London, UK, and Guangzhou, China, March 9, 2026GW1AN and GW3A Expand GOWIN’s Small and Medium FPGA Portfolio GOWIN Semiconductor today announced the launch of its next-generation Arora GW1AN and GW3A FPGA families, expanding its programmable logic portfolio with compact architectures, efficient integration, and dependable performance across industrial, consumer, and embedded applications.   Designed to support the complete FPGA decision chain — including hardware architects, FPGA developers, engineering managers, and component procurement teams — the new families emphasize migration flexibility, sourcing stability, and long-term production planning across EMEA, the United States, and Japan.   Arora GW1AN: Expanded Small FPGA Integration The Arora GW1AN family introduces an enhanced small FPGA architecture focused on system-level efficiency and integration flexibility. Key features include: Redesigned packaging for improved board compatibility Hardened embedded IP subsystems to reduce development complexity Integrated user flash supporting background programming and multi-image reliability Higher-precision ADC resources for monitoring and control systems Pin-compatible migration paths enabling dual-source and risk mitigation strategies The GW1AN series is positioned for industrial control, embedded processing, power management, and cost-sensitive programmable logic designs where compact footprint and long lifecycle support are essential. GW3A: New Medium FPGA Performance Class The GW3A family introduces a hybrid LUT4/LUT6 FPGA architecture combined with optimized hard IP blocks to deliver balanced performance and efficient silicon utilization. With logic densities ranging from approximately 6K to 90K LUTs, GW3A supports: Industrial automation platforms Machine vision systems Video bridging and display connectivity Embedded interface and control applications The architecture is designed to provide strong integration capability while maintaining footprint efficiency for small to medium programmable designs. Designed for Real-World Engineering Requirements Both FPGA families integrate hardened functional blocks aligned with practical system demands, including: Deterministic timing for motor control and FoC applications MIPI connectivity for imaging and vision systems Flexible display and interface bridging Integrated ADC and DSP resources for power and energy applications These capabilities allow designers to reduce external components, simplify system architecture, and optimize board-level efficiency. Regional Focus and Supply Chain Stability The 2026 portfolio expansion reinforces GOWIN’s commitment to: Strong 3.3V I/O drive capability Simplified configuration flows Alignment with legacy device architectures Predictable production planning These attributes address the sourcing, lifecycle, and supply chain priorities of customers across EMEA, the US, and Japan. Executive Perspective “With the introduction of the Arora GW1AN and GW3A families, we are strengthening GOWIN’s position in both the small and medium FPGA markets,” said Mike Furnival, VP International Sales and GM of the UK Office at GOWIN Semiconductor. “Our customers are asking for integration efficiency, migration flexibility, and dependable production planning. These new families are designed specifically to address those needs while delivering the performance and architectural balance modern embedded systems require.” Availability The Arora GW1AN and GW3A families will roll out throughout 2026, with technical documentation, development tools, and evaluation platforms available through GOWIN’s global support network. For detailed specifications, evaluation hardware, or migration support, please contact your local GOWIN Semiconductor representative or visit the GOWIN Technical Resource Center. About GOWIN Semiconductor Corporation Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.

London, UK, and Guangzhou, China, January 22, 2026GOWIN Semiconductor Corporation, a leading global provider of FPGA solutions, is pleased to announce its participation in Embedded World 2026, taking place March 10–12, 2026, in Nuremberg, Germany. This marks GOWIN’s continued presence at the world’s premier embedded systems exhibition. Attendees are invited to visit Hall 3A, Stand 340, where GOWIN will connect with developers, partners, and system designers shaping the future of embedded computing. Enabling Next-Generation Embedded Systems with FPGAs As embedded applications continue to evolve, system designers face growing demands for real-time performance, low latency, power efficiency, and interface flexibility. FPGAs play a critical role in addressing these challenges by enabling highly parallel processing, deterministic behavior, and adaptable hardware architectures. At Embedded World 2026, GOWIN will highlight how its FPGA platforms support a wide range of modern embedded use cases - particularly in AR/VR, robotics, and intelligent edge systems-where responsiveness, efficiency, and system integration are key. Focus Areas at Embedded World 2026 AR/VR Systems Augmented and virtual reality applications place strict requirements on latency, bandwidth, and power consumption. GOWIN FPGAs are well suited for AR/VR system architectures, enabling: Real-time sensor processing and display pipelines Ultra-low-latency data paths to reduce motion-to-photon delay Flexible support for high-speed display and camera interfaces Efficient offloading of vision and AI-related workloads Robotics and Intelligent Automation Robotics systems demand precise timing, deterministic control, and seamless integration of sensors, motors, and communication interfaces. GOWIN FPGAs help robotics developers: Implement real-time motor control and motion algorithms Process sensor and vision data with low and predictable latency Integrate multiple interfaces within a single, flexible platform Scale designs from prototyping to production efficiently Flexible FPGA Platforms for Embedded Innovation Across AR/VR, robotics, industrial, and consumer applications, GOWIN’s FPGA portfolio supports designers with: Power-efficient architectures suitable for edge and mobile systems Pin-compatible device options to simplify design migration Cost-effective solutions that balance performance and system integration A growing ecosystem of development tools, IP, and reference designs Join GOWIN at Embedded World 2026 “We’re excited to return to Embedded World and continue conversations with the global embedded community,” said Mike Furnival, Vice President of International Sales at GOWIN Semiconductor. “Embedded systems are becoming more complex and performance-driven, and FPGAs remain a powerful enabler for applications like AR/VR and robotics. Embedded World is an ideal place to exchange ideas and explore how flexible FPGA platforms can support next-generation designs.” GOWIN invites attendees to stop by Hall 3A, Stand 340 to discuss application challenges, system architectures, and how FPGAs can accelerate embedded innovation. Supporting Resources Schedule a Meeting: To arrange a meeting with GOWIN Semiconductor at Embedded World 2026, contact us at [email protected] Learn More About GOWIN Semiconductor: https://www.gowinsemi.com/en/ Embedded World 2026 Information: https://www.embedded-world.de/en About GOWIN Semiconductor Corporation Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.

