Philips Semiconductors
Immobilizer and RKE
Version 4
Immo-RKE-System-Design Version 4
System Design
Philips Semiconductors
Part 1: Immobilizer Design
1
2
3
4
Note:
Introduction
Immobilizer antenna design
ABIC design and optimization
System verification
At the beginning of every chapter of this presentation an overview
about related documents, software and development tools is given.
The associated product specifications are not explicitely mentioned.
Immo-RKE-System-Design Version 4
Content
Philips Semiconductors
1
Introduction
System configuration
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
User Manual and Software HSIS/UM9708: Control Software Library for PDF7991AT
and PCF7936AS.
User Manual and Tool: Transponder Evaluation and Development Kit (TED-Kit)
HSIS/UM9907.
Immo-RKE-System-Design Version 4
Basics of communication
Philips Semiconductors
System Configuration (Principle)
Basestation
Antenna
Inputs,
Outputs
Tx1
Transponder
Ra
VDC,
GND
Interface
Interface
Drivers
Drivers
Voltage
Voltage
Regulator
Regulator
Ca
ABIC
ABIC
Rx
Rx
Power
HITAG/
HITAG/
STARC
STARC
La
Tx2
Data
Immo-RKE-System-Design Version 4
Bussystem
Microcontroller
I/O
I/O
Functions
Functions
Philips Semiconductors
1
System configuration
Basics of communication
Immo-RKE-System-Design Version 4
Introduction
Philips Semiconductors
Principle of Data Transmission from Transponder
demodulator
tap point
It
Ib
data
energy
Vt
data
6V
Immo-RKE-System-Design Version 4
Vb
Philips Semiconductors
Data Transmission from the Transponder
Data
Manchester
CDP
RWD
Data rates for Manchester/CDP (HITAG2): 4 kbit/s
Transponder
Immo-RKE-System-Design Version 4
RL
Philips Semiconductors
Principle of Data Transmission to Transponder
Vb
energy
Vt
demodulator
6V
data
Immo-RKE-System-Design Version 4
data
It
Ib
Philips Semiconductors
Data Transmission to the Transponder
Data
Coding
Drivers on
Drivers off
TWRP
TLOG_0
TWRP
TLOG_0
Basestation
Antenna Signal
Duration of TWRP : 4..10 T0
TLOG0 : 18..22 T0
TLOG1 : 26..32 T0
TWRP
TLOG_1
TWRP
TLOG_1
TWRP
TLOG_0
Immo-RKE-System-Design Version 4
Timing
Philips Semiconductors
2
Immobilizer antenna design
Typical design requirements
Electrical design rules
Mechanical antenna design
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Laboratory Report: Questions to the ABIC (PCF7991).
Immo-RKE-System-Design Version 4
Physical parameters of antennas
Philips Semiconductors
Series Resonant Circuit (1)
damping factor:
R
2L
time constant:
quality factor:
VR
VL
V0
VC
Q=
f L
=
= f
B
R
0
voltages (magnitude):
VR = V0
VL = Q V0
VC = Q V0
Immo-RKE-System-Design Version 4
Philips Semiconductors
Series Resonant Circuit (2)
100
f = B
0.8
0.707
-50
-100
100
0.6
0.4
0.2
f0
f0
110
120
130
f[kHz] ->
capacitive
140
inductive
150
0
100
110
120
130
f[kHz] ->
capacitive
140
inductive
150
Immo-RKE-System-Design Version 4
abs(Y))/Ymax ->
phase(Z)[] ->
50
Philips Semiconductors
Effective Series Parameter of the Antenna
Physical circuit and serial equivalent circuit of a coil at 125 KHz:
Rohm
Rs
RS =
Xeff, S
2
R ohm
X eff,S =
L
CW
RS
Xeff ,S
QL
2
R ohm
+ L
Cw
Rohm
R
L
1
ohm L
CW CW
CW
ohm's resistance of the antenna []
inductance of the antenna [H]
interwinding capacitance of the antenna [F]
effective series resistance of the antenna []
CW
2
R ohm
CW
QL =
Xeff,S
RS
L
1
L
CW
CW
1
+ L
CW
effective series reactance of the antenna []
quality factor of the antenna
Practical approach: Measurement of the effective series parameter
Immo-RKE-System-Design Version 4
Rohm
Philips Semiconductors
Antenna Quality Factor
Definition: QL= XL/RL = fRes/B
Determines
transient and decay times of the antenna signal
transmission range
energy content of the field
Influenced by
losses due to eddy currents in metal in the vicinity of antenna
thickness of antenna wire
permeability of the core
losses due to energy absorption by transponder
Immo-RKE-System-Design Version 4
write pulses
Philips Semiconductors
Resonant frequency
