Description Features: 100Mhz Current Feedback Video Amplifier With Disable
Description Features: 100Mhz Current Feedback Video Amplifier With Disable
Features Description
• This Circuit is Processed in Accordance to MIL-STD- The HA-5020/883 is a wide bandwidth, high slew rate
883 and is Fully Conformant Under the Provisions of amplifier optimized for video applications and gains between
Paragraph 1.2.1. 1 and 10. Manufactured on Intersil’s Reduced Feature
Complementary Bipolar DI process, this amplifier uses cur-
• Wide Unity Gain Bandwidth . . . . . . . . . . 105MHz (Min)
rent mode feedback to maintain higher bandwidth at a given
• Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800V/µs gain than conventional voltage feedback amplifiers. Since it
is a closed loop device, the HA-5020/883 offers better gain
• Output Current . . . . . . . . . . . . . . . . . . . . . . ±30mA (Min)
accuracy and lower distortion than open loop buffers.
• Drives 3.5V into 75Ω The HA-5020/883 features low differential gain and phase and
• Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . 0.025% will drive two double terminated 75Ω coax cables to video
levels with low distortion. Adding a gain flatness performance
• Differential Phase. . . . . . . . . . . . . . . . . . . . . . .0.025 Deg of 0.1dB makes this amplifier ideal for demanding video
• Low Input Noise Voltage . . . . . . . . . . . . . . . . 4.5nV/√Hz applications. The bandwidth and slew rate of the HA-5020/
883 are relatively independent of closed loop gain. The
• Low Supply Current. . . . . . . . . . . . . . . . . . . 10mA (Max) 105MHz unity gain bandwidth only decreases to 77MHz at a
• Wide Supply Range . . . . . . . . . . . . . . . . . . . ±5V to ±15V gain of 10. The HA-5020/883 used in place of a conventional
op amp will yield a significant improvement in the speed
• Output Enable/Disable power product. To further reduce power, the HA-5020/883 has
• High Performance Replacement for EL2020/883 a disable function which significantly reduces supply current,
while forcing the output to a true high impedance state. This
allows the outputs of multiple amplifiers to be wire-OR’d into
Applications multiplexer configurations. The device also includes output
• Unity Gain Video/Wideband Buffer short circuit protection and output offset voltage adjustment.
Pinouts
HA-5020/883 HA-5020/883
(CERDIP) (CLCC)
TOP VIEW TOP VIEW
DISABLE
BAL 1 8 DISABLE
BAL
NC
NC
NC
-IN 2 - 7 V+ 3 2 1 20 19
+
+IN 3 6 OUT NC 4 18 NC
V- 4 5 BAL NC 5 17 NC
-IN 6 - 16 V+
+
NC 7 15 NC
+IN 8 14 OUT
9 10 11 12 13
V-
NC
NC
BAL
NC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. Spec Number 511080-883
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
3-94 File Number 3541.2
Specifications HA-5020/883
Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC VINCM ≤ 1/2(V+ - V-) RF = 1kΩ
Operating Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . ±5V to ±15V RL ≥ 400Ω VDISABLE = V+ or 0V
Device Tested at: Supply Voltage = ±15V, RSOURCE = 0Ω, AVCL = +1, RF = 1kΩ, RLOAD = 400Ω, VOUT = 0V, VDISABLE = V+,
Unless Otherwise Specified.
