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Engineering Exam Study Guide

This document contains definitions and descriptions of various electrical and electronics terms related to sensors, materials, circuits, components, and applications. Some key terms discussed include spread resistance sensors, Wagner grounding, potentiometers, defects in materials, welding techniques, integrated circuit manufacturing processes, and types of motors and power supplies. The document provides an overview of a wide range of electrical engineering concepts and components.

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0% found this document useful (0 votes)
102 views2 pages

Engineering Exam Study Guide

This document contains definitions and descriptions of various electrical and electronics terms related to sensors, materials, circuits, components, and applications. Some key terms discussed include spread resistance sensors, Wagner grounding, potentiometers, defects in materials, welding techniques, integrated circuit manufacturing processes, and types of motors and power supplies. The document provides an overview of a wide range of electrical engineering concepts and components.

Uploaded by

stardust
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOC, PDF, TXT or read online on Scribd

 Spreading Resistance Sensor  Ramsauer Effect – absorption of  99.

5% aluminum – 63 %
(SRS) - sensor that detects slow moving electron by conductivity
change in resistance in extrinsic intervening matter  660V – earthly ground
semiconductor.  Bravais Lattice- lattice in which  3.3kV-11kV – resistance ground
 Wagner Grounding – reduce the the lattice points are only shown in  Solar cell – also called as
stray capacitance and capacitance the crystal photovoltaic cell
between bridge arm by grounding.  Frenkel Defect – missing atom  Selenium –photocells and has 1V
 Linear Taper potentiometer – a and relocation of the atom in voltage drop
meter sensitivity control in a test interstitial place in which atom  Shielding or grounding –
instrument. must not be placed elimination of stray capacitance
 LogarithmicTaper Potentiometer  Vacancy defect – absence of an  Switch Mode Power Supply
– a volume control in a stereo atom (SMPS) – most efficient power
compact disc player.  Schering Bridge – AC bridge use supply (10kHz – 40kHz)
 100 Hz – uses magnet as oscillator to measure capacitor  Hopkinson – 2 identical shunt
 Corona – maximum at  Heaviside bridge – measure motor
transmission lines mutual inductance  Mercury Lag – retardation or
 Caryon- can not be used as  Geometry – distance between, delay response in the system
magnet features of IC, distance of features  Compton Camera – imaging of
 Die cast – can not be used in a 2 and 3 µm positron emitter using multiple
processing monolithic IC  Selsyn – indicating device layer of silicon detector
 Transistor Outline (TO) Package orientation of object  Schmitt Trigger – comparator with
– earlier experience in transistors  Shielded metal Arc Welding – hysteresis
 F.T. Bacon - introduce the first heat generated melts the tip  Cyclo converter – AC voltage
fuel battery in 1959  Arc Welding – not resistance frequency converter from one form
 Class F Motors – operates at welding to another
155°C  Electron – Beam Welding – used  LED – Voltage: 1.6, Current: 25mA
 Class B Motors – operates at in vacuum welding  Wien Bridge - measure AC
130°C  Pressure Welding – atom to atom frequency and capacitor with
 Cache memory – stores the bond on surface with oxide free greater accuracy (0.5% - 1%)
frequently used data surface  Polyphase motor – used in large
 Magnetic Disc – faster in retrieval  Swinburnes – most economical, lead application
and storage compared to magnetic convenient way to determine no  Typical value of CMRR: 100-
tape load losses in large dc shunt motor 100,000 & 40-80 dB
 Hysteresis – increases noise  Pure unrealed silver –  Surge resistance of cables: 50Ω
immunity in op-amp conductivity is 108.8%  1 µm – distance between
 99.9% gold – 72.6% conductivity components in an advance IC

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 2 µm – 3 µm – distance between  Gimmick Capacitance – small because it can with stand large
components in a normal IC capacitance generated when overload
 Stack memory – uses LIFO twisting 2 insulated wires  Timing Marker Generator –
 Skin effect – seen at high  Digital IC – discrete converting sine wave to series of
frequencies  Analog IC – linear pulses
 Program Counter – indicates the  False triggering – dV/dt effect in  Regulator IC alone – current
address of next instruction SCR regulator alone
 Einstein Relation – drift current is  Local Hot Spot – di/dt effect in  Duty Cycle (D) for Buck
directly proportional to mobility, SCR
diffusion is directly proportional to  Prescaler Circuit – divides the HF D =V2/ V1
concentration of diffusion signal so that a low frequency  Duty Cycle (D) for Buck
 Inverter – an AC-DC converter counter would be able to display
 Semiconverter – use controlled the operating frequency (D-1) =V1/ V2
devices  Quantum Detector – responds to
 Gold doping – reduces storage the variation in incident photon  Duty Cycle (D) for Buck - Boost
time  Tank ckt. – anti-resonant circuit D =V2/ (V2 + V1)
 Weston cell – use as voltage  MMIC – Impedance: 50Ω, Noise
reference 3.5 to 6 dB  Buck – Boost continuously:
 Ringing ckt. – RLC that produces  TTL – 5V power supply, input
nearly undamped oscillation threshold is half the power supply L =((1-D)2DRL)/2FS
 Fuzzy logic – absolutely false,  FETVM – draws less current from
neutral, absolutely true the circuit under test
 Trilogic – false, neutral, true  Optoisolator – provides very high
 Monolithic – active and passive electrical isolation between control
devices fabricated in one process, ckt and power ckt, has high
most used in a AC because it is impedance between light source
more compact and phototransistor
 Film IC – deposited  5.6V zener has the best
 Thin Film IC– sputtering, ceramic temperature stability
substrate  Bolometer - used to measure
 Thick Film IC – alumina substrate variations by the changing metallic
 Hay Bridge – measures resistance
inductance with large phase angle  Thermistor – most common
 Anderson bridge – improvised bolometric device
Wein – bridge  DC motor and stepper motor –
are mostly used in robot than AC
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