Definition:
Particular value is influenced by:
Production tolerances of the antenna components
Changes of the component values due to temperature influence
Aging of the antenna components
High damping factor (low Q) reduces effective resonant
frequency:
0' = 02 2
Immo-RKE-System-Design Version 4
1
0
f0 =
=
2 2 L C
Philips Semiconductors
Coupling factor
Transponder
coil
Transponder
RWD
R1
L1
k
L2
C2
R2
C1
energy
data
k (coupling factor) depends on the
- amount and
- direction of the magnetic field
Immo-RKE-System-Design Version 4
RWD
Antenna
Philips Semiconductors
Describes how many field lines of the basestation antenna are
captured by the transponder antenna
Pure geometric parameter and independent from the antenna
inductances
Relation between coupling factor and system performance is
stronger than linear
Depends on the mechanical antenna design, that is
the form and size of the basestation and transponder
antennas
their placement relative to each other
the materials inside or close to the coils
Since the coupling factor is hard to calculate or to find by
simulations, the parameter should be measured
Immo-RKE-System-Design Version 4
Coupling factor
Philips Semiconductors
Coupling factor measurement
Basestation
Antenna (L1)
Transponder
coil (L2)
Conditions:
immo-key is placed in home position
transponder is replaced by a
transponder coil (molded coil)
V1
Frequency
generator
(125kHz
Sine-wave)
V2
Oscilloscop
e
Attention: V2 has high impedance,
proper probe calibration mandatory.
Use low-capacitive probes.
V2
L1
k=
100%
V1 L2
Immo-RKE-System-Design Version 4
all material near the antenna which
has influence on the coupling (e.g.
metal) must be included for this
measurement
Philips Semiconductors
2
Physical parameters of antennas
Typical design requirements
Electrical design rules
Mechanical antenna design
Immo-RKE-System-Design Version 4
Immobilizer antenna design
Philips Semiconductors
Energy supply for transponder function and possible battery charging
(e.g. with STARC)
Specification of the data communication between basestation and
transponder:
modulated voltage received from the transponder must be
sufficient over a wide tolerance range
write pulse specification has to be met
Tolerances specifications of the antenna elements
EMC requirements:
susceptibility
radiation
Communication distance
Immo-RKE-System-Design Version 4
Typical design requirements
Philips Semiconductors
Basestation antenna parameters:
Quality factor range:
Antenna inductance range:
5 -15
350 -1200 H
Transponder antenna parameters:
Quality factor (typ.):
Antenna inductance (typ.):
35
2.35 mH
Coupling factor range:
0.5 - 20 %
Immo-RKE-System-Design Version 4
Typical system parameters
Philips Semiconductors
2
Physical parameters of antennas
Typical design requirements
Electrical design rules
Mechanical antenna design
Immo-RKE-System-Design Version 4
Immobilizer antenna design
Philips Semiconductors
Electrical design rules (1): General Remarks
Due to the variety of different requirements and restrictions, the immobilizer
antenna design is rather an iterative process
To optimize the system and to meet all requirements, system simulations should
be applied during the design
Following, some basic design rules are given, to support the optimization
Immo-RKE-System-Design Version 4
process
Philips Semiconductors
Electrical design rules (2): Transponder antenna
For designing a transponder antenna for a normal application of HITAG2+ or
STARC1, L=2.35mH, Q=35, as used in the HITAG2 transponder is a good
starting value.
Larger transponder inductances increase the induced voltage at transponder
Smaller inductances lead to the opposite effect in both cases. Finding the
optimum compromise is only possible employing system simulations. However
the optimization curve is very flat. Therefore a change from e.g.. 2,3mH to
2.8mH has only a minor effect.
From the actual experience wed propose 2.35mH to 3mH.
