Sold separately.
** HD content required to view HD images.
***Internet access required.
Features
3. For the use cases outlined in the DOD 5220.22-M Supplement.Does not support solid state drives.
4. Requires initial user set up.
5. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88.
6. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription.
Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability
outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/computrace-agreement. Data Delete is an optional service provided
by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers
must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from
Absolute Software.
MultiMedia
CyberLink PowerDVD
CyberLink YouCam BE
Communication
HP Connection Manager with support for HP Mobile Connect (Windows 7 only)2
HP GPS and Location1
HP Mobile Connect (Windows 8 only)2
HP Wireless Hotspot3 (Windows 8 only)
Intel WiDi Software4
HP Roaming Alert
Intel My WiFi and Wireless Drivers
3rd Party
Adobe® Flash Player (Commercial)
Foxit PhantomPDF Express for HP
Bing Search
Skype6
Buy Office
NOTE: HP Recovery Manager enables fast recovery of the factory preinstalled image if the system becomes corrupted or if
important system files are accidentally deleted. Up to 16 GB (for Windows 7) and 36 GB (for Windows 8) of system disk is
reserved for the system recovery software.
1. GPS access requires an unobstructed path to multiple satellites. Performance may be affected if/when used inside of
buildings, bridges or heavily congested metropolitan areas. Requires separately purchased GPS navigation software
available from multiple GPS applications.
2. HP Mobile Connect is only available on selective devices with wwan. For geographical availability refer to
http://www.hp.com/go/mobileconnect
3. The wireless hotspot application requires an active internet connection that is shared with the connecting devices.
Features
Wireless hotspot data usage may incur additional charges. Check with your service provider for plan details.
4. Integrated Intel Wi-Di feature is available on select configurations only and requires separately purchased projector, tv or
computer monitor with an integrated or external Wi-Di receiver. External Wi-Di receivers connect to the projector, tv or
computer monitor via a standard HDMI cable, also sold separately.
5. Requires an Internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible
printers, supported documents and image types and other HP ePrint details, see
http://www.hp.com/go/businessmobileprinting.
6. Skype is not offered in China.
Manageability
HP Driver Packs 1
HP SoftPaq Download Manager (SDM)
HP System Software Manager (SSM)1
HP BIOS Config Utility (BCU) 1
HP Client Catalog / HP CIK for Microsoft SCCM1
LANDESK Management 1
1. Not preinstalled
For more information on HP Client Management Solutions refer to: http://www.hp.com/go/clientmanagement.
Security Hardware
TPM Embedded Security Chip 1.2
Security lock slot
Fingerprint Reader
Integrated Smart Card Reader
1. Requires Windows. Data is protected prior to Drive Encryption login. Turning the PC off or into hibernate logs out of Drive
Encryption and prevents data access.
2. For the use cases outlined in the DOD 5220.22-M Supplement. Supports standard Hard Drives. Initial setup required.
3. Opt in and internet connection required for updates.
POWER
Power Supply
HP 45W Smart AC Adapter
45W 2-prong 7.4mm DC jack AC Adapter (Only for Japan)
HP 65W Smart EM AC Adapter (China and India only)
Power cord is configurable; either 3.2 feet or 6 feet (1.0 or 1.8 meter)
Total length including external AC adapter is 9.2 feet or 12 feet (2.86 or 3.66 meter).
Features
Primary Battery
3-cell HP Long Life Polymer 26 WHr
3-cell HP Long Life Polymer 46 WHr
Battery Life*
Hardware details Battery UMA Graphics
HDD 3-cell (46 WHr) Up to 12 hrs
SSD 3-cell (46 WHr) Up to 15 hrs 15 mins
SSD 3-cell (26 WHr) Up to 9 hrs 15 mins
**Windows 7 MM07 battery life will vary depending on various factors including product model,
configuration, loaded applications, features, use, wireless functionality, and power management
settings. The maximum capacity of the battery will naturally decrease with time and usage. See
www.bapco.com for additional details.
**Standby life will vary depending on various factors including battery, Memory, CPU, EC and LAN chip. The maximum capacity
of the battery will naturally decrease with time and usage.
Power Conservation
Supports enhanced Intel SpeedStep technology (allows Battery Optimized Mode, Maximum Performance Mode, or Automatic
mode)
AMD PowerPlay technology (discrete models)
Hibernation
Standby
ACPI compliance
Touch
Starting at 3.35 lbs/1.52 kg
Weight will vary by configuration.
