Surface-mount technology

An SMT component is usually smaller than its through-

hole counterpart because it has either smaller leads or no
leads at all. It may have short pins or leads of various
styles, at contacts, a matrix of solder balls (BGAs), or
terminations on the body of the component.

1 History
Surface mounting was originally called planar
mounting.[1]
Surface-mount technology was developed in the 1960s
and became widely used in the late 1980s. Much of the
pioneering work in this technology was by IBM. The de-
Surface-mount components on a USB ash drive's circuit board. sign approach rst demonstrated by IBM in 1960 in a
The small rectangular chips with numbers are resistors, while the
small-scale computer was later applied in the Launch Ve-
unmarked small rectangular chips are capacitors. The capaci-
tors and resistors pictured are 0603 (1608 metric) package sizes,
hicle Digital Computer used in the Instrument Unit that
along with a very slightly larger 0805 (2012 metric) ferrite bead. guided all Saturn IB and Saturn V vehicles.[2] Compo-
Not shown here, are even smaller chip capacitors of 01005 (0402 nents were mechanically redesigned to have small metal
metric) and 0201 (0603 metric) sizes. tabs or end caps that could be directly soldered to the sur-
face of the PCB. Components became much smaller and
component placement on both sides of a board became
far more common with surface mounting than through-
hole mounting, allowing much higher circuit densities.
Often only the solder joints hold the parts to the board,
in rare cases parts on the bottom or second side of the
board may be secured with a dot of adhesive to keep com-
ponents from dropping o inside reow ovens if the part
has a large size or weight. Adhesive is sometimes used to
hold SMT components on the bottom side of a board if
a wave soldering process is used to solder both SMT and
through-hole components simultaneously. Alternatively,
SMT and through-hole components can be soldered to-
gether without adhesive if the SMT parts are rst reow-
soldered, then a selective solder mask is used to prevent
the solder holding the parts in place from reowing and
Surface-mount capacitor
the parts oating away during wave soldering. Surface
mounting lends itself well to a high degree of automa-
Surface-mount technology (SMT) is a method for pro-
tion, reducing labor cost and greatly increasing produc-
ducing electronic circuits in which the components are
tion rates. SMDs can be one-quarter to one-tenth the size
mounted or placed directly onto the surface of printed
and weight, and one-half to one-quarter the cost of equiv-
circuit boards (PCBs). An electronic device so made is
alent through-hole parts.
called a surface-mount device (SMD). In the industry
it has largely replaced the through-hole technology con-
struction method of tting components with wire leads
into holes in the circuit board. Both technologies can be 2 Terms
used on the same board, with the through-hole technology
used for components not suitable for surface mounting Because surface-mount refers to a methodology of
such as large transformers and heat-sinked power semi- manufacturing, there are dierent terms used when re-
conductors. ferring to the dierent aspect of the method, which dis-

