{"id":24261470,"date":"2025-07-29T00:15:41","date_gmt":"2025-07-29T07:15:41","guid":{"rendered":"https:\/\/semiengineering.com\/?p=24261470"},"modified":"2025-07-29T09:05:44","modified_gmt":"2025-07-29T16:05:44","slug":"changes-in-scan-test-data","status":"publish","type":"post","link":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/","title":{"rendered":"Changes In Scan Test Data"},"content":{"rendered":"<p>Bigger designs with hundred of cores are creating an explosion in the volume of scan test data, significantly bumping up the amount of time spent on test. That raises the cost of test, forcing chipmakers to trade off higher costs with reliability. The solution is to raise the level of abstraction for scan tests, using a bus and packetized data that can run at much higher frequencies than is possible with the internal scan chains in each core. Ron Press, senior director of technology enablement at Siemens EDA, talks about what needs to change in the scan test architecture to make all this work, along with the advantages of using different sized patterns for different cores, and how that can improve reliability while reducing costs.<\/p>\n<p><iframe loading=\"lazy\" src=\"https:\/\/www.youtube.com\/embed\/slvzAUN63Jw\" width=\"480\" height=\"270\" frameborder=\"0\" allowfullscreen=\"allowfullscreen\"><\/iframe><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Better management of data in multi-core designs.<\/p>\n","protected":false},"author":43,"featured_media":24225429,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2},"jetpack_post_was_ever_published":false},"categories":[9786,1129],"tags":[2316,10202,253,46967,322,9993,45448],"class_list":["post-24261470","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-packaging-and-test","category-youtube","tag-ai","tag-chiplets","tag-mentor","tag-packetized-data","tag-reliability","tag-scan-test","tag-siemens-eda"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v28.3 (Yoast SEO v28.3) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>Changes In Scan Test Data<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/semiengineering.com\/changes-in-scan-test-data\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Changes In Scan Test Data\" \/>\n<meta property=\"og:description\" content=\"Better management of data in multi-core designs.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/semiengineering.com\/changes-in-scan-test-data\/\" \/>\n<meta property=\"og:site_name\" content=\"Semiconductor Engineering\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/SemiEngineering\" \/>\n<meta property=\"article:published_time\" content=\"2025-07-29T07:15:41+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-07-29T16:05:44+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg\" \/>\n\t<meta property=\"og:image:width\" content=\"2560\" \/>\n\t<meta property=\"og:image:height\" content=\"1440\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Ed Sperling\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@SemiEngineering\" \/>\n<meta name=\"twitter:site\" content=\"@SemiEngineering\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Ed Sperling\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/\"},\"author\":{\"name\":\"Ed Sperling\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/#\\\/schema\\\/person\\\/1ef5cdf9bfede4476fa93023899f37fb\"},\"headline\":\"Changes In Scan Test Data\",\"datePublished\":\"2025-07-29T07:15:41+00:00\",\"dateModified\":\"2025-07-29T16:05:44+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/\"},\"wordCount\":130,\"commentCount\":0,\"image\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1\",\"keywords\":[\"AI\",\"chiplets\",\"Mentor\",\"packetized data\",\"reliability\",\"scan test\",\"Siemens EDA\"],\"articleSection\":[\"Test, Measurement and Analytics\",\"Videos\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#respond\"]}],\"copyrightYear\":\"2025\",\"copyrightHolder\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/#organization\"}},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/\",\"url\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/\",\"name\":\"Changes In Scan Test Data\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1\",\"datePublished\":\"2025-07-29T07:15:41+00:00\",\"dateModified\":\"2025-07-29T16:05:44+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/#\\\/schema\\\/person\\\/1ef5cdf9bfede4476fa93023899f37fb\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#primaryimage\",\"url\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1\",\"contentUrl\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1\",\"width\":2560,\"height\":1440,\"caption\":\"Abstract Technical Blueprint style of Macro view of CPU socket on PC. Mainboard Electronic computer background with Bokeh 3d render\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/changes-in-scan-test-data\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/semiengineering.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Changes In Scan Test Data\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/#website\",\"url\":\"https:\\\/\\\/semiengineering.com\\\/\",\"name\":\"Semiconductor Engineering\",\"description\":\"Deep Insights For Chip Engineers\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/semiengineering.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/semiengineering.com\\\/#\\\/schema\\\/person\\\/1ef5cdf9bfede4476fa93023899f37fb\",\"name\":\"Ed Sperling\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/43.thumbnail.jpg?resize=66%2C80&ssl=1\",\"url\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/43.thumbnail.jpg?resize=66%2C80&ssl=1\",\"contentUrl\":\"https:\\\/\\\/i0.wp.com\\\/semiengineering.com\\\/wp-content\\\/uploads\\\/43.thumbnail.jpg?resize=66%2C80&ssl=1\",\"caption\":\"Ed Sperling\"},\"description\":\"Ed Sperling is the editor in chief of Semiconductor Engineering.