Immo-RKE-System-Design Version 4
side, however they reduce the modulation voltage seen at the basestation. That
means with larger inductances the transponder will be kept running in larger
distances, however the distance where the reader stops to demodulate the
signal coming back, because of noise, sensitivity limitations and EMI will be
reduced.
Philips Semiconductors
Electrical design rules (3): Transponder antenna
A smaller Q will reduce the maximum operating distance, however normally has
no high impact in the key home position.
If a STARC1-system is designed for battery charging, smaller inductances shall
be applied to allow higher currents (around 1mH). Optimization has to be done
by simulations.
The models for STARC2 are still under development. At the moment we propose
The size and volume of the ferrite core influences the coupling factor. Higher
volumes lead to higher coupling, however this effect is only proportional to the
3rd root of the volume.
Immo-RKE-System-Design Version 4
also 2.35mH as a starting value for optimization of the transponder inductance.
Philips Semiconductors
2
Physical parameters of antennas
Typical design requirements
Electrical design rules
Mechanical antenna design
Immo-RKE-System-Design Version 4
Immobilizer antenna design
Mechanical Design: Configurations
Philips Semiconductors
Plastic spacer
Transponder
metal lock
barrel
Antenna
coil
The upper design
example normally results
in higher coupling factors
Plastic
spacer
Transponder
Key
metal lock
barrel
Antenna
coil
Immo-RKE-System-Design Version 4
dash board
Key
Philips Semiconductors
Mechanical Design Rules (1)
Keep some distance between metal lock barrel and antenna coil
by a plastic spacer part not to dissipate too much field energy in
form of eddy currents into the metal.
Place the transponder in axial direction as close to the antenna
as possible or even inside.
barrel middle axis must be smaller than the inner coil winding
radius.
Inside the key, the transponder should be placed as far as
possible from the key metal parts but as close as possible
towards the antenna coil.
Immo-RKE-System-Design Version 4
The distance of the transponder in radial direction from the lock
Philips Semiconductors
Mechanical Design Rules (2)
Metal parts of the dash board should be as far as possible away
from the antenna.
with different coils, coil positions, transponder positions and
transponder angles relative to the middle axis by powering the
antenna coil with a 125kHz sine frequency generator and
measuring the induced voltage in a molded coil in transponder
position before finishing the lock design. Optimization by
analytical calculations is hardly possible.
Immo-RKE-System-Design Version 4
The coupling factor should be optimized by practical experiments
Philips Semiconductors
Bad Mechanical Design Example
Transponder
too far from Antenna
too close to metal
part of key
Key
Antenna coil
too far from transponder
no space between metal an coil
Immo-RKE-System-Design Version 4
metal lock
barrel
Philips Semiconductors
Mechanical Requirements
The mechanical stability of the ferrite coil of the transponder antenna, also
related to its packaging and the way the part is soldered to the PCB, is very
important. This issue should be addressed by fall tests with coils soldered to the
final PCB.
The temperature and humidity drift of the inductance is a very important issue as
If water can enter the key housing and short the coil or the interconnection to the
transponder IC, the system will fail. Therefore, water protection by molding,
lacquering or a water resistant sealed key is important.
Immo-RKE-System-Design Version 4
well as a small manufacturing tolerance. The overall tolerance should be in the
3% range, at least for systems with weak coupling.
Philips Semiconductors
3
ABIC basestation design and optimization
circuit to the ABIC
Implementation of the AST algorithm
Configuration of the ABIC
Electrical verification and debugging
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Laboratory Report: Proposal for a Circuit Design and PCB-Layout for the PCF7991
(ABIC)
User Manual and Tool: Transponder Evaluation and Development Kit (TED-Kit)
HSIS/UM9907.
Immo-RKE-System-Design Version 4
Design and adaptation of the resonant
Philips Semiconductors
Basic specifications for ABIC based
systems
ABIC:
- maximum antenna current:
- output voltage:
- maximum Rx-pin-input voltage:
Imax,p = 200 mAp (Burst mode: 400 mAp)
Vout = 5V * 4/ = 6.3 Vp
VRx,p = 7..8 Vp
basestation quality factor range:
Q = 5 .. 15
Immo-RKE-System-Design Version 4
basestation inductance value range: L = 350 .. 1200 H
Philips Semiconductors
Basestation Design Example
RWD
Choose La = 400H
Antenna
Tx1
Ra
Ca = 1 / La / (2 pi fres)2 = 4nF
Ia = 200mAp
Ra = Vout / Ia = 32 Ohms
VRx = Vtap Rint,max / (Rx + Rint,max) => Rx
(Vtap = Q Vout = 63Vp)
La
ABIC
ABIC
VRX = 7..8Vp
(Rint,max = 33k)
k = 1% (measured)
Coil Design...
