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IC Purchase Specifications

This document outlines specifications for purchasing integrated circuits (ICs). It specifies that ICs will include general purpose types like amplifiers and logic gates as well as memory and radio frequency ICs. Parameters like part number, package, and manufacturer will be as stated on the purchase order. Suppliers must submit test certificates on a quarterly basis and for the first two deliveries to verify specifications. ICs must be packaged according to quantity, with tape and reel for surface mount devices meeting minimum order quantities and corrugated boxes for other types. Package markings will identify part numbers and quantities. The document history notes revisions to the characteristics section.

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Yogesh Kumar
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141 views2 pages

IC Purchase Specifications

This document outlines specifications for purchasing integrated circuits (ICs). It specifies that ICs will include general purpose types like amplifiers and logic gates as well as memory and radio frequency ICs. Parameters like part number, package, and manufacturer will be as stated on the purchase order. Suppliers must submit test certificates on a quarterly basis and for the first two deliveries to verify specifications. ICs must be packaged according to quantity, with tape and reel for surface mount devices meeting minimum order quantities and corrugated boxes for other types. Package markings will identify part numbers and quantities. The document history notes revisions to the characteristics section.

Uploaded by

Yogesh Kumar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Purchase Material Specification

IC’s
1. SPECIFICATION OF THE PRODUCT

Component is used to repair customer unit.

2. CHARACTERISTICS

2.1 General IC – Amplifiers, Digital gate, Counters, Flip flop, Comparators, Trans receiver,
Clock distributors, Buffers, PWM.

No Parameter Unit Specification

Part No. As per Purchase Order


1
Package As per Purchase Order
2
Manufacturer As per Purchase Order
3

2.2 Memory IC- RAM, ROM, NVRAM.

No Parameter Unit Specification

Part No. As per Purchase Order


1
Package As per Purchase Order
2
Manufacturer As per Purchase Order
3

2.3 RF IC -LNB, Amplifier, Mixer, RF Relays, Attenuation, Filters.

No Parameter Unit Specification

Part No. As per Purchase Order


1
Package As per Purchase Order
2
Manufacturer As per Purchase Order
3

3 TEST CERTIFICATE

Supplier will submit test certificate (Self attested or Manufacturer) of the above parameter for the product conformity on
Quarterly basis as well as first two supplies.

4 WAY OF DELIVERY

4.1 Packing
All types of IC’s must be pack at the time of supply as per table given below: -

Quantity Packing type


For SMD IC, If MOQ met Original Tape & Reel
For remaining type, if MOQ met Original corrugate box pack
If MOQ not met or less quantity Packed in corrugate box

Prepared By: Shammi sundle Doc. No: PS/RD/06 Rev.No.:1.1


Page 1 of 2
Approved By : Sudhir Kumar Issued By : Mohit Mohan Date:10-03-2017
Purchase Material Specification
IC’s
4.2 Markings

Information about part no. & quantity must be display with temporary paper sticker on side of each bundle
at defined in point no. 4.1

5. AMENDMENT RECORD:

Revision Revision Approved By


Sr. No Revised Clause
No Date Brief Description of Revision
Prafull Moon
1. 1.0 17-09-2016 - New Document release

2. 1.1 10-03-2017 2- characteristics characteristics parameter updated Sudhir Kumar

Prepared By: Shammi sundle Doc. No: PS/RD/06 Rev.No.:1.1


Page 2 of 2
Approved By : Sudhir Kumar Issued By : Mohit Mohan Date:10-03-2017

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