3-cell (26 Whr) battery, FHD Touch, no FPR, 1 SODIMM, WLAN, lightest M.2 SSD primary storage module, no camera, no WWAN.
Dimensions (w x d x h)
Non Touch
12.2 x 8.48 x 0.83 in
31 x 21.53 x 2.1 cm
Touch
12.2 x 8.48 x 0.97 in
Features
31 x 21.53 x 2.46 cm
PORTS/SLOTS
Ports
(1) DisplayPort 1.2
(1) USB 3.0 Charging Port
(2) USB 3.0 Port
(1) RJ-45 / Ethernet
(1) Side Docking connector
(1) Headphone/Microphone Combo
(1) AC Port
(1) VGA Port
Expansion Slots
Media Card Reader
Supports SD, SDHC, SDXC
NOTE: Certain restrictions and exclusions apply. Consult the HP Customer Support Center for details.
http://h20000.www2.hp.com/bizsupport/TechSupport/ProductRoot.jsp
*HP Care Packs are sold separately. Service levels and response times for HP Care Services may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. Consult the HP
Customer Support Center for details. http://h20000.www2.hp.com/bizsupport/TechSupport/ProductRoot.jsp
Technical Specifications
SYSTEM UNIT
Technical Specifications
DISPLAYS
12.5” diagonal LED- Outline Dimensions 11.46 x 7.14 x 0.14 in (29.1 x18.14 x 0.36 cm)
backlit HD anti-glare (W x H x D)
SVA flat (1366 x 768) Active Area 10.89 x 6.12 in (27.6615 x 15.552 cm)
Weight 0.6 lb (270g) (max)
Diagonal Size 12.5 in (35.75 cm)
12.5” diagonal LED- Outline Dimensions 291.0mm x 181.4mm (max) x 2.85mm (max)
backlit FHD Premium (W x H x D)
anti-glare UWVA slim Active Area 276.48mm typ. (W) x 155.52mm typ. (H)
(1920 x 1080)
Weight 0.50 lb (230g) (max)
Diagonal Size 12.5 in (35.75 cm)
Technical Specifications
12.5” diagonal LED- Outline Dimensions 291.0mm x 181.4mm (max) x 2.85mm (max)
backlit FHD Premium (W x H x D)
anti-glare UWVA slim Active Area 276.48mm typ. (W) x 155.52mm typ. (H)
(1920 x 1080)+Touch
Weight 0.50 lb (230g) (max)
Diagonal Size 12.5 in (35.75 cm)
Touch enabled Yes
TSP Type Capacitive
Touch point supported Min 5-point & Max 10-point for Win8
320 GB* 7200 rpm SATA Drive Weight 0.21 lbs (95 g)
Hard Drive Capacity 320 GB
Height 0.28 in (7 mm)
Width 2.75 in (69.85 mm)
Interface ATA-8, SATA 3.0
Transfer Rate Synchronous (maximum) 600 MB/s (Drive Capability)
Seek Time Single Track 1.5 ms-2ms
(typical reads, including Average 12 ms-13ms
settling)
Maximum 18ms-22 ms
Cache Up to 32 MB
Rotational Speed 7200 rpm
Logical Blocks 625,142,448
Operating Temperature 32° to 140° F (0° to 60° C) [case temp]
Features ATA Security; S.M.A.R.T.IV, NCQ, Ultra DMA
Technical Specifications
500 GB* 7200 rpm Drive Weight 0.20lbs(92g- 0.21 lbs (95g)
SATA Hard Drive
Capacity 500 GB
Height 0.28 in (7 mm)
Width 2.75 in (69.85 mm)
Interface ATA-8, SATA 3.0
Transfer Rate Synchronous (maximum) 600 MB/s (Drive Capability)
Seek Time Single Track 1.5 ms-2ms
(typical reads, including Average 12 ms-13ms
settling)
Maximum 18ms-22 ms
Rotational Speed 7200 rpm
Logical Blocks 976,773,168
Operating Temperature 32° to 140° F (0° to 60° C) [case temp]
Features ATA Security; S.M.A.R.T.IV, NCQ, Ultra DMA
Technical Specifications
(typical reads, including Average 12 ms
settling) Maximum 22 ms
Cache 16 MB
Rotational Speed 5400 rpm
Logical Blocks 976,773,168
Operating Temperature 32° to 140° F (0° to 60° C) [case temp]
Features ATA Security; TCG Opal 2.x, FIPS
Technical Specifications
SATA 3 Gb/s 32 GB*, M.2 Drive Weight 10 Grams
2242 Solid State Drive Capacity 32 GB
Height 0.09 in (3.7 mm)
Width 0.87 in (22 mm)
Interface ATA-8, SATA 3.0
Performance Maximum Sequential Maximum Sequential Write
Read
Up to 380 MB/s Up to 110 MB/s
Logical Blocks 62,533,296
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; DIPM; TRIM; DEVSLP
Technical Specifications
Performance Maximum Sequential Read Maximum Sequential Write
Up to 520 MB/s Up to 140 MB/s
Logical Blocks 250,069,680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; DIPM; TRIM; DEVSLP