1
2 3 ASSEMBLY TECHNIQUES

tinguishes for example the components, technique, and is the most popular reow technology using either stan-
machines used in manufacturing. These terms are listed dard air or nitrogen gas. Each method has its advantages
in the following table: and disadvantages. With infrared reow, the board de-
signer must lay the board out so that short components
don't fall into the shadows of tall components. Compo-
3 Assembly techniques nent location is less restricted if the designer knows that
vapor phase reow or convection soldering will be used in
production. Following reow soldering, certain irregular
or heat-sensitive components may be installed and sol-
dered by hand, or in large-scale automation, by focused
infrared beam (FIB) or localized convection equipment.
If the circuit board is double-sided then this printing,
placement, reow process may be repeated using either
solder paste or glue to hold the components in place. If
a wave soldering process is used, then the parts must be
glued to the board prior to processing to prevent them
from oating o when the solder paste holding them in
place is melted.
After soldering, the boards may be washed to remove ux
residues and any stray solder balls that could short out
Assembly line with SMT placement machines closely spaced component leads. Rosin ux is removed
with uorocarbon solvents, high ash point hydrocarbon
Where components are to be placed, the printed cir- solvents, or low ash solvents e.g. limonene (derived from
cuit board normally has at, usually tin-lead, silver, or orange peels) which require extra rinsing or drying cycles.
gold plated copper pads without holes, called solder pads. Water-soluble uxes are removed with deionized water
Solder paste, a sticky mixture of ux and tiny solder par- and detergent, followed by an air blast to quickly remove
ticles, is rst applied to all the solder pads with a stainless residual water. However, most electronic assemblies are
steel or nickel stencil using a screen printing process. It made using a No-Clean process where the ux residues
can also be applied by a jet-printing mechanism, simi- are designed to be left on the circuit board [benign]. This
lar to an inkjet printer. After pasting, the boards then saves the cost of cleaning, speeds up the manufacturing
proceed to the pick-and-place machines, where they are process, and reduces waste.
placed on a conveyor belt. The components to be placed Certain manufacturing standards, such as those written by
on the boards are usually delivered to the production line the IPC - Association Connecting Electronics Industries
in either paper/plastic tapes wound on reels or plastic require cleaning regardless of the solder ux type used
tubes. Some large integrated circuits are delivered in to ensure a thoroughly clean board. Even no-clean ux
static-free trays. Numerical control pick-and-place ma- leaves a residue which, under IPC standards, must be re-
chines remove the parts from the tapes, tubes or trays and moved. Proper cleaning removes all traces of solder ux,
place them on the PCB. as well as dirt and other contaminants that may be invisi-
The boards are then conveyed into the reow soldering ble to the naked eye. However, while shops conforming to
oven. They rst enter a pre-heat zone, where the temper- IPC standard are expected to adhere to the Associations
ature of the board and all the components is gradually, rules on board condition, not all manufacturing facilities
uniformly raised. The boards then enter a zone where the apply IPC standard, nor are they required to do so. Addi-
temperature is high enough to melt the solder particles in tionally, in some applications, such as low-end electron-
the solder paste, bonding the component leads to the pads ics, such stringent manufacturing methods are excessive
on the circuit board. The surface tension of the molten both in expense and time required.
solder helps keep the components in place, and if the sol- Finally, the boards are visually inspected for missing or
der pad geometries are correctly designed, surface tension misaligned components and solder bridging. If needed,
automatically aligns the components on their pads. There they are sent to a rework station where a human operator
are a number of techniques for reowing solder. One is repairs any errors. They are then usually sent to the test-
to use infrared lamps; this is called infrared reow. An- ing stations (in-circuit testing and/or functional testing) to
other is to use a hot gas convection. Another technology verify that they operate correctly.
which is becoming popular again is special uorocarbon
liquids with high boiling points which use a method called
vapor phase reow. Due to environmental concerns, this
method was falling out of favor until lead-free legislation
was introduced which requires tighter controls on solder-
ing. Currently, at the end of 2008, convection soldering
 3

4 Advantages specic SMD component, a less-expensive breakout

board may be used. Additionally, stripboard style
The main advantages of SMT over the older through-hole protoboards can be used, some of which include
technique are: pads for standard sized SMD components. For
prototyping, "dead bug" breadboarding can be
used.[5]
Smaller components. As of 2012 smallest was 0.4
0.2 mm (0.016 0.008 in: 01005). Expected to SMDs solder connections may be damaged by
sample in 2013 are 0.25 0.125 mm (0.010 0.005 potting compounds going through thermal cycling.
in, size not yet standardized)
Solder joint dimensions in SMT quickly become
Much higher component density (components per
much smaller as advances are made toward ultra-
unit area) and many more connections per compo-
ne pitch technology. The reliability of solder joints
nent.
becomes more of a concern, as less and less solder
Higher density of connections because holes do not is allowed for each joint. Voiding is a fault com-
block routing space on inner or back-side layers. monly associated with solder joints, especially when
reowing a solder paste in the SMT application. The
Components can be placed on both sides of the cir- presence of voids can deteriorate the joint strength
cuit board. and eventually lead to joint failure.[6][7]
Small errors in component placement are corrected SMT is unsuitable for large, high-power, or high-
automatically as the surface tension of molten solder voltage parts, for example in power circuitry. It
pulls components into alignment with solder pads. is common to combine SMT and through-hole
Better mechanical performance under shake and vi- construction, with transformers, heat-sinked power
bration conditions. semiconductors, physically large capacitors, fuses,
connectors, and so on mounted on one side of the
Lower resistance and inductance at the connection; PCB through holes.
consequently, fewer unwanted RF signal eects and
better and more predictable high-frequency perfor- SMT is unsuitable as the sole attachment method for
mance. components that are subject to frequent mechanical
stress, such as connectors that are used to interface
Fewer holes need to be drilled. with external devices that are frequently attached
Lower initial cost and time of setting up for produc- and detached.
tion.
Simpler and faster automated assembly. Some 6 Rework
placement machines are capable of placing more
than 136,000 components per hour.
Many SMT parts cost less than equivalent through-
hole parts.
Better EMC performance (lower radiated emis-
sions) due to the smaller radiation loop area (be-
cause of the smaller package) and the smaller lead
inductance.[3]

