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1998, Scripta Materialia
AI
This work investigates the atomic structures of unloaded and loaded cracks at the (001) surface of muscovite mica using Atomic Force Microscopy (AFM). The study identifies an unperturbed atomic structure at unloaded crack tips, while a disorder zone about 8nm wide is present at the loaded crack tips, suggesting a difference in mechanical properties and atomic arrangements due to stress concentration.
Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science, 2011
A number of investigators have recently turned to the atomic force microscope to characterize crack tips in glass. The technique is used for several purposes: to quantify crack velocities to very low values, 1x10 -13 m/s, to characterize the roughness and fractal dimensions of freshly formed fracture surfaces, to measure the corrosion rate of surfaces of arrested cracks that have been exposed to water or water vapor, to study water condensation at crack tips in glass and to study the relation between crack geometry and the static fatigue limit in glass. In this paper, we discuss several recent studies in which atomic force microscopy was used to clarify the role played by corrosion in determining the shape of crack tips in glass and the effect of crack tip diffusion on crack growth in glass. First, the two principal methods of using atomic force microscopy to study crack tips in glass are reviewed. These involve (1) the direct observation of crack motion in situ by scanning the tip of an emerging crack during crack growth and (2) the post mortem examination of the fracture surfaces once the specimen has been fractured in two. Then we describe the kinds of results that can be obtained by atomic force microscopy. It is shown for example that permanent displacements develop between fracture surfaces as a consequence of corrosion during the fracture process. Such crack tip displacements only occur in glasses that contain alkali or other ions that will form high pH solutions at the crack tip: soda lime silicate glass, for example, but not for silica glass. These measurements can also be used to show that crack tips in silicate glasses are always sharp even in the presence of a corrosive environment. By using atomic force microscopy, we can also show that residual damage resulting from cavity formation is not present on freshly formed fracture surfaces in silicate glasses. In the final sections of the paper, we compare two major mechanisms of crack growth: crack growth due to a stress enhanced chemical reaction between water in the air and strained bonds in the glass, and crack growth by viscoelastic flow of glass near the crack tip. Experimental data mainly supports the chemical theory of crack growth. Although, a crack growth theory based on water penetration to the crack tip and viscoelastic flow of the glass has been developed, the theory is as of yet not well supported by experimental data.
Fatigue & Fracture of Engineering Materials and Structures, 1979
Crack tip closure measurements were performed in a 2124T3 51 aluminum alloy by electronfractography. The technique makes use of high resolution fractography to correlate a closure in striation spacing with a sudden change of the stress intensity factor range following steady state crack growth. The crack growth tests under programmed loads were performed with a servohydraulic machine interfaced to a digit4 computer. An average value of K,,/K,,, equal to 0.15 was found in the range of 10 MPaJm < AK < 35 MPaJm.
This paper presents a study of microscale plastic deformation at the crack tip and the effect of microstructure feature on the local deformation of aluminum specimen during fracture test. Three-point bending test of aluminum specimen was conducted inside a scanning electron microscopy (SEM) imaging system. The crack tip deformation was measured in situ utilizing SEM imaging capabilities and the digital image correlation (DIC) full-field deformation measurement technique. The microstructure feature at the crack tip was examined to understand its effect on the local deformation fields. Microscale pattern that was suitable for the DIC technique was generated on the specimen surface using sputter coating through a copper mesh before the fracture test. A series of SEM images of the specimen surface were acquired using in situ backscattered electronic imaging (BEI) mode during the test. The DIC technique was then applied to these SEM images to calculate the full-field deformation around the crack tip. The grain orientation map at the same location was obtained from electron backscattered diffraction (EBSD), which was superimposed on a DIC strain map to study the relationship between the microstructure feature and the evolution of plastic deformation at the crack tip. This approach enables to track the initiation and evolution of plastic deformation in grains adjacent to the crack tip. Furthermore, bifurcation of the crack due to intragranular and intergranular crack growth was observed. There was also localization of strain along a grain boundary ahead of and parallel to the crack after the maximum load was reached, which was a characteristic of Dugdale-Barenblatt strip-yield zone. Thus, it appears that there is a mixture of effects in the fracture process zone at the crack tip where the weaker aspects of the grain boundary controls the growth of the crack and the more ductile aspects of the grains themselves dissipate the energy and the corresponding strain level available for these processes through plastic work.