SATA 3 Gb/s 180 GB*, 2.5- Drive Weight 78 Grams
inch SATA Solid State Capacity 180 GB
Drive
Height 0.28 in (7 mm)
Width 2.75 in (69.85 mm)
Interface ATA-8, SATA 3.0
Performance Maximum Sequential Maximum Sequential Write
Read
Up to 540 MB/s Up to 490 MB/s
Logical Blocks 351,651,888
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; DIPM; TRIM; DEVSLP
Technical Specifications
Features ATA Security; DIPM; TRIM; DEVSLP
Technical Specifications
Height 0.28 in (7 mm)
Width 2.75 in (69.85 mm)
Interface ATA-8, SATA 3.0
Performance Maximum Sequential Maximum Sequential Write
Read
Up to 550 MB/s Up to 550 MB/s
Logical Blocks 1,000,215,216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; DIPM; TRIM; DEVSLP
NETWORKING/COMMUNICATIONS
*For storage drives, GB = 1 billion bytes. TN = 1 trillion bytes. Actual formatted capacity is less. Upt o 16Gb (for Windows 7) and up
to 30GB (for Windows 8) of system disk is reserved for system recovery software.
Technology/Operating LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 800 MHz
bands (Band 20, DD800) MHz
HSPA+: 2100 (Band 1), 1900 (Band 2), 850 (Band 5), 900 (Band 8) MHz
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 (Band 5), 900 (Band 8) MHz
Wireless protocol 3GPP Release 8 LTE Specification
standards WCDMA R99, 3GPP Release 5, 6 and 7 UMTS Specification
E-GPRS: Class B, Multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9
GPS Standalone
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz
Technical Specifications
Maximum data rates LTE: 100 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)
EDGE: 236.8 kbps (Download), 236.8 kbps (Upload)
GPRS: 85.6 kbps(Download), 85.6 kbps (Upload)
Maximum output LTE: 23 dBm
power HSPA+: 23.5 dBm
E-GPRS 1900/1800: 26.5 dBM
E-GPRS 900/850: 27.5 dBM
GPRS 1900/1800: 29.5 dBm
GPRS 900/850: 32.5 dBm
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
E-GPRS: 2,800 mA (peak); 700 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 6g
Dimensions 1.65 x 1.18 x 0.09 in (42 x 30 x 2.3 mm)
(Length x Width x
Thickness)
* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not
available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to
location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.
Technology/Operating LTE: 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 700 (Band 13), 700 (Band 17), 1900 (Band 25) MHz
bands HSPA+: 2100 (Band 1), 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 800 (Band 8) MHz
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 (Band 5), 900 (Band 8) MHz
EV-DO: 800 (BC0), 1900 (BC1) MHz
Wireless protocol 3GPP Release 9 LTE Specification
standards WCDMA R99, 3GPP Release 5, 6 and 7 UMTS Specification
E-GPRS: Class B, Multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9
EVDO Release 0 and Release A
GPS Standalone
GPS bands 1575.42 MHz (± 1.023 MHz), GLONASS 1596-1607MHz
Maximum data rates LTE: 100 Mbps (Download), 50Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)
WCDMA PS: 384 kbs (Download), 384 kbs (Upload)
WCDMA CS: 64 kbs (Download), 64 kbs (Upload)
E-GPRS: 236.8 kbps (Download), 236.8 kbps (Upload)
GPRS: 85.6 kbps(Download), 85.6 kbps (Upload)
Technical Specifications
GPRS 1900/1800 : 30 dBm
GPRS 900/850: 32 dBm
CDMA: 24 dBM
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
E-GPRS: 2,800 mA (peak); 500 mA (average)
EV-DO: 1000 mA (peak); 700 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 6g
Dimensions 1.65 x 1.18 x 0.09 in (42 x 30 x 2.3 mm)
(Length x Width x
Thickness)
* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available
in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location,
environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.
