Global Mixed-mode Technology Inc.

G1117-XX

1A Low-Dropout Linear Regulator

Features

General Description
The G1117-XX is a low dropout linear regulator with a dropout of 1.3V at 1A of load current. It is available in four fixed voltage: 1.5V, 1.8V, 2.5V, 3.3 and 3.5V versions. The G1117-XX provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1117-XX is available in SOT-223 packages. A minimum of 10F tantalum electrolytic capacitor is required at the output to improve the transient response and stability.

Available in 1.5V, 1.8V, 2.5V, 3.3V,3.5V Version Space Saving SOT-223 Package Internal Short Circuit Current Limiting Internal Over Temperature Protection Output Current in Excess of 1A

Applications

Post Regulation for Switching DC/DC Converter High Efficiency Linear Regulator Battery Charger Battery Powered Instrumentation Motherboard

Ordering Information
ORDER NUMBER
G1117-15T43U G1117-18T43U G1117-25T43U G1117-33T43U G1117-35T43U G1117-15T63U G1117-18T63U G1117-25T63U G1117-33T63U G1117-35T63U

ORDER NUMBER (Pb free)

G1117-15T43Uf G1117-18T43Uf G1117-25T43Uf G1117-33T43Uf G1117-35T43Uf G1117-15T63Uf G1117-18T63Uf G1117-25T63Uf G1117-33T63Uf G1117-35T63Uf

MARKING
1117-15 1117-18 1117-25 1117-33 1117-35 1117-15 1117-18 1117-25 1117-33 1117-35

TEMP.

RANGE
-40C~85C -40C~85C -40C~85C -40C~85C -40C~85C -40C~85C -40C~85C -40C~85C -40C~85C -40C~85C

PACKAGE
TO-252 TO-252 TO-252 TO-252 TO-252 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223

1
GND GND GND GND GND GND GND GND GND GND

PIN OPTION 2
VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT

3
VIN VIN VIN VIN VIN VIN VIN VIN VIN VIN

* For other package types and pin options, please contact us at [email protected]

Order Number Identification

GXXXX-XX XX X X Packing Type Pin Option Package Type Voltage Part Number PACKAGE TYPE
T4: TO-252 T6: SOT-223 1 3: GND

PIN OPTION
2 VOUT 3 VIN

PACKING
U : Tape & Reel

Package Type

Typical Application
[Note 4]: Type of COUT
VIN

G1117-XX
VIN GND C1 1F

IO VOUT

VOUT

Top View

Top View

COUT 10F

SOT-223

TO-252

Ver: 1.5 Apr 18, 2006

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(Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature. . . . . . . . . . . . .150C Storage Temperature Range . . . -65C TJ +150C Reflow Temperature (soldering, 10sec) . . . . . .260C Thermal Resistance Junction to Ambient, (JA) SOT-223(1). . . . . . . . . . . . . . . . . . . . . . . . . . .116C/W TO-252(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W Thermal Resistance Junction to Case, (JC) SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . . .21C/W TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10C/W
Note (1): See Recommended Minimum Footprint

G1117-XX

Absolute Maximum Ratings

Operating Conditions

(Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . .3V~6V Temperature Range . . . . . . . . . . . . -40C TA 85C

Electrical Characteristics
Operating Conditions: VIN 6V, TJ = 25C unless otherwise specified. [Note3] PARAMETER
Output Voltage Line Regulation Load Regulation Dropout Voltage Short Circuit Current Quiescent Current Ripple Rejection f = 120Hz, COUT = 10F Tantalum, Vripple = 2VP-P, IOUT = 100mA Thermal Resistor Junction-to-Ambient SOT-223; Recommended Minimum Footprint (No heat sink; No air flow) Thermal Shutdown Junction Temperature

CONDITION
10mA< IOUT < 1A (VOUT + 1.5V) < VIN < 6V, IOUT = 10mA VIN = 5V, 10mA < IOUT < 1A VOUT = 2%, IOUT = 1A

MIN TYP MAX UNIT

2% --------0.3 ------VO 3 35 1.3 1.6 0.6 50 116 150 3% 30 50 1.4 --1.5 ------V mV mV V A mA dB C/W C

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / JA. If this dissipation is exceeded, the die temperature will rise above 150C and IC will go into thermal shutdown. For the G1117-XX in SOT-223 package; JA is 116C/W; in the TO-252 package, JA is 86C/W (See recommend minimum footprint). The safe operation in SOT-223, TO-252 package, it can see Typical Performance Characteristics (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum.