LIMITS
GROUP A
PARAMETERS SYMBOL CONDITIONS SUBGROUP TEMPERATURE MIN MAX UNITS
Input Offset Voltage VIO VCM = 0V 1 +25oC -8 8 mV
2, 3 +125oC, -55oC -10 10 mV
Common Mode +CMRR ∆VCM = +10V, V+ = 5V, 1 +25oC 60 - dB
Rejection Ratio V- = -25V
2, 3 +125oC, -55oC 50 - dB
-CMRR ∆VCM = -10V, V+ = 25V, 1 +25oC 60 - dB
V- = -5V
2, 3 +125oC, -55oC 50 - dB
Power Supply Rejection +PSRR ∆VSUP = 13.5V, 1 +25oC 64 - dB
Ratio V+ = 4.5V, V- = -15V;
2, 3 +125oC, -55oC 60 - dB
V+ = 18V, V- = -15V
-PSRR ∆VSUP = 13.5V, 1 +25oC 64 - dB
V+ = 15V, V- = -4.5V;
2, 3 +125oC, -55oC 60 - dB
V+ = 15V, V- = -18V
Non-Inverting (+IN) IBP VCM = 0V 1 +25oC -8 8 µA
Current
2, 3 +125oC, -55oC -20 20 µA
+IN Common Mode IBPCMP ∆VCM = +10V, V+ = 5V, 1 +25oC - 0.1 µA/V
Rejection V- = -25V
2, 3 +125oC, -55oC - 0.5 µA/V
IBPCMN ∆VCM = -10V, V+ = 25V, 1 +25oC - 0.1 µA/V
V- = -5V
2, 3 +125oC, -55oC - 0.5 µA/V
Non-Inverting (+IN) Input +RIN Calculated 1/IBPCMP 1 +25oC 10 - MΩ
Impedance
2, 3 +125oC, -55oC 2 - MΩ
+IN Power Supply IBPPSP ∆VSUP = 13.5V, 1 +25oC - 0.06 µA/V
Rejection V+ = 4.5V, V- = -15V;
2, 3 +125oC, -55oC - 0.2 µA/V
V+ = 18V, V- = -15V
IBPPSN ∆VSUP = 13.5V, 1 +25oC - 0.06 µA/V
V+ = 15V, V- = -4.5V;
2, 3 +125oC, -55oC - 0.2 µA/V
V+ = 15V, V- = -18V
Inverting Input (-IN) IBN VCM = 0V 1 +25oC -20 20 µA
Current
2, 3 +125oC, -55oC -50 50 µA
LIMITS
GROUP A
PARAMETERS SYMBOL CONDITIONS SUBGROUP TEMPERATURE MIN MAX UNITS
-IN Common Mode IBNCMP ∆VCM = +10V, V+ = 5V, 1 +25oC - 0.4 µA/V
Rejection V- = -25V
2, 3 +125oC, -55oC - 0.5 µA/V
IBNCMN ∆VCM = -10V, V+ = 25V, 1 +25oC - 0.4 µA/V
V- = -5V
2, 3 +125oC, -55oC - 0.5 µA/V
-IN Power Supply IBNPSP ∆VSUP = 13.5V, 1 +25 Co
- 0.2 µA/V
Rejection V+ = 4.5V, V- = -15V;
2, 3 +125oC, -55oC - 0.5 µA/V
V+ = 18V, V- = -15V
IBNPSN ∆VSUP = 13.5V, 1 +25oC - 0.2 µA/V
V+ = 15V, V- = -4.5V;
2, 3 o
+125 C, -55 Co
- 0.5 µA/V
V+ = 15V, V- = -18V
Common Mode Range +CMR V+ = 5V, V- = -25V 1 +25oC 10 - V
2, 3 +125oC, -55oC 10 - V
-CMR V+ = 25V, V- = -5V 1 +25oC - -10 V
2, 3 +125oC, -55oC - -10 V
Transimpedance +AZOL1 RL = 400Ω, VOUT = 0 to 1 +25oC 1 - MΩ
10V
2, 3 +125oC, -55oC 1 - MΩ
-AZOL1 RL = 400Ω, VOUT = 0 to 1 +25oC 1 - MΩ
-10V
2, 3 +125oC, -55oC 1 - MΩ
Output Voltage Swing +VOUT VIN = 12.8V 1, 2 +25oC, +125oC 12 - V
3 -55oC 11 - V
-VOUT VIN = -12.8V 1, 2 +25oC, +125oC - -12 V
3 -55oC - -11 V
+VOUT5 V+ = 5V, V- = -5V, 1 +25oC 2 - V
VIN = 3V
2, 3 +125oC, -55oC 2 - V
-VOUT5 V+ = 5V, V- = -5V, 1 +25oC - -2 V
VIN = -3V
2, 3 +125oC, -55oC - -2 V
Output Current +IOUT Note 1 1, 2 +25oC, +125oC 30 - mA
3 -55oC 27.5 - mA
-IOUT Note 1 1, 2 +25oC, +125oC - -30 mA
3 -55oC - -27.5 mA
Short Circuit Output +ISC RL = Open, VIN = 10V 1 +25oC 50 - mA
Current
2, 3 +125oC, -55oC 50 - mA
-ISC RL = Open, VIN = -10V 1 +25oC - -50 mA
2, 3 +125oC, -55oC - -50 mA
Disabled Output Current +ILEAK VIN = 0V, VOUT = +10V, 1 +25oC -1 1 µA
RL = Open, VDIS = 0V
3 -55oC -1 1 µA
VIN = 2V 2 +125oC -1 1 µA