HP hs3110HSPA+ Mobile Broadband Module*
Technology/Operating HSPA+: 2100 (Band1), 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 900 (Band 8) MHz
bands E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz
Wireless protocol E-GPRS: Class B, Multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9.
standards UMTS/WCDMA: Release 99 and Release 7
GPS Standalone, A-GPS
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz
Maximum data rates HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)
HSPA: 7.2 Mbps (Download), 5.76 Mbps (Upload)
WCDMA PS: 384 kbps (Download), 384 kbps (Upload)
WCDMA CS: 64 kbps (Download), 64 kbps (Upload)
E-GPRS: 296 kbps (Download), 236.8 kbps (Upload)
GPRS: 107 kbps (Download), 85.6 kbps (Upload)
Maximum output HSPA+: 24 dBm
power E-GPRS 1800/1900: 26 dBm
E-GPRS 850/900: 27 dBm
GPRS 1800/1900: 30 dBm
GPRS 850/900: 33 dBm
Maximum power 2500 mA (peak); 600 mA (average)
consumption
Form Factor M.2, 3042-S3 Key B
Weight 6g
Dimensions 1.65 x 1.18 x 0.09 in (42 x 30 x 2.3 mm)
(Length x Width x
Thickness)
* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not
available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to
location, environment, network conditions, and other factors.
WIRELESS LAN (WLAN)
Intel® Dual Band Wireless-AC 7265 802.11 ac (2X2) Wi-Fi + Bluetooth®*
Technical Specifications
Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability Wi-Fi certified
Frequency Band 802.11b/g/n
2.402 – 2.482 GHz
Note:
The FCC has declared as of January 1, 2015 products that utilize
passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
802.11a
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Note:
Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
Technical Specifications
802.11a : +14dBm minimum
Technical Specifications
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation)
and a packet error rate of 10% for 802.11a/g (OFDM modulation).
Technical Specifications
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
802.11a
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Note:
Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
Technical Specifications
WAPI
Sub-channels Multinational support with frequency bands and channels compliant to
local regulations.
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between band Access Points
Output Power2 802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
Power Consumption Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Technical Specifications
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. In Power Save Polling mode and on battery power.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CCK
modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).
5. WLAN supplier's client utility is required for Cisco Compatible Extensions support with
Microsoft Windows XP. WLAN may also be compatible with certain third-party software
supplicants. WLAN supplier IHV extensions required for Cisco Compatible Extensions support
for Microsoft Windows Vista.
*Wireless is an optional feature. Wireless access point and internet service required and
sold separately. Availability of public wireless access points limited.
Technical Specifications
Dial-Up Networking (DUN)1,2
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1,2
Human Interface Device Profile (HID)1,2
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Technical Specifications
Security1 IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g
mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX
Lite
WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 802.11b : +16dBm minimum
Technical Specifications
Two embedded dual band 2.4/5 GHz antennas are provided to the card
to support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Weight Type 2230 : 2.8g
Or
Type 1630 : 2g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
4. Check latest software/driver release for updates on supported security features.
5. Maximum output power may vary by country according to local regulations.
6. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation)
and a packet error rate of 10% for 802.11a/g (OFDM modulation).
* Wireless is an optional feature. Wireless access point and internet service required and sold
separately. Availability of public wireless access points limited. The specifications for the 802.11n
WLAN are draft specifications and are not final. If the final specifications differ from the draft
specifications, it may affect the ability of the notebook to communicate with other 802.11n WLAN
devices.
Technical Specifications
Bluetooth Software Supported Full support of Bluetooth Security Provisions
Security
Power Management Microsoft Windows ACPI, and USB Bus Support
Power Management Self-configurable to optimize power conservation in all operating
Certifications modes, including Standby, Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries, including:
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetooth Profiles Supported
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Serial Port Profile (SPP)1
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)1,2
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1,2
Certifications Human Interface Device Profile (HID)1,2
Bluetooth Profiles Supported FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Technical Specifications
transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
802.11a/n
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Note:
Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
Technical Specifications
Power Consumption Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3 802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card
to support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Weight Type 2230 : 2.8g
Or
Type 1630 : 2g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
7. Check latest software/driver release for updates on supported security features.
8. Maximum output power may vary by country according to local regulations.
9. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation)
and a packet error rate of 10% for 802.11a/g (OFDM modulation).