5 Disadvantages
Manual prototype assembly or component-level re-
pair is more dicult and requires skilled operators Removal of surface-mount device using soldering tweezers
and more expensive tools, due to the small sizes and
lead spacings of many SMDs.[4] Main article: rework (electronics)
SMDs cannot be used directly with plug-in
breadboards (a quick snap-and-play prototyping Defective surface-mount components can be repaired by
tool), requiring either a custom PCB for every using soldering irons (for some connections), or using a
prototype or the mounting of the SMD upon non-contact rework system. In most cases a rework sys-
a pin-leaded carrier. For prototyping around a tem is the better choice because SMD work with a sol-
4 7 PACKAGES

dering iron requires considerable skill and is not always Surface temperature depends on the components
feasible. albedo: dark surfaces will be heated more than
Reworking usually corrects some type of error, either lighter surfaces
human- or machine-generated, and includes the follow- The temperature additionally depends on the sur-
ing steps: face shape. Convective loss of energy will reduce
the temperature of the component
Melt solder and remove component (s)
No reow atmosphere possible
Remove residual solder

Print solder paste on PCB, directly or by dispensing 6.2 Hot gas

Place new component and reow. During hot gas soldering, the energy for heating up the
solder joint is transmitted by a hot gas. This can be air or
Sometimes hundreds or thousands of the same part need inert gas (nitrogen).
to be repaired. Such errors, if due to assembly, are of- Advantages:
ten caught during the process. However, a whole new
level of rework arises when component failure is discov-
ered too late, and perhaps unnoticed until the end user of Simulating reow oven atmosphere
the device being manufactured experiences it. Rework Some systems allow switching between hot air and
can also be used if products of sucient value to justify nitrogen
it require revision or re-engineering, perhaps to change
a single rmware-based component. Reworking in large Standard and component-specic nozzles allow high
volume requires an operation designed for that purpose. reliability and faster processing
There are essentially two non-contact solder- Allow reproducible soldering proles
ing/desoldering methods: infrared soldering and
soldering with hot gas. Ecient heating, large amounts of heat can be trans-
ferred

6.1 Infrared Even heating of the aected board area

Temperature of the component will never exceed the

With infrared soldering, the energy for heating up the sol-
adjusted gas temperature
der joint is transmitted by long- or short-wave infrared
electromagnetic radiation. Rapid cooling after reow, resulting in small-
Advantages: grained solder joints (depends on system used)

Easy setup Disadvantages:

No compressed air required Thermal capacity of the heat generator results in

slow reaction whereby thermal proles can be dis-
No requirement for dierent nozzles for many com-
torted (depends on system used)
ponent shapes and sizes, reducing cost and the need
to change nozzles

Fast reaction of infrared source (depends on system 7 Packages

used)
Main article: Chip carrier
Disadvantages:
Surface-mount components are usually smaller than their
Central areas will be heated more than peripheral counterparts with leads, and are designed to be handled by
areas machines rather than by humans. The electronics industry
has standardized package shapes and sizes (the leading
Temperature control is less precise, and there may standardisation body is JEDEC). These include:
be peaks
The codes given in the chart below usually tell the length
Nearby components must be shielded from heat to and width of the components in tenths of millimeters or
prevent damage, which requires additional time for hundredths of inches. For example, a metric 2520 com-
every board ponent is 2.5 mm by 2.0 mm which corresponds roughly
7.2 Three-terminal packages 5

