Fig. 1. Cross section of the MCM-D technology. Also shown are a flip-chip solder bump, a resistor, capacitor, and inductor. Fig. 8. Cross section of a micromechanical switch. Fig. 9. Picture of the brick-wall antenna under RF testing. Fig. 10. Transistor schematic of the VCO circuit. Fig. 11. Microphotograph of the DECT VCO circuit integrated in MCM-D technology with wirebonded bare dice. Fig. 12. Output power spectrum of the DECT VCO at the fundamental oscillation frequency. Fig. 13. (a) Microphotograph of the second-order 5-G Hz bandpass filter. (b) Measured transfer function of the bandpass filters. Fig. 14. Microphotograph showing the low noise amplifier. The small bare-die transistor is mounted upon the MCM. At the bottom is a small part of the GaAs down-converter MMIC. Fig. 15. Measurement results of the down-conversion gain of the 5-GHz WLAN receiver RF module, consisting of two MCM bandpass filters, LNA, and MMIC down-conversion mixer. Fig. 17. RF front end of a 5-GHz WLAN receiver. Fig. 16. Lumped element model for multitum spiral inductor Fig. 18. (a) Voltage-controlled oscillator. (b) Microphotograph of the VCO with off-chip MCM inductors, flip-chipped onto the MCM substrate. Fig. 19. Microphotograph of the complete front-end MCM. Simulation Results for the VCO of Fig. 6 With Several Options for the LC Tank