* Wireless is an optional feature. Wireless access point and internet service required and sold
separately. Availability of public wireless access points limited. The specifications for the 802.11n
WLAN are draft specifications and are not final. If the final specifications differ from the draft
specifications, it may affect the ability of the notebook to communicate with other 802.11n WLAN
devices.
Technical Specifications
Number of Available Channels 79 (1 MHz) available channels
Data Rates and Throughput 3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric or 1306.9 kbps symmetric
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device
with a maximum transmit power of +4 dBm for BR and EDR.
Receiver Sensitivity Modulation 0.01% BER 0.001% BER
GFSK -80 dBm -70 dBm
π/4-DQPSK -80 dBm -70 dBm
8DPSK -80 dBm -70 dBm
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Up to 33 ft (10 m)
Electrical Interface USB 2.0 compliant
Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology
Electrical Interface Point to Point, Multipoint Pico Nets up to 7 slaves
Bluetooth Software Supported Full support of Bluetooth Security Provisions
Security
Power Management Microsoft Windows ACPI, and USB Bus Support
Power Management Self-configurable to optimize power conservation in all operating
Certifications modes, including Standby, Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries, including:
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetooth Profiles Supported
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Serial Port Profile (SPP)1
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)1,2
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Certifications Hard Copy Cable Replacement (HCRP)1,2
Bluetooth Profiles Supported Personal Area Networking Profile (PAN)1,2
Human Interface Device Profile (HID)1,2
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Technical Specifications
AUDIO/MULTIMEDIA - DTS STUDIO SOUND™
Hardware Implementation ALC3228
Function Key Volume Volume up, volume down, and mute
Controls
Full Duplex Yes
Microphone In Stereo
Headphone/Line Out Stereo
Integrated Microphone Yes, dual digital microphone array
Audio Output Quality Frequency Response 20 Hz – 20 kHz
Signal to Noise Ratio >85 dB
Total Harmonic 0.01%
Distortion
Noise Floor –110 dB
Play/Record Sampling 8 kHz – 48kHz
Rate(s)
DAC 16, 20 or 24-bit
ADC 16 or 20-bit
Integrated Stereo Power Rating 2 Watts
Speakers Impedance 4 Ohms
SECURITY
HP Fingerprint Reader Mobile Voltage Operation 3.0V-3.6V
(optional) Operating Temperature 14° – 167°F (-10° – 75°C)
Current Consumption 36 mA peak
Image
Low Latency Wait for 950 uA
Finger
Capture Rate 6000 lines/sec
ESD Resistance IEC 61000-4-2 4B (±15KV)
Detection Matrix 200*1 (plus another secondary line)
508 dpi
12*3 mm sensor area
Smart Card Reader Smart card standard PC/SC 2.0 for Windows smart card standard
Dimensions (L x W x H) 0.41x 0.08 x 0.32 in (10.5 x 2 x 8.2 mm)
Smart Card support ISO 7816 Class A and AB smart cards
Smart Card Interface Smart Card Interface with T = 0 and T = 1 support
Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436,
SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via
external EEPROM
Technical Specifications
Operating systems No driver is required for this device. Native support is provided by the
operating system.
Power Normal Mode With card present, before being suspended: 40.9 mA
Without card present, before being suspended:
33.16 mA
After being suspended with smart card present: 380
μA
After being suspended without smart card present:
380 μA
Power Saving With card present, before being suspended: 40.6 mA
Mode Without card present: 380 μA
After being suspended with smart card present: 380
μA
Features Support single slot
Support T0, T1 protocol
Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442,
SLE4436,
SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041
card via external EEPROM
Support ISO7816 Class A, B and C (5V/3V/1.8V) card
Implemented as an USB full speed device with bulk transfer
endpoint, Mass
Storage endpoint
Built-in PLL for USB and Smart Card clocks requirement
Support EEPROM for USB descriptors customization (PID/VID/
iManufacturer/iProduct/Serial Number), Direct Web Page Link, and
accessing memory card module.