QGND
Rx
Rx
Ca
Tx2
Vout = 6.3Vp
GND
Immo-RKE-System-Design Version 4
Q = 2 pi fres La / Ra => Q = 10 (in range)
Philips Semiconductors
Basestation Coil Design
Read/Write
Read/Write
Device
Device
L
r
d
NA
N A1,85
inductance [nH]
antenna radius [cm]
wire diameter [cm]
number of turns
Inductance value, calculated by this formula, is strongly influenced by metal and ferrite
in the vicinity of the coil.
Immo-RKE-System-Design Version 4
L = 4 r
2 r
ln
Philips Semiconductors
3
ABIC basestation design and optimization
Design and adaptation of the resonant circuit to
the ABIC
Configuration of the ABIC
Electrical verification and debugging
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
User Manual and Software HSIS/UM9708: Control Software Library for PDF7991AT
and PCF7936AS.
Immo-RKE-System-Design Version 4
Implementation of the AST algorithm
Philips Semiconductors
Adaptive-Sampling-Time Principle
R1
phase
difference
s = 2 /2
synchronous detector
V1
L1
low pass
filter
VDemod
phaseshifter and multiplier are realized as sample and hold detector
good price/performance ratio
correct demodulation from the first bit on short authentication time
demodulation of only one data stream required low C calculation
only one demodulator
power, low C price
Immo-RKE-System-Design Version 4
VC
Philips Semiconductors
AST Implementation
ABIC
ant
phase
difference
R1
s = 2 ant + offs
V1
L1
LP
VC
sampling resolution:
360
64 = 5,625
Data
Immo-RKE-System-Design Version 4
Philips Semiconductors
Microcontroller Function
void Ast_Adjust (UBYTE t_offset)
{
t_antenna = READ_PHASE();
t_antenna <<= 1;
// multiply by 2
t_antenna += t_offset;
// add compensation constant
t_antenna &= 0x3F;
// mask out
SET_SAMPLING_TIME(t_antenna);
}
Immo-RKE-System-Design Version 4
UBYTE t_antenna;
Philips Semiconductors
3
ABIC basestation design and optimization
Design and adaptation of the resonant circuit to
Configuration of the ABIC
Electrical verification and debugging
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Laboratory Report: Questions to the ABIC (PCF7991).
Immo-RKE-System-Design Version 4
the ABIC
Implementation of the AST algorithm
Philips Semiconductors
Highpass
filter
Amplifier 0
Lowpass
filter
THRESET
Amplifier 1
Smart
Comparator
RX
DOUT
+
-
32/
6
QGND
HYSTER
ESIS
3/
6kHz
DISSMART
COMP
32/
16
GAIN1*
40/
160Hz
FILTERL
Input
protection
FILTERH
VIRX
Vtap
RIRX
GAIN0*
Rv
Sampling
demodulator
Control Register
MODE
TEST_SAMPLING_PHASE
TEST_ANAOUT
TEST_3900Hz
TEST_OFF
lowest internal clock
*gain values without filter attenuation
ABIC
Immo-RKE-System-Design Version 4
EMI filter
Control Register
DISLP1
FREEZE
0/1
Extended block diagram of the ABIC
Philips Semiconductors
Configuration of the ABIC
Contents of the Configuration Pages
Bit 0
Bit 3
GAIN1
GAIN0
FILTERH
FILTERL
PD_MODE
PD
HYSTERESIS
TXDIS
THRESET
ACQAMP
FREEZE1
FREEZE0
DISLP1
DISSMARTCOMP
FSEL1
FSEL0
one config page contains 4 bit
realized as RAM (not EEPROM)
Immo-RKE-System-Design Version 4
Page:
Philips Semiconductors
Configuration of the ABIC
Optimum filter settings for HITAG2/STARC based systems
The following filter settings are adapted to the spectral properties of the Manchester/CDP code with a data
rate of 4 kBit/s
Main low pass cutoff frequency: 6k Hz (FILTERL = 1)
Main high pass cutoff frequency: 160 Hz (FILTERH = 1)