Definitions
Output Voltage The G1117-XX provides in four fixed voltages = 1.5V, 1.8V, 2.5V, 3.3V and 3.5V. Its quiescent current is typically 600A. Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected.
Ver: 1.5 Apr 18, 2006

Load Regulation
The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.

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Typical Performance Characteristics
VIN= 5V, CIN=1F, COUT=10F, TA=25C, unless otherwise noted. (G1117-25)
Line Transient

G1117-XX
Load Transient

Ch1: Vin (offset=5.0V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA

Ch1: Iout (1A/div) Ch2: Vout (offset=2.50V)

Output Voltage vs. Load Current

2.600 1200 1100

Dropout Voltage vs. Load Current

Dropout Voltage (mV)

2.580

1000 900 800 700 600 500 400 300 200 100

Ootput Voltage (V)

2.560

2.540

2.520

2.500

2.480
0 100 200 300 400 500 600 700 800 900 1000

0
0 100 200 300 400 500 600 700 800 900 1000

Load Current (mA)

Load Current (mA)

Ground Current vs. Load Current

2.00 1.80 1.60

Ground Current (mA)

1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00

0 100 200 300 400 500 600 700 800 900 1000

Load Current (mA)

Ver: 1.5 Apr 18, 2006

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Typical Performance Characteristics (continued)
TO-252 Max. Power Dissipation vs. PCB Top Copper Area
4 3.5
Max. Dissipation Power (W) Max. Dissipation Power (W)

G1117-XX
Unit:in2 A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0

TO-252 Max. Power Dissipation vs. TAMB ( Still Air)

4 3.5 3 2.5 2 1.5 1 0.5 0

3 2.5 2 1.5 1 0.5 0 0.5

1.0

1.5 2.0 2.5 3.0 3.5 4.0 PCB Top Copper Area (in2)

4.5

5.0

25

35

45

55 65 TAMB (oC)

75

85

SOT-223 Max. Power Dissipation vs. PCB Top Copper Area

3
Max. Dissipation Power (W)

SOT-223 Max. Power Dissipation vs. PCB Top Copper Area TAMB (Still Air)
3
Max. Dissipation Power (W)

Unit:in2 A=0.5

2.5 2 1.5 1 0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 PCB Top Copper Area (in2)

2.5 2 1.5 1 0.5 0 25 45 65 TAMB (oC) 85

A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0

Recommend Minimum Footprint

SOT-223 TO-252

Ver: 1.5 Apr 18, 2006

TEL: 886-3-5788833 http://www.gmt.com.tw

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Package Information
E E1 L1 A

G1117-XX
F

L2 b e1 e

A1

L3

TO-252 (T4) Package MILLIMETERS MIN.

2.19 0.89 0.64 0.46 5.97 6.35 5.21 2.26BSC 3.96 0.46 0.89 0.64 2.40 9.40 0 5.18 0.58 2.03 1.02 2.80 10.40 4 0.156 0.018 0.035 0.025 0.095 0.370 0

SYMBOL
A A1 b C D E E1 e e1 F L1 L2 L3 H

INCHES MAX.
2.38 1.27 0.89 0.58 6.22 6.73 5.46

MIN.
0.086 0.035 0.025 0.018 0.235 0.250 0.205 0.09BSC

MAX.
0.094 0.050 0.035 0.023 0.245 0.265 0.215 0.204 0.023 0.080 0.040 0.110 0.410 4

Ver: 1.5 Apr 18, 2006

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Global Mixed-mode Technology Inc.

G1117-XX
A C

D B1

13 (4X)

L e e1 L2

13 (4X)

A1 B

SOT-223 (T6) Package SYMBOLS

A A1 B B1 C D E e e1 H L L2

MILLIMETERS MIN
1.55 0.02 0.60 2.90 0.24 6.30 3.30 2.30 BSC 4.60 BSC 6.70 0.90 MIN 0.06 BSC 0 10 0 7.30 0.264

INCHES MAX
1.80 0.12 0.80 3.10 0.32 6.70 3.70

MIN
0.061 0.0008 0.024 0.114 0.009 0.248 0.130 0.090 BSC 0.181 BSC

MAX
0.071 0.0047 0.031 0.122 0.013 0.264 0.146

0.287 0.036 MIN 0.0024 BSC 10

Taping Specification

PACKAGE
SOT-223 TO-252
Feed Direction TO-252 Package Orientation Feed Direction SOT-223 Package Orientation

QTY/REEL
2,500 ea 2,500 ea

GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.

Ver: 1.5 Apr 18, 2006

TEL: 886-3-5788833 http://www.gmt.com.tw