EEPROM programmable via USB interface
Support software update for memory card module
Support Direct Web Page Link via configuration in external EEPROM
Support short APDU and extended APDU
Compatible with Microsoft USB-CCID driver
Support remote wake up through inserting card/removing card
Support USB selective suspend
Support Power Saving Mode (Using one pin to select between
Normal/PWR Saving Mode)
Support card power over current protection mechanism
Built in resonator.
Support USB LPM (Link Power Management) features.
Embedded clock source.
POWER
HP 45W Smart AC Adapter Dimensions 95.0 x 40.0 x 26.5mm
Non-Slim & Non-Slim 2 Input 90 to 265 VAC
Prong
Input Efficiency 88% min at 115 VAC / 89% min at 230VAC
Input frequency range 47 to 63 Hz
Input AC current 1.4 A at 90 VAC and maximum load
Technical Specifications
Output Output power 45W
DC output 19.5V
Hold-up time 5 msec at 115 VAC input
Output current limit <8A, Over voltage protection- 29V max
automatic shutdown
Connector 3 pin/grounded, mates with interchangeable cords
Environmental Design Operating 32° to 95° F (0° to 35° C)
temperature
Non-operating (storage) -4° to 121° F (-20° to 85° C)
temperature
Altitude 0 to 16,405 ft (0 to 5,000 m)
Humidity 0% to 95%
Storage Humidity 0% to 95%
EMI and Safety CE Mark - full compliance with LVD and EMC directives; Worldwide safety
Certifications standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals
- C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B,
CCC, NOM-1 NYCE; Reliability - failure rate of less than 0.1% annually within
the first three years of operation.
HP 65W EM AC Adapter Dimensions 4.98 x 1.97 x 1.18 in (12.65 x 5.0 x 3.0 cm)
(China and India only) Weight 0.62 lb (300 g) max
Input 90 to 265 VAC
Input Efficiency 87% min at 115 VAC/230VAC
Input frequency range 47 to 63 Hz
Input AC current 1.7 A at 90 VAC
Output Output power 65W
DC output 19.5V
Hold-up time 5 msec at 115 VAC input
Output current limit <11A, Over voltage protection- 29V max
automatic shutdown
Connector 3 pin/grounded, mates with 4.5mm barrel type Smart ID DC connector
Environmental Design Operating 32° to 95° F (0° to 35° C)
temperature
Non-operating (storage) -4° to 185° F (-20° to 85° C)
temperature
Altitude 0 to 16,405 ft (0 to 5,000 m)
Technical Specifications
Certifications standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals
- C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B,
CCC, NOM-1 NYCE; MTBF - over 200,000 hours at 25°C ambient condition.
3-cell HP Long Life Dimensions (H x W x L) 0.85 x 1.76 x 10.59 in (2.16 x 4.46 x 26.9 cm)
(26WHr) Lithium-Ion Weight 168.5 g
Polymer
Cells/Type 3-cell Lithium-Ion Polymer
Energy Voltage 11.1
Amp-hour capacity 4.4Ah
Watt-hour capacity 26.3Wh
Temperature Operating (Charging) 32° to 113° F (0° to 45° C)
Operating (Discharging) 14° to 122° F(-10° to 50° C)
Non-operating -4° to 122° F (-20° to 50° C)
Battery System in OFF or 2.5 hours
Re-Charge Time Standby Mode
Fuel Gauge LED No
Warranty 1 year or 3 years*
*Battery warranty depends on the platform warranty.
Optional Travel Battery No
Available
ENVIRONMENTAL
Technical Specifications
Eco-Label Certifications & This product has
declarations received or is in the
process of being
certified to the
following
approvals and may be
labeled with one or
more of these marks:
IT ECO
declaration
US ENERGY
STAR®
EPEAT <Gold>
registered in the
United States. See
http://www.epeat.net
for
registration status in
your country.
System Configuration The configuration used
for the Energy
Consumption and
Declared Noise
Emissions data for the
Notebook model is
based on a “Typically
Configured Notebook”.
Note:
Energy efficiency data
listed is for an ENERGY
STAR® compliant
product if offered
within the model
family. HP computers
marked with the
ENERGY STAR® Logo
are
compliant with the
applicable U.S.