to 0.10 inches by 0.08 inches (hence, imperial size is 7.1.2 Tantalum capacitors[14][15]
1008). Exceptions occur for imperial in the two small-
est rectangular passive sizes. The metric codes still rep- 7.1.3 Aluminium capacitors[16][17][18]
resent the dimensions in mm, even though the imperial
size codes are no longer aligned. Problematically, some 7.1.4 Small outline diode (SOD)
manufacturers are developing metric 0201 components
with dimensions of 0.25 mm 0.125 mm (0.0098 in 7.1.5 Metal electrode leadless face[25] (MELF)
0.0049 in),[8] but the imperial 01005 name is already be-
ing used for the 0.4 mm 0.2 mm (0.0157 in 0.0079 Mostly resistors and diodes; barrel shaped components,
in) package. dimensions do not match those of rectangular references
for identical codes.

Metric Imperial
comparison code code comparison
7.1.6 DO-214
0.1x0.1 mm 0402 01005 0.01x0.01 in
0603 0201 (10x10 mils)
7.2 Three-terminal packages
1005 0402
1608 0603 7.2.1 Small-outline transistor (SOT)
1x1mm 2012 0805
0.1x0.1 in SOT-223: 6.7 mm 3.7 mm 1.8 mm body: four
2520 1008 (100x100 mils)
terminals, one of which is a large heat-transfer pad
3216 1206 [27]
3225 1210
4516 1806 SOT-89 (TO-243)[28] (SC-62):[29] 4.5 mm 2.5
4532 1812 mm 1.5 mm body: four terminals, center pin is
5025 2010 connected to a large heat-transfer pad [30]

1x1 cm 6332 2512 SOT-23 (TO-236-3) (SC-59): 2.9 mm 1.3/1.75

Actual 0.5x0.5in mm 1.3 mm body: three terminals for a transistor
size (500x500 mils) [31]

SOT-323 (SC-70): 2 mm 1.25 mm 0.95 mm

Example of component sizes, metric and imperial codes and com-
body: three terminals [32]
parison included
SOT-416 (SC-75): 1.6 mm 0.8 mm 0.8 mm
body: three terminals [33]

SOT-663: 1.6 mm 1.6 mm 0.55 mm body: three

terminals [34]

SOT-723: 1.2 mm 0.8 mm 0.5 mm body: three

terminals: at lead[35]

SOT-883 (SC-101): 1 mm 0.6 mm 0.5 mm

body: three terminals: leadless [36]

7.2.2 Other

DPAK (TO-252, SOT-428): Discrete Packaging.

SMD capacitors (on the left) with two through-hole capacitors Developed by Motorola to house higher powered de-
(on the right) vices. Comes in three-[37] or ve-terminal[38] ver-
sions

D2PAK (TO-263, SOT-404): bigger than the

7.1 Two-terminal packages DPAK; basically a surface mount equivalent of the
TO220 through-hole package. Comes in 3, 5, 6, 7,
7.1.1 Rectangular passive components 8 or 9-terminal versions [39]

Mostly resistors and capacitors. D3PAK (TO-268): even larger than D2PAK [40]
6 7 PACKAGES

7.3 Five- and six-terminal packages

7.3.1 Small-outline transistor (SOT)

SOT-23-5 (SOT-25, SC-74A): 2.9 mm 1.3/1.75

mm 1.3 mm body: ve terminals [41]

SOT-23-6 (SOT-26, SC-74): 2.9 mm 1.3/1.75

mm 1.3 mm body: six terminals [42]

SOT-23-8 (SOT-28): 2.9 mm 1.3/1.75 mm 1.3

mm body: eight terminals [43]

SOT-353 (SC-88A): 2 mm 1.25 mm 0.95 mm

body: ve terminals [44]

SOT-363 (SC-88, SC-70-6): 2 mm 1.25 mm

0.95 mm body: six terminals [45]

SOT-563: 1.6 mm 1.2 mm 0.6 mm body: six

terminals [46]

SOT-665: 1.6 mm 1.6 mm 0.55 mm body: six

terminals [47]

SOT-666: 1.6 mm 1.6 mm 0.55 mm body: six Various SMD chips, desoldered
terminals [48]

SOT-886: 1.5 mm 1.05 mm 0.5 mm body: six

terminals: leadless

SOT-886: 1 mm 1.45 mm 0.5 mm body: six

terminals: leadless [49]