Main low pass is enabled (DISLP1 = 0)
we propose to choose the demodulator gain in order to have at least a voltage of 2Vpp demodulated
signal at the input of the smart comparator (check TEST_ANAOUT as explained in this training) for the
weakest baseband signal expected in the given system
2 mVpp would correspond to the minimum receiver sensitivity multiplied by the maximum gain of the ABIC
the weakest baseband signal occurs for the worst case combination of transponder resonant frequency
tolerance and basestation resonant frequency tolerance
Immo-RKE-System-Design Version 4
Optimization of the ABIC gain settings
Philips Semiconductors
3
ABIC basestation design and optimization
the ABIC
Implementation of the AST algorithm
Configuration of the ABIC
Electrical verification and debugging
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Immo-RKE-System-Design Version 4
Design and adaptation of the resonant circuit to
Philips Semiconductors
ABIC Block Diagram
VDD
100 nF
VDD
10 F
TX1
TX2
XTAL1
Antenna Drivers
Modulator
Oscillator
Control
Unit
1
RX
Synchron
Demodulator
XTAL2
DIN
Bandpass Filter
Amplifier
Serial Interface
DOUT
to C
SCLK
4
Phase
Measurement
Control Register
QGND
CEXT
100 nF
100 nF
MODE
VSS
1M
VDD
1 nF
Immo-RKE-System-Design Version 4
Dynamic Control
Digitizer
Philips Semiconductors
4
System verification
Tolerance field verification by measurement
Temperature, humidity and functional tests
EMC measurements and optimization
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Immo-RKE-System-Design Version 4
Tolerance field verification by simulation
Philips Semiconductors
Verification method during and after design phase
Due to production and temperature tolerances, the resonant frequencies of
transponder and basestation antenna are changed
In practice, nearly all combinations of transponder and basestation
resonant frequencies are possible
Tolerance field shows the safe operating area of the system in means of
transponder and basestation tolerance
Tolerance fields can be determined in two ways
by simulation
by measurements
Immo-RKE-System-Design Version 4
Tolerance Field Diagrams
Philips Semiconductors
Philips Tolerance Field Simulation Program
There are two different tolerance fields calculated, as function of the
resonant frequency of two inductively coupled resonant circuits:
the energy transfer function
the amplitude of the demodulated data received from the transponder
The following restrictions apply:
Calculation is done in the Frequency domain; transients in time domain
are neglected
neglected
modelling the transponder by pure ohmic load (power dissipation and
load modulation)
V/I transfer function of the transponder is linearized (pice-wise)
modelling the demodulator of the basestation by math. model
Immo-RKE-System-Design Version 4
the calculation is restricted to the fundamental; higher harmonics are
Philips Semiconductors
Simulation Capabilities
Important Note:
Due to the given restrictions, the simulations can not replace practical
measurements and qualification of the transponder system
Measurements, which include temperature effects, aging and other
Following, one option to do worst case simulations with the PHILIPS
simulation tool TOLSIMU is shown on an example with practical values.