Fracture of Nano and Engineering Materials and Structures
In this paper the authors present results of in situ observation of crack growth in various materials, at various length scales and under various modes of loading. In order to approach better understanding of the fracture behaviour light microscope (LM) with in-situ recording device, scanning electron microscope (SEM) equipped with a tensile test device and transmission electron microscope (TEM) with a straining holder have been utilized. In situ investigations by light microscopy were carried on pure Cu of bimodal grain size with microcrystalline grains embedded in sub-microcrystalline matrix. For quantitative description of strain field the Digital Image Correlation method was used. As a result of the performed examinations it was found that a crack propagating in a material with bimodal grain size distribution meanders, due to which fracture surface is not flat. This allows presuming that materials with such structure have higher resistance to cracking than materials with homogeneous grain size distribution. In situ SEM fracture studies were performed on the coarse grain Al sample directly in the vacuum chamber of SEM, equipped with tensile test device. The sample with a thickness of 0.2 mm was pre-notched by means of electro polishing. The processes of strain localization, crack initiation and propagation have been investigated with details showing distribution of slip bands. A 316 type stainless steel for the in situ TEM dislocation pile ups against grain boundary studies as an appropriate material having low stacking fault energy has been chosen. An increase of dislocation number in the pile ups as well as a slip of the dislocation in the opposite direction was registered and analyzed in detail. The presented research results show that in situ examinations are useful in revealing phenomena occurring in the crack tip plastic zone. These investigations can be conducted at various length scales, which allows to reveal various phenomena, starting from quantitative description of deformation in case of examinations with use of light microscopy, through SEM examination of slip bands, up to an analysis of individual dislocations behaviour in case of transmission electron microscopy.
Journal of the Mechanics and Physics of Solids, 1992
DISLOCATION nucleation from a stressed crack tip is analyzed based on the Peierls concept. A periodic relation between shear stress and atomic shear displacement is assumed to hold along the most highly stressed slip plane emanating from a crack tip. This allows some small slip displacement to occur near the tip in response to small applied loading and, with increase in loading, the incipient dislocation configuration becomes unstable and leads to a fully formed dislocation which is driven away from the crack. An exact solution for the loading at that nucleation instability is developed via the J-integral for the case when the crack and slip planes coincide, and an approximate solution is given when they do not. Solutions are also given for emission of dissociated dislocations, especially partial dislocation pairs in fcc crystals. The leveJ of applied stress intensity factors required for dislocation nucleation is shown to be proportional to x/)'u,, where 7,,., the unstable stacking energy, is a new solid state parameter identified by the analysis. It is the maximum energy encountered in the block-like sliding along a slip plane, in the Burgers vector direction, of one half of a crystal relative to the other. Approximate estimates of ~,~j are summarized and the results are used to evaluate brittle vs ductile response in fcc and bcc metals in terms of the competition between dislocation nucleation and Griffith cleavage at a crack tip. The predictions seem compatible with known behavior and also show that in many cases solids which are predicted to first cleave under pure mode I loading should instead first emit dislocations when that loading includes very small amounts of mode II and III shear. The analysis in this paper also reveals a feature of the near-tip slip distribution corresponding to the saddle point energy configuration for cracks that are loaded below the nucleation threshold, as is of interest for thermal activation.
Engineering Fracture Mechanics, 2015
Atomic-scale fracture processes are traditionally investigated in quasi-2D models of straight, infinite cracks. This approach neglects crack front curvature effects, which might be particularly important for nanoscale crack nuclei in semi-brittle materials. Here we use 3D atomistic simulations to study penny-shaped cracks in body-centered cubic metals. Our results show extensive crack tip plasticity initiated by deformation twinning and followed by emission of screw dislocations which cross-slip along the crack front. Together with the interactions of dislocations and/or twins that are nucleated at differently oriented parts of the crack, these processes determine the fracture behavior of highly curved nanoscale cracks.