\",\"url\":\"https:\\\/\\\/semiengineering.com\\\/author\\\/esperling\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"Changes In Scan Test Data","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/","og_locale":"en_US","og_type":"article","og_title":"Changes In Scan Test Data","og_description":"Better management of data in multi-core designs.","og_url":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/","og_site_name":"Semiconductor Engineering","article_publisher":"https:\/\/www.facebook.com\/SemiEngineering","article_published_time":"2025-07-29T07:15:41+00:00","article_modified_time":"2025-07-29T16:05:44+00:00","og_image":[{"width":2560,"height":1440,"url":"https:\/\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg","type":"image\/jpeg"}],"author":"Ed Sperling","twitter_card":"summary_large_image","twitter_creator":"@SemiEngineering","twitter_site":"@SemiEngineering","twitter_misc":{"Written by":"Ed Sperling","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#article","isPartOf":{"@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/"},"author":{"name":"Ed Sperling","@id":"https:\/\/semiengineering.com\/#\/schema\/person\/1ef5cdf9bfede4476fa93023899f37fb"},"headline":"Changes In Scan Test Data","datePublished":"2025-07-29T07:15:41+00:00","dateModified":"2025-07-29T16:05:44+00:00","mainEntityOfPage":{"@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/"},"wordCount":130,"commentCount":0,"image":{"@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#primaryimage"},"thumbnailUrl":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1","keywords":["AI","chiplets","Mentor","packetized data","reliability","scan test","Siemens EDA"],"articleSection":["Test, Measurement and Analytics","Videos"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/semiengineering.com\/changes-in-scan-test-data\/#respond"]}],"copyrightYear":"2025","copyrightHolder":{"@id":"https:\/\/semiengineering.com\/#organization"}},{"@type":"WebPage","@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/","url":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/","name":"Changes In Scan Test Data","isPartOf":{"@id":"https:\/\/semiengineering.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#primaryimage"},"image":{"@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#primaryimage"},"thumbnailUrl":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1","datePublished":"2025-07-29T07:15:41+00:00","dateModified":"2025-07-29T16:05:44+00:00","author":{"@id":"https:\/\/semiengineering.com\/#\/schema\/person\/1ef5cdf9bfede4476fa93023899f37fb"},"breadcrumb":{"@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/semiengineering.com\/changes-in-scan-test-data\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#primaryimage","url":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1","contentUrl":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1","width":2560,"height":1440,"caption":"Abstract Technical Blueprint style of Macro view of CPU socket on PC. Mainboard Electronic computer background with Bokeh 3d render"},{"@type":"BreadcrumbList","@id":"https:\/\/semiengineering.com\/changes-in-scan-test-data\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/semiengineering.com\/"},{"@type":"ListItem","position":2,"name":"Changes In Scan Test Data"}]},{"@type":"WebSite","@id":"https:\/\/semiengineering.com\/#website","url":"https:\/\/semiengineering.com\/","name":"Semiconductor Engineering","description":"Deep Insights For Chip Engineers","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/semiengineering.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/semiengineering.com\/#\/schema\/person\/1ef5cdf9bfede4476fa93023899f37fb","name":"Ed Sperling","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/43.thumbnail.jpg?resize=66%2C80&ssl=1","url":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/43.thumbnail.jpg?resize=66%2C80&ssl=1","contentUrl":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/43.thumbnail.jpg?resize=66%2C80&ssl=1","caption":"Ed Sperling"},"description":"Ed Sperling is the editor in chief of Semiconductor Engineering.","url":"https:\/\/semiengineering.com\/author\/esperling\/"}]}},"jetpack_publicize_connections":[],"jetpack_sharing_enabled":true,"jetpack_shortlink":"https:\/\/wp.me\/p9HsLC-1DNw2","jetpack_featured_media_url":"https:\/\/i0.wp.com\/semiengineering.com\/wp-content\/uploads\/AdobeStock_278047901-05-25-scaled.jpeg?fit=2560%2C1440&ssl=1","_links":{"self":[{"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/posts\/24261470","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/users\/43"}],"replies":[{"embeddable":true,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/comments?post=24261470"}],"version-history":[{"count":3,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/posts\/24261470\/revisions"}],"predecessor-version":[{"id":24261502,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/posts\/24261470\/revisions\/24261502"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/media\/24225429"}],"wp:attachment":[{"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/media?parent=24261470"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/categories?post=24261470"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/semiengineering.com\/wp-json\/wp\/v2\/tags?post=24261470"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}