Immo-RKE-System-Design Version 4
parameter of the used devices, have to be done in addition to the following
simulations
Philips Semiconductors
Example (1): Given Parameters
System:
= 1.8%
(min)
Base station: PCF7991AT (ABIC) :
VDD = 4.9V - 5.1V
ROTX = 0 - 7 Ohm
(5V +- 2%)
(Driver resistance ABIC in full bridge)
L
= 601H - 651H
RReihe = 29.1 - 29.7 Ohm
RCU,FE = 22 - 24.4 Ohm
Immo-RKE-System-Design Version 4
Base station antenna:
Philips Semiconductors
Example (2): Derived Parameters
Base station antenna quality factor:
Q1
= ( 2* PI * 125e3 * L ) / ( RReihe + ROTX + RCU,FE )
Q1min = ( 2* PI * 125e3 * 601e-6 ) / ( 29.7 + 7 + 24,4 )
Q1min = 7.72
Q1max = ( 2* PI * 125e3 * 651e-6 ) / ( 29.1 + 0 + 22 )
Q1max = 10
RV,MIN = RIRX,MAX * ( (VDD,MAX *4/PI * Q1max ) / VIRX,MAX - 1 )
RV,MIN = 235 kOhm
RV,NOM = 270 kOhm (choosen according to IEC-E24, 2% Toleranz)
Immo-RKE-System-Design Version 4
External Resistor at Rx:
Philips Semiconductors
Example (3): Derived Parameters
Minimal amplitude of the modulated voltage at base station antenna:
Immo-RKE-System-Design Version 4
VRX = 3 mV
(peak) (ABIC gain at 1000)
VMOD = ( RV,MAX / RIRX,MIN + 1 )* VRX
VMOD = 51.6 mV
(peak)
Philips Semiconductors
Example (4): Simulation 1, Demodulation of TXP data
Used simulation parameters:
k
= 1.8%
fOSC
= 125kHz
VDD
= 4.9V
= 651
Q1
= 7.72
VMOD = 51.6 mV
(+-0.3% => two plots in one diagram)
(display the 52mV line at tap point)
Standard HITAG2 Transponder Model
Immo-RKE-System-Design Version 4
Philips Semiconductors
Example (5): Simulation 1, Demodulation of TXP data
L1=0.651mH, Q1=7.7, Q2=35.0, k=1.80%, U1=6.24V , I1max= 94mA
52
52
-3.2%
Immo-RKE-System-Design Version 4
3.2%
52
52
7.7%
18.3
Philips Semiconductors
Example (6): Simulation 2, Energy transfer
Used simulation parameters:
k
= 1.8%
VDD
= 4.9V
= 651H
Q1
= 7,72
Energy: Standard HITAG2-Model
Immo-RKE-System-Design Version 4
Philips Semiconductors
Example (7): Simulation 2, Energy transfer
L1=0.651mH, Q1=7.7, Q2=35.0, k=1.80%, U1=6.24V , I1max= 94mA
Immo-RKE-System-Design Version 4
3.2%
-3.2%
26.5%
Philips Semiconductors
4
Tolerance field verification by simulation
Tolerance field verification by measurement
Temperature, humidity and functional tests
EMC measurements and optimization
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Immo-RKE-System-Design Version 4
System verification
Philips Semiconductors
Tolerance Field Measurement Setup (Principle)
TX1
Ra
Lt
Ct0
La
Ca0
Ct2
Ca2
...
Ca1
...
Ct1
Ctm
Can
Transponder
(bondout version)
Rv
RX
Immo-RKE-System-Design Version 4
TX2
Philips Semiconductors
4
Tolerance field verification by simulation
Tolerance field verification by measurement
Temperature, humidity and functional tests
EMC measurements and optimization
Related Documents, Software and Tools:
Important information about relevant tests and test conditions can be found in the
Product Qualification Packages of the particular products.
Immo-RKE-System-Design Version 4
System verification
Philips Semiconductors
Temperature, humidity and functional tests
Temperature and humidity chamber tests should be done according to the maximum operating
conditions given in the module specification
Temperature and humidity chamber tests should be done with ALL transponder system components
included (basestation electronics, immobilizer coil and transponder)
Functional tests should be done with a larger number of devices to get statistically relevant results
Immo-RKE-System-Design Version 4
The ICs used in the tested modules should be taken from different batches
Philips Semiconductors
4
Tolerance field verification by simulation
Tolerance field verification by measurement
Temperature, humidity and functional tests
EMC measurements and optimization
Related Documents, Software and Tools:
Application Note AN99075: Designing RF-Identification Basestations with the
Advanced Basestation IC PCF7991.
Laboratory Report: Questions to the ABIC (PCF7991).
Immo-RKE-System-Design Version 4
System verification
Philips Semiconductors
ABIC-EMC guidelines (1)
VDD
100 nF
VDD
10 F
TX1
XTAL1
Programmable
Clock Divider
Modulator
Oscillator
Control
Unit
Rv
RX
EMI Filter
Synchron
Demodulator
Bandpass Filter
Amplifier
DOUT
Serial Interface
Dynamic Control
Digitizer
DIN
Digital Glitch
Filter
Phase
Measurement
Control Register
QGND
100 nF
CEXT
100 nF
VSS
XTAL2
MODE
SCLK
to C
Immo-RKE-System-Design Version 4
Antenna Drivers
TX2
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ABIC-EMC guidelines (2)
It is extraordinary important to place Rv as close as possible to the RX-pin for optimum EMIperformance.