Fracture of Nano and Engineering Materials and Structures, 2006
The miniaturisation and the complexity of optical laser devices has been the focal centre of many industries in recent years. One key issue of the processing is the dicing of laser bars and devices. This process is constituted by the two crucial operations which are (1) the scratching and (2) the cleavage. The goal of the first operation is to create a subsurface crack aligned with a cleavage plane. This crack is required to be able to control the crack initiation and propagation, even in brittle materials such as Gallium-Arsenide (GaAs) so that atomically flat surfaces can be achieved [1]. Unfortunately, scribing semiconductors with a diamond tip does not only induce the defect needed but also some undesirable features such as radial cracks (chevrons) and particles. The purpose of the second operation is the separation of the laser bars and/or individual lasers. In order to investigate these two operations, two special apparatus, working inside a Scanning Electron Microscope (SEM), were employed. It was found that the scratching velocity and tip direction (edge first or face first) have only little influence on the onset of radial cracks and chips. However, the tip direction affects the size and number of the chips. Additionally, the depth of the initial crack, a, for subsequent cleavage, can be related to the applied load, P S , by the following power law: a 3/2 ∝ PS. PS has been found to be inversely related to PC. Finally, the scatter measured in PC is dependent on the scratching load P S. This is due to the fact that at high P S values, the median cracks are not constant throughout the scratch length and some deeper points exist which act as stress concentrations.
Philosophical transactions. Series A, Mathematical, physical, and engineering sciences, 2015
To better understand the relationship between the nucleation and growth of defects and the local stresses and phase changes that cause them, we need both imaging and stress mapping. Here, we explore how this can be achieved by bringing together synchrotron X-ray diffraction and tomographic imaging. Conventionally, these are undertaken on separate synchrotron beamlines; however, instruments capable of both imaging and diffraction are beginning to emerge, such as ID15 at the European Synchrotron Radiation Facility and JEEP at the Diamond Light Source. This review explores the concept of three-dimensional crack-tip X-ray microscopy, bringing them together to probe the crack-tip behaviour under realistic environmental and loading conditions and to extract quantitative fracture mechanics information about the local crack-tip environment. X-ray diffraction provides information about the crack-tip stress field, phase transformations, plastic zone and crack-face tractions and forces. Time-l...
Physics and Chemistry of Minerals, 2008
The terminal velocity of a crack determines whatever classical or quantum approaches are appropriate to describe phenomena at the crack tip. The expression for the fractoemission intensity of crystals accounting for the quantum character of the energy transfer at the crack tip is obtained. Relationships of classical mechanics and statistical physics are applied to numerical aspects of energy balance on the front of a main crack, with reference to the cleavage of alkali halide crystals. The possibility of nanoparticle emission during dynamic fracture of solids is confirmed theoretically.
Scripta Metallurgica, 1988
lntroduction Dislocation emission from the tip of a propagating crack has been shown to be an important factor in determining the fracture toughness and ductile to brittle transition temperature (DBTF) of many crystalline solids (Gilman et al [1], Burns & Webb [2], St.John [3], and Brede & Haasen [4]). Emitted dislocations reduce the stress intensity factor at the crack tip and slow its motion by crack tip blunting and dislocation shielding. However, many analyses to date, most notably that of Rice & Thomson [5], have considered only dislocation nucleation on slip planes which contain the crack front. Argon [6] has described the DBTT by analyzing dislocation emission on planes inclined to the crack front for isotropic materials. The purpose of this paper is to show that for some anisotropic materials of cubic symmetry under mode I crack loading, the resolved shear stress is greater on slip planes which are inclined 45 ° to the crack front rather than on planes which contain the crack front.