-ILEAK VIN = 0V, VOUT = -10V, 1 +25oC -1 1 µA
RL = Open, VDIS = 0V
3 -55oC -1 1 µA
VIN = -2V 2 +125oC -1 1 µA
LIMITS
GROUP A
PARAMETERS SYMBOL CONDITIONS SUBGROUP TEMPERATURE MIN MAX UNITS
Disable Pin Input Current ILOGIC VDIS = 0V 1, 2 +25oC, +125oC -1 0 mA
3 -55oC -1.5 0 mA
Minimum DISABLE Pin IDIS Note 2 1 +25oC - 350 µA
Current to Disable
2, 3 +125oC, -55oC - 350 µA
Maximum DISABLE Pin IEN Note 3 1 +25 Co
20 - µA
Current to Enable
2, 3 +125oC, -55oC 20 - µA
Quiescent Power Supply ICC RL = 400Ω 1 +25oC - 10 mA
Current o o
2, 3 +125 C, -55 C - 10 mA
IEE RL = 400Ω 1 +25oC -10 - mA
2, 3 +125oC, -55oC -10 - mA
Disabled Power Supply ICCDIS RL = 400Ω, VDIS = 0V 1 +25oC - 5.6 mA
Current
2, 3 +125oC, -55oC - 7.5 mA
IEEDIS RL = 400Ω, VDIS = 0V 1 +25oC -5.6 - mA
2, 3 +125oC, -55oC -7.5 - mA
Offset Voltage +VADJ Note 4 1 +25oC 30 - mV
Adjustment
2, 3 +125oC, -55oC 25 - mV
-VADJ Note 4 1 +25oC - -30 mV
2, 3 +125oC, -55oC - -25 mV
NOTES:
1. Guaranteed from VOUT test by IOUT = VOUT/400Ω.
2. This is the minimum current which must be sourced from the DISABLE pin, to disable the output. The output is considered disabled when
VOUT ≤ 10mV. Conditions are: VIN = 10V, RL = 100Ω. The test is performed by sourcing 350µA from the DISABLE pin, and testing that
the output decreases below the test limit (10mV).
3. This is the maximum current that can be sourced from the DISABLE pin with the device remaining enabled. The device is considered
disabled when the supply current decreases by at least 0.5mA. Conditions are: RL = 400Ω. Test is performed by sourcing 20µA from the
DISABLE pin, and testing that the supply current decreases by no more than the test limit (0.5mA).
4. The offset adjustment range is referred to the output. The inverting input current (-IBIAS) can be adjusted with an external pot between pins
1 and 5, wiper connected to V+. Since -IBIAS flows through RF , an adjustment of offset voltage results. The amount of offset adjustment is
proportional to the value of RF . Test conditions are: RL = Open, 10kΩ from pin 5 to V+, 1kΩ from pin 1 to V+, for +VADJ; RL = Open, 1kΩ
from pin 5 to V+, 10kΩ from pin 1 to V+, for -VADJ.
Device Tested at: Supply Voltage = ±15V, RSOURCE = 50Ω, RLOAD = 400Ω, CLOAD ≤ 10pF, AVCL = +1V/V, Unless Otherwise Specified.
LIMITS
GROUP A
PARAMETERS SYMBOL CONDITIONS SUBGROUP TEMPERATURE MIN MAX UNITS
Slew Rate +SR VIN = -10V to +10V 4 +25oC 600 - V/µs
5, 6 +125oC, -55oC 400 - V/µs
-SR VIN = +10V to -10V 4 +25oC 600 - V/µs
5, 6 +125oC, -55oC 400 - V/µs
Device Characterized at: Supply Voltage = ±15V, RSOURCE = 50Ω, RLOAD = 400Ω, RF = 1kΩ, VDISABLE = V+, CLOAD ≤ 10pF, AVCL = +1V/V,
Unless Otherwise Specified.
LIMITS
NOTES:
1. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These param-
eters are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by characterization
based upon data from multiple production runs which reflect lot to lot and within lot variation.