The power supply shall be bypassed (de-coupled) via a 10F or larger capacitor in parallel to a 100nF
capacitor
For bypassing the internal analog virtual ground (~2V), a 100nF capacitor has to be connected from the
QGND-pin to the VSS-pin. This capacitor connection should be low impedance and close to the IC.
Another 100nF capacitor is connected from CEXT to VSS, which is needed for the 2nd high pass filter.
This capacitor connection should be low impedance and close to the IC too.
prevent leakage currents into CEXT.
The usage of the internal ABIC glitch filters should be considered depending on the particular
application.
Immo-RKE-System-Design Version 4
It is recommended to place a guard ring at the QGND potential around the CEXT-pin - capacitor lead, to
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ABIC-EMC guidelines (3)
The value of the pull-up resistors of the serial interface (DIN, DOUT, SCLK) should be chosen to
minimize the influence of external disturbers on these lines. This can be verified during measurements
of these signals under EMC conditions.
Increasing the Q-factor of the basestation antenna to improve the selectivity of the basestation resonant
circuit.
Immo-RKE-System-Design Version 4
Please read the relating chapters of the ABIC application note very carefully,
which provide additional hints and background information concerning the
presented topics.
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Hints for EM-Susceptibility measurements (1)
Separate measurements at the ABIC-MODE-pin in TEST_ANAOUT -mode
under the following conditions:
A) the demodulated signal amplitude (without disturber, only transponder modulation)
B) the demodulated noise amplitude (only disturber active to measure susceptibility)
By doing these measurements the signal to noise ratio (depending on the disturber carrier
frequency) of the system can be
In case of a communication error during EMC-measurements, a post-trigger is generated by
the basestation application software
The other channels of the oscilloscope are connected to important signals like RX, DIN,
DOUT, SCLK and VDD
By this, the prehistory of the error can be observed and countermeasures can be done
Note: Measurements during EMC tests may have strong influence on the system
performance and EMC behaviour, due to the susceptibility of the measurement probes and
cables.
Immo-RKE-System-Design Version 4
Doing measurements on the system with an oscilloscope using the posttrigger mode:
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Hints for EM-Susceptibility measurements (2)
Susceptibility can be measured with e.g. Ereduced = 50V/m instead of Enominal = 100V/m (values
depend on the used EMC specification)
This can be done, to find the most critical disturber frequencies. Note: Provided that after
EMC-measurements only go/no-go information is available (measurement with fixed disturber
field strength).
This information can then be used for example to design optimised adapted filters.
Immo-RKE-System-Design Version 4
Doing measurements on the system with reduced disturber field strength:
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Part 2:
RKE Implementation for
HITAG2+ based sytems
1
2
3
Block diagram of an RKE system (example)
Design of an remote data telegram
Decoder and identification functions
Related Documents, Software and Tools:
Application Note AN00041: Implementation of remote keyless entry with the PCF7946.
User manual and Software CAS/UM0101: HITAG2 / HITAG2+ Security Algorithm
for 8 bit microcontrollers.
User Manual and Tool: Transponder Evaluation and Development Kit (TED-Kit) HSIS/UM9907.