SOT-891: 1.05 mm 1.05 mm 0.5 mm body: ve

terminals: leadless

SOT-953: 1 mm 1 mm 0.5 mm body: ve ter-

minals

SOT-963: 1 mm 1 mm 0.5 mm body: six ter-

minals

SOT-1115: 0.9 mm 1 mm 0.35 mm body: six

terminals: leadless [50]

SOT-1202: 1 mm 1 mm 0.35 mm body: six

terminals: leadless [51]
MLP package 28-pin chip, upside down to show contacts

Thin small-outline package (TSOP), thinner than

7.4 Packages with more than six terminals SOIC with smaller pin spacing of 0.5 mm
7.4.1 Dual-in-line Shrink small-outline package (SSOP), pin spacing
of 0.65 mm, sometimes 0.635 mm or in some cases
Flatpack was one of the earliest surface-mounted 0.8 mm
packages.
Thin shrink small-outline package (TSSOP).
Small-outline integrated circuit (SOIC): dual-in-
line, 8 or more pins, gull-wing lead form, pin spacing Quarter-size small-outline package (QSOP), with
1.27 mm pin spacing of 0.635 mm

Small-outline package, J-leaded (SOJ), the same as Very small outline package (VSOP), even smaller
SOIC except J-leaded [52] than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
7.4 Packages with more than six terminals 7

7.4.3 Grid arrays

Pin grid array (PGA)

Ball grid array (BGA): A square or rectangular array
of solder balls on one surface, ball spacing typically
1.27 mm (0.050 in)
Land grid array (LGA): An array of bare lands only.
Similar to in appearance to QFN, but mating is by
spring pins within a socket rather than solder.
Fine-pitch ball grid array (FBGA)]: A square or
rectangular array of solder balls on one surface
Low-prole ne-pitch ball grid array (LFBGA): A
square or rectangular array of solder balls on one
surface, ball spacing typically 0.8 mm
Thin ne-pitch ball grid array (TFBGA): A square
or rectangular array of solder balls on one surface,
32-pin MQFP chip with manually soldered wires attached for ball spacing typically 0.5 mm
prototyping. The same eect can be achieved using commercially
Column grid array (CGA): A circuit package
available breakout boards
in which the input and output points are high-
temperature solder cylinders or columns arranged in
Dual at no-lead (DFN), smaller footprint than a grid pattern.
leaded equivalent
Ceramic column grid array (CCGA): A circuit
package in which the input and output points are
7.4.2 Quad-in-line high-temperature solder cylinders or columns ar-
ranged in a grid pattern. The body of the component
Plastic leaded chip carrier (PLCC): square, J-lead, is ceramic.
pin spacing 1.27 mm Micro ball grid array (BGA): Ball spacing less than
Quad at package (QFP): various sizes, with pins on 1 mm
all four sides Lead less package (LLP): A package with metric pin
distribution (0.5 mm pitch).
Low-prole quad at-package (LQFP): 1.4 mm
high, varying sized and pins on all four sides
7.4.4 Non-packaged devices
Plastic quad at-pack (PQFP), a square with pins on
all four sides, 44 or more pins Although surface-mount, these devices require specic
Ceramic quad at-pack (CQFP): similar to PQFP process for assembly.

Metric quad at-pack (MQFP): a QFP package with Chip-on-board (COB), a bare silicon chip, that is
metric pin distribution usually an integrated circuit, is supplied without
a package (usually a lead frame overmolded with
Thin quad at-pack (TQFP), a thinner version of epoxy) and is attached, often with epoxy, directly
PQFP to a circuit board. The chip is then wire bonded and
protected from mechanical damage and contamina-
Quad at no-lead (QFN): smaller footprint than tion by an epoxy glob-top.
leaded equivalent
Chip-on-ex (COF), a variation of COB, where a
Leadless chip carrier (LCC): contacts are recessed chip is mounted directly to a ex circuit.
vertically to wick-in solder. Common in aviation
electronics because of robustness to mechanical vi- Chip-on-glass (COG); a variation of COB, where a
bration. chip, typically a liquid crystal display (LCD) con-
troller, is mounted directly on glass:.
Micro leadframe package (MLP, MLF): with a 0.5
mm contact pitch, no leads (same as QFN) There are often subtle variations in package details from
manufacturer to manufacturer, and even though standard
Power quad at no-lead (PQFN): with exposed die- designations are used, designers need to conrm dimen-
pads for heatsinking sions when laying out printed circuit boards.
8 8 IDENTIFICATION