Journal of Materials Science
This paper presents a study of microscale plastic deformation at the crack tip and the effect of microstructure feature on the local deformation of aluminum specimen during fracture test. Three-point bending test of aluminum specimen was conducted inside a scanning electron microscopy (SEM) imaging system. The crack tip deformation was measured in situ utilizing SEM imaging capabilities and the digital image correlation (DIC) full-field deformation measurement technique. The microstructure feature at the crack tip was examined to understand its effect on the local deformation fields. Microscale pattern that was suitable for the DIC technique was generated on the specimen surface using sputter coating through a copper mesh before the fracture test. A series of SEM images of the specimen surface were acquired using in situ backscattered electronic imaging (BEI) mode during the test. The DIC technique was then applied to these SEM images to calculate the full-field deformation around the crack tip. The grain orientation map at the same location was obtained from electron backscattered diffraction (EBSD), which was superimposed on a DIC strain map to study the relationship between the microstructure feature and the evolution of plastic deformation at the crack tip. This approach enables to track the initiation and evolution of plastic deformation in grains adjacent to the crack tip. Furthermore, bifurcation of the crack due to intragranular and intergranular crack growth was observed. There was also localization of strain along a grain boundary ahead of and parallel to the crack after the maximum load was reached, which was a characteristic of Dugdale–Barenblatt strip-yield zone. Thus, it appears that there is a mixture of effects in the fracture process zone at the crack tip where the weaker aspects of the grain boundary controls the growth of the crack and the more ductile aspects of the grains themselves dissipate the energy and the corresponding strain level available for these processes through plastic work.
Journal of Materials Science, 1987
A new picture of environmentally-enhanced fracture in highly brittle solids is presented. It is asserted that the fundamental relations for crack growth are uniquely expressible in terms of the surface force functions that govern the interactions between separating walls in an intrusive medium. These functions are the same, in principle, as those measured directly in the newest submolecular-precision microbalance devices. A fracture mechanics model, based on a modification of the Barenblatt cohesive zone concept, provides the necessary framework for formalizing this link between crack relations and surface force functions. The essence of the modification is the incorporation of an element of discreteness into the surface force function, to allow for geometrical constraints associated with the accommodation of intruding molecules at the crack walls. The model accounts naturally for the existence of zero-velocity thresholds; further, it explains observed shifts in these thresholds in cyclic load-unload-reload experiments, specifically the reduction in applied loading needed to propagate cracks through healed as compared to virgin interfaces. The threshold configurations emerge as thermodynamic equilibrium states, definable in terms of interfacial surface energies. Crack velocity data for cyclic loading in mica, fused silica and sapphire are presented in support of the model. Detailed considerations of the theoretical crack profiles in these three materials, with particular attention to the atomic structure of the "lattice" (elastic sphere approximation) at the interfaces, shows that intruding molecules must encounter significant diffusion barriers as they penetrate toward the tip region. It is concluded that such diffusion barriers control the fracture kinetics at low driving forces. At threshold the barriers become so large that the molecules can no longer penetrate to the tip region. This leads to a crucial prediction of our thesis, that the cohesive Zone consists of two distinct parts: a "protected" primary zone adjacent to the tip, where intrinsic binding forces operate without influence from environmental influences; and a "reactive" secondary zone more remote from the tip, where extrinsic interactions with intruding chemical species are confined. The prevailing view of chemically enhanced brittle fracture, that crack velocity relations are determined by a concerted reaction with reactive species at a single line of crack-tip bonds, is seen as a limiting case of our model, operative at driving forces well above the threshold level. The new description offers the potential for using brittle fracture as a tool for investigating surface forces themselves.
Microscopy, 2015
The dislocation shielding field at a crack tip was experimentally proven at the atomic scale by measuring the local strain in front of the crack tip using high-resolution transmission electron microscopy (HRTEM) and geometric phase analysis (GPA). Single crystalline (110) silicon wafers were employed. Cracks were introduced using a Vickers indenter at room temperature. The crack tip region was observed using HRTEM followed by strain measurements using GPA. The measured strain field at the crack tip was compressive owing to dislocation shielding, which is in good agreement with the strain field calculated from elastic theory.
Fracture analysis is one important role in a material characterization. Many theory and observation on the subject especially after the matter was broken or post cracked, but on the other hand, as far as author knowledge, only a few research are did in in situ observation on micro crack propagation, because of the propagation is in a micrometer scale and can't be observed using a naked eye and has difficulties to observed using standard optical microscope. In this study, different material are observed, the micro cracks propagation in Aluminum foil is observed in an in situ mode using an optical microscope during loaded in an axial tensile mode, the other is a Si thin plate was observed using TEM after compressed in axial compressed.