2. Measured from 10% to 90% of the output waveform.
3. Measured from 90% to 10% of the output waveform.
4. Measured from 25% to 75% of the output waveform.
5. Measured from 75% to 25% of the output waveform.
6. DISABLE = +15V to 0V. Measured from the 50% of DISABLE to VOUT = ±200mV.
7. DISABLE = 0V to +15V. Measured from the 50% of DISABLE to VOUT = ±1.8V.
NOTE:
1. PDA applies to Subgroup 1 only.
Die Characteristics
DIE DIMENSIONS:
65 x 60 x 19 mils ± 1 mils
1640µm x 1520µm x 483µm ± 25.4µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
WORST CASE CURRENT DENSITY:
5.77 x 104 A/cm2 at 30mA
SUBSTRATE POTENTIAL (Powered Up): V-
GLASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1kÅ
TRANSISTOR COUNT: 62
PROCESS: Bipolar Dielectric Isolation
BAL DISABLE V+
-IN 2 1 8 7
6 OUT
+IN 3 4 5
V- BAL
K10 1K
10K
V+
ICC 10 0.1
VY
500 -IBIAS =
1K 100K
(0.01%) -
0.1 VY
+
x100
VX 7
VIO = 500 1
100 2 5
- 1K
- 6
VX 0.1 500 DUT VOUT
+ K7 3
x100 +
8 400 100
200pF 150pF 4
K12
200K (0.1%) K1
VZ K3 K4
+IBIAS =
200K
VZ - 10 0.1
+ VDISABLE
HA-5177
Test Waveforms
SIMPLIFIED TEST CIRCUIT FOR LARGE AND SMALL SIGNAL PULSE RESPONSE (Applies to Tables 2 and 3)
AV = +1 TEST CIRCUIT AV = +10 TEST CIRCUIT
V+ V+
VDISABLE VDISABLE
VIN + VIN +
VOUT VOUT
- RS -
RS RF
50Ω RL CL RL 50Ω 360Ω
1kΩ RG
V- V- 40Ω
V+
VDISABLE
VIN + VOUT
-
RF CL RL
1kΩ
V-
VDISABLE VDISABLE
+15V +15V +15V +15V
0V 0V 0V 0V
VOUT VOUT
+2V +2V 0V 0V
90% 90%
10% 10%
0V 0V -2V -2V
+tDIS +tEN -tDIS -tEN
Burn-In Circuits
HA7-5020/883 CERAMIC DIP
R3
1 8
R1
2 - 7 V+
R2
+ C1 D1
3 6
V- 4 5
D2 C2
Schematic Diagram
BAL BAL
V+
5Ibn
VDISABLE
OUT
+IN -IN +1
IREF
5Ibp
V-
Packaging
c1 LEAD FINISH
F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A)
-A- -D- 8 LEAD DUAL-IN-LINE FRIT-SEAL CERAMIC PACKAGE
BASE (c)
INCHES MILLIMETERS
METAL
E SYMBOL MIN MAX MIN MAX NOTES
b1 A - 0.200 - 5.08 -
M M
-B- b 0.014 0.026 0.36 0.66 2
(b)
b1 0.014 0.023 0.36 0.58 3
SECTION A-A
bbb S C A-B S D S b2 0.045 0.065 1.14 1.65 -
D b3 0.023 0.045 0.58 1.14 4
BASE
PLANE Q c 0.008 0.018 0.20 0.46 2
-C- A
SEATING c1 0.008 0.015 0.20 0.38 3
PLANE L α D - 0.405 - 10.29 5
S1 eA E 0.220 0.310 5.59 7.87 5
A A
b2 e 0.100 BSC 2.54 BSC -
b e eA/2 c eA 0.300 BSC 7.62 BSC -
ccc M C A-B S D S aaa M C A - B S D S eA/2 0.150 BSC 3.81 BSC -
L 0.125 0.200 3.18 5.08 -
Q 0.015 0.060 0.38 1.52 6
NOTES:
S1 0.005 - 0.13 - 7
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded S2 0.005 - 0.13 - -
area shown. The manufacturer’s identification shall not be used α 90o 105o 90o 105o -
as a pin one identification mark. aaa - 0.015 - 0.38 -
2. The maximum limits of lead dimensions b and c or M shall be bbb - 0.030 - 0.76 -
measured at the centroid of the finished lead surfaces, when ccc - 0.010 - 0.25 -
solder dip or tin plate lead finish is applied.