8 Identication used to fabricate the capacitors, such as Nickel Tantalate,

possess dierent colours and these can give an approxi-
mate idea of the capacitance of the component.
8.1 Resistors
For 5% precision SMD resistors usually are marked with Light grey body colour indicates a capacitance
their resistance values using three digits: two signicant which is generally less than 100 pF.
digits and a multiplier digit. These are quite often white
Medium Grey colour indicates a capacitance any-
lettering on a black background, but other colored back-
where from 10 pF to 10 nF.
grounds and lettering can be used.
The black or colored coating is usually only on one face Light brown colour indicates a capacitance in a
of the device, the sides and other face simply being the range from 1 nF to 100 nF.
uncoated, usually white ceramic substrate. The coated
Medium brown colour indicates a capacitance in a
surface, with the resistive element beneath is normally po-
range from 10 nF to 1 F.
sitioned face up when the device is soldered to the board,
although they can be seen in rare cases mounted with the Dark brown colour indicates a capacitance from 100
uncoated underside face up, whereby the resistance value nF to 10 F.
code is not visible.
For 1% precision SMD resistors, the code is used, as three Dark grey colour indicates a capacitance in the F
digits would otherwise not convey enough information. range, generally 0.5 to 50 F, or the device may be
This code consists of two digits and a letter: the digits an inductor and the dark grey is the color of the fer-
denote the values position in the E96 sequence, while the rite bead. (An inductor will measure a low resistance
letter indicates the multiplier.[53] to a multimeter on the resistance range whereas a ca-
pacitor, out of the circuit, will measure a near innite
Typical examples of resistance codes resistance.)

102 = 10 00 = 1,000 = 1 k Generally physical size is proportional to capacitance and

voltage^2 for the same dielectric. For example, a 100 nF
0R2 = 0.2
50 V capacitor may come in the same package as a 10 nF
684 = 68 0000 = 680,000 = 680 k 150 V device.
SMD (non electrolytic) capacitors, which are usually
68X = 499 0.1 = 49.9
monolithic ceramic capacitors, exhibit the same body
color on all four faces not covered by the end caps.
There is an online tool to translate codes to resistance val-
ues. Resistors are made in several types; a common types SMD electrolytic capacitors, usually tantalum capacitors,
uses a ceramic substrate. Resistance values are available and lm capacitors are marked like resistors, with two
in several tolerances dened in EIA Decade Values Table signicant gures and a multiplier in units of pico Farads
: or pF, (1012 Farad.)
Examples
E3, 50% tolerance (no longer used)
104 = 100 nF = 100,000 pF
E6, 20% tolerance (now seldom used)
226 = 22 F = 22,000,000 pF
E12, 10% tolerance

E24, 5% tolerance The electrolytic capacitors are usually encapsulated in

black or beige epoxy resin with at metal connecting
E48, 2% tolerance strips bent underneath. Some lm or tantalum electrolytic
E96, 1% tolerance types are unmarked and possess red, orange or blue body
colors with complete end caps, not metal strips.
E192, 0.5, 0.25, 0.1% and tighter tolerances

8.3 Inductors
8.2 Capacitors
Due to the small dimensions of SMDs, SMT inductors
Non electrolytic capacitors are usually unmarked and the are limited to values of less than about 10 mH. Smaller
only reliable method of determining their value is re- inductance with moderately high current ratings are usu-
moval from the circuit and subsequent measurement with ally of the ferrite bead type. They are simply a metal con-
a capacitance meter or impedance bridge. The materials ductor looped through a ferrite bead and almost the same
 9