Environmental
Technical Specifications
Protection Agency
(EPA)
ENERGY STAR®
specifications for
computers. If a model
family does not offer
ENERGY
STAR® compliant
configurations, then
energy efficiency data
listed is for a typically
configured PC
featuring a hard disk
drive, a high efficiency
power supply, and a
Microsoft Windows®
operating system.
*NOTE: Heat
dissipation is
calculated based on
the measured watts,
assuming the
service level is
attained for one hour.
Technical Specifications
Cadmium greater than
20ppm by weight
Technical Specifications
standard at
the < gold>
level,
see
www.epeat.n
et
Plastics parts
weighing over
25 grams
used in the
product are
marked per
ISO11469 and
ISO1043.
This product
contains 0%
post-
consumer
recycled
plastic (by
wt.)
This product
is 96.6%
recycle-able
when
properly
disposed of at
end of life.
Technical Specifications
least 70%
recycled
content.
Material Usage This product does not
contain any of the
following substances
in excess of regulatory
limits
(refer to the HP
General Specification
for the Environment at
http://www.hp.com/hp
info/globalcitizenship/
environment/pdf/gse.
pdf):
Asbestos
Certain Azo
Colorants
Certain
Brominated
Flame
Retardants –
may not be
used as flame
retardants in
plastics
Cadmium
Chlorinated
Hydrocarbons
Chlorinated
Paraffins
Formaldehyd
e
Halogenated
Diphenyl
Methanes
Lead
carbonates
and sulfates
Lead and Lead
compounds
Mercuric
Oxide
Batteries
Nickel –
finishes must
not be used
on the
external
Technical Specifications
surface
designed to
be frequently
handled or
carried by the
user.
Ozone
Depleting
Substances
Polybrominat
ed Biphenyls
(PBBs)
Polybrominat
ed Biphenyl
Ethers
(PBBEs)
Polybrominat
ed Biphenyl
Oxides
(PBBOs)
Polychlorinat
ed Biphenyl
(PCB)
Polychlorinat
ed Terphenyls
(PCT)
Polyvinyl
Chloride (PVC)
– except for
wires and
cables, and
certain retail
packaging has
been
voluntarily
removed from
most
applications.
Radioactive
Substances
Tributyl Tin
(TBT),
Triphenyl Tin
(TPT), Tributyl
Tin Oxide
(TBTO)
6.
Packaging Usage HP follows these
guidelines to decrease
the environmental
impact of product
Technical Specifications
packaging:
Eliminate the
use of heavy
metals such
as lead,
chromium,
mercury and
cadmium in
packaging
materials.
Eliminate the
use of ozone-
depleting
substances
(ODS) in
packaging
materials.
Design
packaging
materials for
ease of
disassembly.
Maximize the
use of post-
consumer
recycled
content
materials in
packaging
materials.
Use readily
recyclable
packaging
materials
such as paper
and
corrugated
materials.
Reduce size
and weight of
packages to
improve
transportatio
n fuel
efficiency.
Plastic
packaging
materials are
marked
according to
ISO 11469
Technical Specifications
and DIN
6120
standards.
Global Citizenship
Report
http://www.hp.com/hp
Technical Specifications
info/globalcitizenship/
gcreport/index.html
Eco-label certifications
http://www8.hp.com/
us/en/hp-
information/environm
ent/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hp
info/globalcitizenship/
environment/pdf/PC_G
BU_
Product_Design_ISO_1
4K_Certificate.pdf
and
http://www.hp.com/hp
info/globalcitizenship/
environment/pdf/cert.
pdf
COUNTRY OF ORIGIN
China
Summary of Changes
Summary of Changes
Copyright © 2016 HP Development Company, L.P. The information contained herein is subject to change without notice. The
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein.
Intel, Core, vPro and Celeron are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries.
Bluetooth is a trademark owned by its proprietor and used by Hewlett-Packard Company under license. Microsoft and Windows are
U.S. registered trademarks of the Microsoft group of companies. Adobe is a trademark of Adobe Systems Incorporated. ENERGY
STAR is a registered trademark owned by the U.S. Environmental Protection Agency.. For DTS patents, see http://patents.dts.com.
Manufactured under license from DTS Licensing Limited. DTS, the Symbol, & DTS and the Symbol together are registered
trademarks, and DTS Studio Sound is a trademark of DTS, Inc. © DTS, Inc. All Rights Reserved.
Summary of Changes