Materials Science and Engineering: A
The newly introduced combination of focused ion beam technique with high resolution scanning electron microscopy is the first method to initiate artificial microcracks with idealized crack parameters in front of selected phase-and grain boundaries. The boundaries of interest are selected after a complete sample characterization by Electron Back Scatter Diffraction and a calculation of the preferred slip systems within each grain. This combination of characterizing-and manipulating techniques on a microscale enables for the first time a systematic investigation of the interaction of short cracks with microstructural barriers to check the models of Tanaka, Navarro and De Los Rios quantitatively. In this paper, different notch geometries from single lines to penny shaped surface cracks for the initiation of artificial microcracks are presented. It is shown that not only the starting point of a crack can be selected. Further, the crack propagation path can be predetermined by initiating the crack directly on a slip system with a high Schmid factor. As a first result the influence of grain boundaries with different misorientation angles on the crack propagation rate for a directionally solidified nickel-based superalloy is shown. Finally this method is discussed as a powerful technique for grain boundary engineering.
Ceramic Transactions, 2007
To investigate the possibility of cavity formation in silica glass during subcritical crack growth, the topography of fracture surfaces formed in water at a crack velocity of 8.10 -11 m/s was mapped using an atomic force microscope. The objective of the study was to determine how well the two halves of a crack in silica glass matched by establishing a three dimensional quantitative comparison of the shape of the two surfaces. This procedure uses a minimization routine to correct first order and quadratic deformations between the two AFM images of the crack surfaces. A three-dimensional image representing topographical differences between the corresponding fracture surfaces followed a Gaussian law centered on zero with a standard deviation, , of 0.22 nm. Within the resolution of the technique, 6 nm within the fracture surface and ~ 0.3 nm normal to the fracture surface, no evidence for cavitation was found in silica glass.
1994
Atomic scale changes of structure around a crack-tip in an f.c.c, crystal under in-plane shear (mode II) loading are analyzed by molecular dynamics simulation (MD simulation), and its counterpart in the continuum crystal plasticity model is discussed. A ductile fracture process involving dislocation nucleation from the stressed tip is always observed. The nucleated dislocation is driven away from the crack and a dislocation-free zone develops in the near-tip region. Time averages of local stress in the near-tip region, both before and after dislocation nucleation, coincide well with the linear elastic prediction. The critical stress intensity factor estimated by MD simulation agrees well with Rice's theoretical prediction derived from the unstable stacking energy concept. The temperature dependence of the critical factor can be explained primarily as a thermally activated process. © 1994 -Elsevier Sequoia. All rights reserved ,%'DI 0921-5093(93)02520-D
Physical Review B, 2005
We have performed a systematic molecular dynamics study of the competition between crack growth and dislocation emission from a crack tip. Two types of boundary conditions are adopted: either planar extension or boundary displacements according to the anisotropic mode-I asymptotic continuum solution. The effects of temperature, loading rate, crystal orientation, sharpness of the crack tip, atomic potential, and system size are investigated. Depending on the crystal orientation, dislocation nucleation can be driven either by the strain or by concerted fluctuations at the crack tip. In the latter case, crystal orientation and temperature have the largest influence on the process of dislocation nucleation.
1999
The effects of thermal activation on the dislocation emission from an atomistic crack tip are discussed. Molecular dynamics simulations at different constant temperatures are carried out to investigate the thermal effects. The simulated results show that the processes of the partial dislocation generation and emission are temperature dependent. A s the temperature increases, the incipient duration of the partial dislocation nucleation becomes longer, the critical stress intensity factor for partial dislocation emission is reduced and, at the same loading level, more dislocations are emitted. The dislocation velocity moving away from the crack tip and the separations of partial dislocations are apparently not temperature dependent. The simulated results also show that, a s the temperature increases, the stress distribution along the crack increases slightly. Therefore stress softening at the crack tip induced by thermal activation does not exist in the present simulation. A simple model is proposed to evaluate the relation of the critical stress intensity factor versus temperature. The obtained relation is in good agreement with our molecular dynamics results.
Mechanical Engineering Journal, 2014
In order to determine the effect of triple junction on the crack initiation, we use the finite element method to investigate the effect of misorientation between Cu grains on the stress concentration near the triple junction in comparison to that near a free edge. The results reveal that the triple junction represents a greater danger for crack initiation than the free edge in nano-components over a wide range of grain combinations. The stress concentration near the triple junction is governed by the difference in stiffness between the grains. Thus, the combination of the stiffest and softest grains induces the highest stress concentration.
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