as their through-hole versions but possess SMD end caps Chip carrier
rather than leads. They appear dark grey and are mag-
netic, unlike capacitors with a similar dark grey appear- Electronics
ance. These ferrite bead type are limited to small values Electronics manufacturing services
in the nH (nano Henry), range and are often used as power
supply rail decouplers or in high frequency parts of a cir- List of electronics package dimensions
cuit. Larger inductors and transformers may of course be
Plastic leaded chip carrier
through-hole mounted on the same board.
SMT inductors with larger inductance values often have Point-to-point construction
turns of wire or at strap around the body or embedded in Printed circuit board
clear epoxy, allowing the wire or strap to be seen. Some-
times a ferrite core is present also. These higher induc- RoHS
tance types are often limited to small current ratings, al-
SMT placement equipment
though some of the at strap types can handle a few amps.
As with capacitors, component values and identiers are Through-hole technology
not usually marked on the component itself; if not doc- Wire wrap
umented or printed on the PCB, measurement, usually
removed from the circuit, is the only way of determining
them.
10 References
8.4 Discrete semiconductors [1] Williams, Paul, ed. (1999). Status of the Technology In-
dustry Activities and Action Plan (PDF). Surface Mount
Discrete semiconductors, such as transistors, diodes and Technology. Surface Mount Council. Archived (PDF)
from the original on 2015-12-28.
FETs are often marked with a two- or three-symbol code
in which the same code marked on dierent packages or [2] Schneeweis, Scott. Artifact: Digital Computer Memory
on devices made by dierent manufacturers can translate and Circuit Boards, LVDC, Saturn IB/V Guidance, Nav-
to dierent devices. igation and Control. Artifacts. Spaceaholic. Archived
from the original on 2015-12-28. Retrieved 2015-12-28.
Many of these codes, used because the devices are too
small to be marked with more traditional numbers used [3] Montrose, Mark I. (1999). Components and EMC.
on through-hole equivalent devices, correlate to more fa- EMC and the Printed Circuit Board: Design, Theory, and
miliar traditional part numbers when a correlation list is Layout Made Simple. Wiley-Interscience. p. 64. ISBN
consulted. 978-0780347038.

GM4PMK in the United Kingdom has prepared a [4] Judd, Mike; Brindley, Keith (1999). CS soldering
correlation list, and a similar .pdf list is also available, processes. Soldering in Electronics Assembly (2 ed.).
although these lists are not complete. Newnes. p. 128. ISBN 978-0750635455.

[5] Williams, Jim (1991). High Speed Amplier Techniques

- A Designers Companion for Wideband Circuitry (PDF).
8.5 Integrated circuits Application Notes. Linear Technology. pp. 2629,98
121. Archived (PDF) from the original on 2015-12-28.
Generally, integrated circuit packages are large enough Retrieved 2015-12-28.
to be imprinted with the complete part number which in-
cludes the manufacturers specic prex, or a signicant [6] Dr. Lee, Ning-Cheng; Hance, Wanda B. (1993).
Voiding Mechanisms in SMT. Indium Corporation Tech
segment of the part number and the manufacturers name
Paper. Retrieved 2015-12-28.
or logo.
Examples of manufacturers specic prexes: [7] DerMarderosian, Aaron; Gionet, Vincent (1983). The
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10 10 REFERENCES

