MRS1504T3G,

NRVS1504T3G

Surface Mount Standard

Recovery Power Rectifier
SMB Power Surface Mount Package
http://onsemi.com
Features mesa epitaxial construction with glass passivation. Ideally
suited for high frequency switching power supplies; free wheeling
diodes and polarity protection diodes. STANDARD RECOVERY
RECTIFIER
Features 1.5 AMPERES, 400 VOLTS
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Stable, High Temperature, Glass Passivated Junction
• AEC−Q101 Qualified and PPAP Capable
• NRVS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• All Packages are Pb-Free* SMB
CASE 403A
Mechanical Characteristics: PLASTIC
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in MARKING DIAGRAM
• Weight: 95 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable AYWW
RGG G
• Maximum Temperature of 260°C / 10 Seconds for Soldering G
• Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead
• ESD Ratings:
♦ Machine Model = C A = Assembly Location
♦ Human Body Model = 3A Y = Year
WW = Work Week
RGG = Device Code
G = Pb−Free Package
(Note: Microdot may be in either location)

ORDERING INFORMATION
Device Package Shipping†
MRS1504T3G SMB 2,500 /
(Pb−Free) Tape & Reel

NRVS1504T3G SMB 2,500 /

(Pb−Free) Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:

July, 2012 − Rev. 6 MRS1504T3/D
 MRS1504T3G, NRVS1504T3G

MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 400 V
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR
Average Rectified Forward Current IO A
(At Rated VR, TI = 118°C) 1.5

Peak Repetitive Forward Current IFRM A

(Rated VR, Square Wave, 20 kHz, TI = 118°C) 3.0

Non−Repetitive Peak Surge Current IFSM A

(Surge applied at rated load conditions, halfwave, single phase, 60 Hz) 50

Storage/Operating Case Temperature Range Tstg, TC −55 to 150 °C

Operating Temperature Range TJ −55 to 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance, Junction−to−Lead (Note 1) Rtjl 18 °C/W
Thermal Resistance, Junction−to−Ambient (on 1″ sq. Cu. PCB pattern) Rtja 79 °C/W
1. Minimum pad size.

ELECTRICAL CHARACTERISTICS
Rating Symbol TJ = 25_C TJ = 100_C Unit
Maximum Instantaneous Forward Voltage (Note 2), see Figure 2 VF V
(IF = 1.5 A) 1.04 0.96
(IF = 2.25 A) 1.10 1.02
Maximum Instantaneous Reverse Current, see Figure 4 IR mA
(VR = 400 V) 1.0 340
(VR = 200 V) 0.5 180

2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%

http://onsemi.com
2
 MRS1504T3G, NRVS1504T3G

100
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)

IF, INSTANTANEOUS FORWARD CURRENT (AMPS)

100 100

10 10

TJ = 100°C
TJ = 100°C
TJ = 150°C
1.0 1.0 TJ = 150°C
TJ = 25°C
TJ = 25°C
TJ = -40°C
0.1 0.1
0.6 0.8 1.0 1.2 1.4 1.6 0.6 0.8 1.0 1.2 1.4 1.6
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

100E-6 10E-3

I R, MAXIMUM REVERSE CURRENT (AMPS)

TJ = 150°C
1.0E-3
I R, REVERSE CURRENT (AMPS)

10E-6 TJ = 150°C
TJ = 100°C TJ = 100°C
100E-6
1.0E-6
10E-6
100E-9
1.0E-6
TJ = 25°C
TJ = 25°C
10E-9
100E-9

1.0E-9 10E-9
0 100 200 300 400 0 100 200 300 400
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current

2.5 2.5
I O , AVERAGE FORWARD CURRENT (AMPS)

FREQ = 20 kHz
PFO , AVERAGE POWER DISSIPATION (WATTS)

dc
dc
2.0 2.0 SQUARE WAVE
SQUARE WAVE Ipk/Io = p
1.5 1.5 Ipk/Io = 5
Ipk/Io = p
Ipk/Io = 10
Ipk/Io = 5
1.0 1.0
Ipk/Io = 10 Ipk/Io = 20

0.5 Ipk/Io = 20 0.5

0 0
0 20 40 60 80 100 120 140 160 0 0.5 1.0 1.5 2.0 2.5
TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating Figure 6. Forward Power Dissipation

http://onsemi.com
3
 MRS1504T3G, NRVS1504T3G

100
TJ = 25°C

C, CAPACITANCE (pF)
10

1.0
0 10 20 30 40 50 60 70 80
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED

1.0
50%
20%
10%
0.1
5.0%
2.0%

1.0%
0.01

Rtjl(t) = Rtjl*r(t)

0.001
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100
T, TIME (s)
Figure 8. Thermal Response, Junction−to−Lead
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)

1.0

50%

20%
0.1
10%

5.0%

2.0%
0.01
1.0%
Rtjl(t) = Rtjl*r(t)

0.001
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000
T, TIME (s)
Figure 9. Thermal Response, Junction−to−Ambient

http://onsemi.com
4
 MRS1504T3G, NRVS1504T3G

PACKAGE DIMENSIONS

SMB
CASE 403A−03
ISSUE J

HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
E 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.

MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A 1.95 2.30 2.47 0.077 0.091 0.097
b D A1 0.05 0.10 0.20 0.002 0.004 0.008
b 1.96 2.03 2.20 0.077 0.080 0.087
c 0.15 0.23 0.31 0.006 0.009 0.012
D 3.30 3.56 3.95 0.130 0.140 0.156
E 4.06 4.32 4.60 0.160 0.170 0.181
POLARITY INDICATOR HE 5.21 5.44 5.60 0.205 0.214 0.220
OPTIONAL AS NEEDED
L 0.76 1.02 1.60 0.030 0.040 0.063
L1 0.51 REF 0.020 REF

A1
L L1 c

SOLDERING FOOTPRINT*

2.261
0.089

2.743
0.108

2.159
0.085 SCALE 8:1 ǒinches
mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local
Email: [email protected] Phone: 81−3−5817−1050 Sales Representative

http://onsemi.com MRS1504T3/D
5