Immo-RKE-System-Design Version 4
Content
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Block diagram of an RKE system (example)
m`cTVQS
H
recJ
q~
Remote control unit / FOB
Modulated data-stream (UHF)
Basestation
recJo
Demodulated data-stream (Baseband)
aJ=~=f~
_=~
_~~=
EbbmoljLo^jF
IDE1IDEn(1)
SI1SIn(1)
SYNC1SYNCn(1)
Serial car bus
_=
(1) These values must be stored in the basestation memory for each car remote control (1..n) separately
Immo-RKE-System-Design Version 4
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Design of an remote data telegram (1)
=~==~=========recJ
=~=~====ob`j^u=Y=OR=
=====~===obp=Y=NMM=
~==~==~=~~======~=
~==~===~=~
=====~====
~===iba===~===
~=~=~====~=EKK======~=
F
==~==~===~==
~==~=~~=~=
Immo-RKE-System-Design Version 4
Typical system requirements
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Design of an remote data telegram (2)
Hitag2+ data telegram format
t init
Cycle Time t
cycle
t trans
Transmit
RDHT
Transmit
t trans
Data Frame 2
Data Frame n
Run-In
26 bit
Key Identifier
32 bit
Sequence
Increment
Command
10 bit
4 bit
t data
114 bit/Block (inc. 2 filling bits)
Sequence
Response
32 bit
Parity
Rolling Code Block (RCB)
8 bit
Immo-RKE-System-Design Version 4
Data Frame 1
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Design of an remote data telegram (3)
Example for a typical remote data telegram
TWUP
26.6 ms
3 x RCB
8 x LED
3 x TRCB
TON-RC
71.25 ms
190 ms
30 x SIB
TSI-CYCLE
760 ms
2 x LED
30 x SIB
2 x LED
1 x BRB
TON-SI
TRCB
47.5 ms
23.75 ms
TSIF
25 s
Immo-RKE-System-Design Version 4
8 x WUP
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Decoder and identification functions (1)
Receiver / C wake up
Synchronise to RUN-IN
Read and decode remote
telegram
No
(wrong SIB)
SIB
SIFOB,LOW =
SIBAS,LOW ?
RCB/BRB
RCB/SIB/Bitcount
Error?
wrong Bitcount
See Flowchart
Part 2
M
RUN-IN synchronization and
Manchester decoder
Init_timeout = 95 ms
Timeout detected
(285 ms or 95 ms)
M
Button release notification
Immo-RKE-System-Design Version 4
yes (SIB valid)
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Decoder and identification functions (2)
N
wrong
Parity ?(1)
Button release
notification
right
no
M
IDE valid ?
right
no (BRB)
CID != 0?
yes (RCB)
no
[Link] in
capture range?(2)
[Link] in
self synch. capture range? (3)
yes
Calculate the sequence response of the basestation:
SRBAS=f(IDEFOB,RSKBAS,CIDFOB,SIHIGH,BAS(IDE)(5)
+SI LOW,FOB)
Calculate the sequence response of the basestation:
SRBAS=f(IDEFOB,RSKBAS,CIDFOB,SYNC HIGH,BAS(IDE)
+8000200h(4) +SI LOW,FOB)
no
no
SRBAS = SRFOB ?
SRBAS = SRFOB ?
yes
yes
Resynchronisation: SILOW,BAS(IDE)= SILOW,FOB
SIHIGH,BAS(IDE)= SIHIGH,BAS(IDE) + 1024d
Resynchronisation: SILOW,BAS(IDE)= SILOW,FOB
(5)
SIHIGH,BAS(IDE)=SYNCHIGH,BAS+8000200h(4)
Button pressing notification
Init_timeout = 285 ms
Immo-RKE-System-Design Version 4
yes
no
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Appendix1: Overview about documents, software and tools,
referenced in this presentation
Part1:
Immobilizer Design
Application Note AN99075: Designing RF-Identification Basestations with the Advanced
Basestation IC PCF7991.
User Manual and Software HSIS/UM9708: Control Software Library for PDF7991AT
and PCF7936AS.
HSIS/UM9907.
Laboratory Report: Questions to the ABIC (PCF7991).
Laboratory Report: Proposal for a Circuit Design and PCB-Layout for the PCF7991(ABIC).
Product Qualification Packages of the particular products.
Immo-RKE-System-Design Version 4
User Manual and Tool: Transponder Evaluation and Development Kit (TED-Kit)
Philips Semiconductors
Appendix2: Overview about documents, software and tools,
referenced in this presentation
Part2:
RKE Design
Application Note AN00041: Implementation of remote keyless entry with the PCF7946.
User manual and Software CAS/UM0101: HITAG2 / HITAG2+ Security Algorithm
for 8 bit microcontrollers.
User Manual and Tool: Transponder Evaluation and Development Kit (TED-Kit)
Immo-RKE-System-Design Version 4
HSIS/UM9907.
Philips Semiconductors
Appendix3: Revision History
Version 1
First Version
Version 2
References to related documents, software and tools are given at the
beginning of every chapter.
Version 3
Version 4
Chapter about the HITAG2+ RKE implementation added.
Immo-RKE-System-Design Version 4
Chapter about worst case tolerance field simulations added.