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 11

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12 11 TEXT AND IMAGE SOURCES, CONTRIBUTORS, AND LICENSES

11 Text and image sources, contributors, and licenses

11.1 Text
Surface-mount technology Source: https://en.wikipedia.org/wiki/Surface-mount_technology?oldid=746146677 Contributors: Waveguy,
Heron, Michael Hardy, Delirium, CesarB, Ronz, Julesd, Glenn, Cherkash, CAkira, Hankwang, Mfc, Alan Liefting, Brouhaha, David-
Cary, Smurx, Everyking, Fleminra, AndreKR, Khalid hassani, Zeimusu, DRE, Quota, Imroy, Pt, Evand, Homerjay, Share Bear, John
Fader, Hooperbloob, Wdfarmer, Ronrkey, Wtshymanski, Cburnett, Gene Nygaard, Woohookitty, David Haslam, Pol098, Mbutts, Utuado,
Borborygmus, Allen Moore, FlaBot, Wegsjac, Patentmat, Thunderbird~enwiki, Ecacy, Mcleodm, Bgwhite, Hydrargyrum, Shaddack,
Bovineone, Pelago, Tony1, J.Hollemans~enwiki, Light current, Nicked, Nikkimaria, Zerodamage, Red Jay, Mike1024, Mais oui!, Ca-
ballero1967, Katieh5584, Meegs, Veinor, SmackBot, Askeuhd, Zephyris, Chris the speller, Bluebot, Thumperward, Janm67, ZyMOS,
JonHarder, Wine Guy, Fuhghettaboutit, Lsjzl, Alsh, Euletz, CyrilB, Mabahj, Basjoosten, Dicklyon, DavidGrayson, MTSbot~enwiki, Mot-
tyGlix, Screaming.people, Komeil, Mikebuetow, Atomobot, Ysette9, Chanik, Mikiemike, Cxw, Zureks, Gfbares, JettaMann, Jdmulloy,
DavidMcCabe, Luccas, Christian75, Msnicki, Epbr123, Al Lemos, Marek69, Smile a While, Electron9, James086, Leon7, Escarbot,
Christopher1 s, AntiVandalBot, Mandra Oleka, Quintote, Behnam Ghiaseddin, Credema, Chill doubt, Ex-Nintendo Employee, JAnD-
bot, Hut 8.5, Jahoe, Eintar, Magioladitis, ExFiler, Stigmj, Aka042, Indon, User A1, Moggie2002, Reguiieee, Avakar, R'n'B, Com-
monsDelinker, Mrataj, Krishna1612, Bushcarrot, JASEU, Cmdr Scolan, Homer Landskirty, EdgarDurbin, Andy.gock, Jirisundstrum,
Sergivs-en, VolkovBot, Amikake3, Javi.ar, Rudi Loos, Philip Trueman, Mkcmkc, NeighborJ, LeaveSleaves, Andy Dingley, Jpeeling,
Spinningspark, Adrger, AlleborgoBot, Plan10, Hulzenga, Winchelsea, Mrmrmr1991, Bentogoa, Happysailor, DaN PiCkFoRd, Dou-
blehp, Dtvjho, Dipa1965, Nn123645, Asher196, ImageRemovalBot, WakingLili, Loren.wilton, ClueBot, Sunnysmt, Ninevoltz, DragonBot,
Jacquesehuard, Ottawa4ever, La Pianista, Carto308, HumphreyW, Stickee, Noctibus, Alex Khimich, Addbot, Ramu50, Mortense, Some
jerk on the Internet, Fluernutter, Prxbl, Jordibatet, Oldmountains, Lightbot, Jarble, Ellery, Luckas-bot, Yobot, Jordsan, AnomieBOT,
KDS4444, Jim1138, 5040RZ, Materialscientist, ArthurBot, Capricorn42, Cantonesehick, Birgitlankes, Owendarroch, RibotBOT, Band-
jwet, Henk.muller, Ferentes, Globe Collector, BartomiejB, ~mik, Smta communications, Cannolis, Paly 1, Sky87 jun, Kiltedcueball,
Serols, Haaribaer, Adronwiki, RjwilmsiBot, EmausBot, John of Reading, Dltwaddell, SMTAmember77, Dewritech, KrissN, Daonguyen95,
AvicAWB, Wikfr, Laurasmithhp, Wingman4l7, Thine Antique Pen, Staszek Lem, Sbmeirow, Sethupathy3e, Donner60, TS133, ClueBot
NG, Carnaubo, Matthiaspaul, Tanbaum, DieSwartzPunkt, Asawula, Spuderator, Danim, For tha stone, Theopolisme, Helpful Pixie Bot,
BG19bot, Ramesh Ramaiah, PeterL9DO, KevinTough, Boxofmatches, 220 of Borg, BattyBot, Cyberbot II, YFdyh-bot, Khazar2, MadCow-
poke, LarryKnight71, ThunderStormer, Ruby Murray, Peter Sendtown, Buntybhai, Ashishbuntybhaiya, Kaizentechnologies, Stamptrader,
Etek-gordon, Createsocial, Wehappen, Shailesh Patel at APC, Crystallizedcarbon, U4205011, Spacecowboy420, GreenC bot and Anony-
mous: 314

11.2 Images
File:28_pin_MLP_integrated_circuit.jpg Source: https://upload.wikimedia.org/wikipedia/commons/2/23/28_pin_MLP_integrated_
circuit.jpg License: Public domain Contributors: Photographed by User:Mike1024 Original artist: User Mike1024 on en.wikipedia
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tors: ? Original artist: ?
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11.3 Content license 13

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