M - 0.0015 - 0.038 2
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
N 8 8 8
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b1.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling Dimension: Inch.
11. Lead Finish: Type A.
12. Materials: Compliant to MIL-M-38510.
Packaging (Continued)
D
J20.A MIL-STD-1835 CQCC1-N20 (C-2)
20 PAD METAL SEAL LEADLESS CERAMIC CHIP CARRIER
D3
INCHES MILLIMETERS
jx 45o
SYMBOL MIN MAX MIN MAX NOTES
A 0.060 0.100 1.52 2.54 6, 7
A1 0.050 0.088 1.27 2.23 7
B - - - - 4
B1 0.022 0.028 0.56 0.71 2, 4
E3 E
B B2 0.072 REF 1.83 REF -
B3 0.006 0.022 0.15 0.56 -
D 0.342 0.358 8.69 9.09 -
D1 0.200 BSC 5.08 BSC -
D2 0.100 BSC 2.54 BSC -
h x 45o D3 - 0.358 - 9.09 2
E 0.342 0.358 8.69 9.09 -
E1 0.200 BSC 5.08 BSC -
A A1 E2 0.100 BSC 2.54 BSC -
E3 - 0.358 - 9.09 2
PLANE 2 e 0.050 BSC 1.27 BSC -
e1 0.015 - 0.38 - 2
PLANE 1
h 0.040 REF 1.02 REF 5
j 0.020 REF 0.51 REF 5
L 0.045 0.055 1.14 1.40 -
L3
L e L1 0.045 0.055 1.14 1.40 -
L2 0.075 0.095 1.90 2.41 -
L3 0.003 0.015 0.08 0.38 -
ND 5 5 3
NE 5 5 3
N 20 20 3
B1 B3
E1 NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
E2 L2 and extend toward plane 2 across at least two layers of ceramic
B2 or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specified, a minimum clearance of 0.015 inch
L1
(0.381mm) shall be maintained between all metallized features
D2
(e.g., lid, castellations, terminals, thermal pads, etc.)
e1
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
D1
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals
shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Maximum limits allows for 0.007 inch solder thickness on pads.
8. Lead Finish: Type A.
9. Materials: Compliant to MIL-M-38510.
The information contained in this section has been developed through characterization by Harris Semiconductor and is for use as application
and design information only. No guarantee is implied.
Typical Performance Curves VSUPPLY = ±15V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = +25oC, Unless Otherwise Specified
2.0
-0.5 1.8
BIAS CURRENT (µA)
VSUPPLY = ±4.5V
-2.0 1.2
VSUPPLY = ±4.5V
-2.5 1.0
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (oC) TEMPERATURE (oC)
Typical Performance Curves VSUPPLY = ±15V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = +25oC, Unless Otherwise Specified
+125oC
5 VSUPPLY = ±15V 7
1
-60 -40 -20 0 20 40 60 80 100 120 140 3 5 7 9 11 13 15
TEMPERATURE (oC) SUPPLY VOLTAGE (±V)
5
+25oC 6
4 5
+125oC
3 4
3
2
2
1
1
0 0
3 5 7 9 11 13 15 1 3 5 7 9 11 13 15
SUPPLY VOLTAGE (±V) DISABLE INPUT VOLTAGE (V)
-10 DISABLE = 0V
OUTPUT LEAKAGE CURRENT (µA)
VIN = 5Vp-p
-20 RF = 750Ω 0.5 VOUT = +10V
FEEDTHROUGH (dB)
-30
-40 0
VOUT = -10V
-50
-60 -0.5
-70
-80 -1.0
0 2 4 6 8 10 12 14 16 18 20 -60 -40 -20 0 20 40 60 80 100 120 140
FREQUENCY (MHz) TEMPERATURE (oC)