GOWIN Semiconductor’s 22nm Automotive-Grade FPGA Achieves AEC-Q100 Grade 1 Certification GOWIN Semiconductor has expanded its automotive-grade FPGA portfolio with another major milestone. The company’s 22nm FPGA device, GW5AT-LV60UG225A0, has successfully passed AEC-Q100 Grade 1 certification, the internationally recognized reliability standard for automotive electronics. Certification Ceremony Recently, GOWIN Semiconductor’s automotive-grade FPGA product, GW5AT-LV60UG225A0—developed on an advanced 22nm process—successfully completed AEC-Q100 Grade 1 qualification. This achievement represents another important breakthrough for GOWIN Semiconductor in the automotive electronics market. To mark the occasion, GOWIN Semiconductor and its long-term partner Suzhi Yite, a leading third-party verification and analysis service provider, jointly held a certification ceremony and strategic cooperation seminar. At the event, Cai Su Gu, Minister of the Reliability Engineering Department at Suzhi Yite, officially presented the AEC-Q100 certification to GOWIN Semiconductor. The certification not only validates the reliability of the GW5AT-LV60UG225A0 device but also reflects strong recognition of GOWIN Semiconductor’s capabilities in automotive chip design, process control, and quality management systems. (GOWIN Semiconductor Operations Director Li Shiming (left) and Cai Su Gu, Minister of Reliability Engineering Department, Suzhi Yite (right))   Supporting Next-Generation Automotive Applications Li Shiming, Operations Director of GOWIN Semiconductor, noted that the automotive industry is undergoing a rapid transformation driven by electrification and intelligent technologies, which is significantly increasing the demand for high-performance and highly reliable semiconductor solutions. GOWIN Semiconductor has maintained a forward-looking strategy in the automotive electronics market. The newly certified GW5AT-LV60UG225A0 FPGA is designed for a wide range of automotive applications, including: In-vehicle video display systems (image enhancement, local dimming, roof-mounted displays, and headrest displays) LiDAR systems AR-HUD and PHUD displays Intelligent driving domain controller co-processing These applications are enabled by the device’s rich video interface support, low power consumption, and high reliability. Continued Commitment to Automotive-Grade Quality To date, GOWIN Semiconductor has achieved AEC-Q100 certification for nearly 10 automotive-grade FPGA products, with additional devices currently undergoing certification. This progress demonstrates the company’s long-term commitment to the automotive market and highlights its strong R&D capabilities and robust quality management system for high-reliability products. Looking ahead, GOWIN Semiconductor will continue to expand its automotive-grade FPGA offerings, explore new automotive electronics applications, and contribute to improving the reliability and competitiveness of China’s automotive semiconductor supply chain. About GOWIN Semiconductor Founded in 2014, GOWIN Semiconductor Technology Co., Ltd. is a high-tech FPGA company specializing in the research, development, and design of field-programmable gate array (FPGA) devices. GOWIN provides comprehensive, end-to-end solutions covering FPGA devices, EDA development software, IP cores, development boards, and complete system solutions. Through years of technological innovation and ecosystem development, GOWIN Semiconductor has established independent core expertise in FPGA architecture, SoC design, integrated EDA platforms, and application solutions, supported by numerous domestic and international patents. GOWIN’s FPGA products have been successfully mass-produced and deployed across automotive, industrial control, power, communications, medical, and data center applications. About Suzhi Yite Founded in 2002, Suzhi Yite is a high-tech enterprise specializing in chip modification, failure analysis, reliability verification, wafer microstructure and material analysis, automotive component reliability testing, and board-level reliability evaluation. The company also provides advanced DPA analysis services for modern packaging technologies. Suzhi Yite serves customers across the semiconductor ecosystem—including chip design houses, wafer fabs, packaging and test facilities, and advanced equipment suppliers—offering comprehensive, one-stop verification and analysis services for integrated circuits.