Typical Performance Curves VSUPPLY = ±15V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = +25oC, Unless Otherwise Specified
1.4 14 0 AV = +1
1.2 12 -1
1.0 10 -2
ENABLE TIME
0.8 8 -3 AV = +2
0.6 6 -4
0.4 DISABLE TIME 4 -5 AV = +6
0.2 2 -6 AV = +10
0.0 0 -7
-10 -8 -6 -4 -2 0 2 4 6 8 10 0 24 48 72 96 120
OUTPUT VOLTAGE (V) FREQUENCY (MHz)
RF = 750Ω AV = -2
-1 AV = -1 +45 +90
AV = -6
-2 0 +45
AV = -10
-3 AV = -2 -45 0
-4 -90 -45
-5 -135 AV = +1 -90
AV = -6 AV = +2
-6 AV = -10 -180 -135
AV = +6
-7 -225 -180
AV = +10
-8 -270
0 24 48 72 96 120 0 24 48 72 96 120
FREQUENCY (MHz) FREQUENCY (MHz)
BANDWIDTH AND GAIN PEAKING vs LOAD RESISTANCE BANDWIDTH AND GAIN PEAKING vs FEEDBACK RESISTANCE
110 5 105 20
CL = 10pF CL = 10pF
-3dB BANDWIDTH
VOUT = 0.2Vp-p VOUT = 0.2Vp-p
100 4
-3dB BANDWIDTH (MHz)
-3dB BANDWIDTH (MHz)
100 15
GAIN PEAKING (dB)
GAIN PEAKING (dB)
-3dB BANDWIDTH
90 3
GAIN PEAKING
95 10
80 2
90 5
70 1
GAIN PEAKING
60 0 85 0
0 200 400 600 800 1000 700 900 1.1K 1.3K 1.5K
LOAD RESISTANCE (Ω) FEEDBACK RESISTOR (Ω)
Typical Performance Curves VSUPPLY = ±15V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = +25oC, Unless Otherwise Specified
95 15
-3dB BANDWIDTH 50
90 10
40
85 5 30
GAIN PEAKING
20
80 0 10
400 600 800 1.0K 1.2K 200 400 600 800 1000
FEEDBACK RESISTOR (Ω) FEEDBACK RESISTOR (Ω)
-10 AV = +10
70 -20
REJECTION RATIO (dB)
-30
PSRR
-40
65
-50
CMRR
-60
60 CMRR +PSRR
-70
-PSRR
-80
55
-60 -40 -20 0 20 40 60 80 100 120 140 -90
10K 100K 1M 10M
TEMPERATURE (oC) FREQUENCY (Hz)
25
3.0
VSUPPLY = ±10V
20
VSUPPLY = ±10V
2.5 15
VSUPPLY = ±4.5V 10
2.0
VSUPPLY = ±4.5V
5
1.5
-60 -40 -20 0 20 40 60 80 100 120 140 0
10 100 1K 10K
TEMPERATURE (oC) LOAD RESISTANCE (Ω)
Typical Performance Curves VSUPPLY = ±15V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = +25oC, Unless Otherwise Specified
90
80
-ISC IN
70
+ISC
60
50
OUT
40
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (oC)
7.0
PROPAGATION DELAY (ns)
6.5
IN RLOAD = 100Ω
VOUT = 1Vp-p
6.0
5.5
5.0
OUT -60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (oC)
Typical Performance Curves VSUPPLY = ±15V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = +25oC, Unless Otherwise Specified
AV = +2
OVERSHOOT (%)
9.0 10
AV = +1
8.0
AV = +2 VSUPPLY = ±15V
7.0 5
AV = +1
RLOAD = 100Ω AV = +1
6.0 VOUT = 1Vp-p
AV = +2
0
5.0
3 5 7 9 11 13 15 0 200 400 600 800 1000
SUPPLY VOLTAGE (±V) LOAD RESISTANCE (Ω)
0.06
VOUT = 20Vp-p
RLOAD = 75Ω 1000
SLEW RATE (V/µs)
0.05
+SLEW RATE
0.04
-SLEW RATE
RLOAD = 150Ω 800
0.03
0.02
RLOAD = 1K
0.01 600
3 5 7 9 11 13 15 -60 -40 -20 0 20 40 60 80 100 120 140
SUPPLY VOLTAGE (±V) TEMPERATURE (oC)
Device Characterized at: Supply Voltage = ±15V, RF = 1kΩ, AV = +1V/V, RL = 400Ω, CL ≤ 10pF, VDISABLE = V+, Unless Otherwise Specified
DESIGN
PARAMETERS CONDITIONS TEMPERATURE TYPICAL LIMIT UNITS
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com