Special Reports

CFETs Forge Better Connections

By: Laura Peters

Performance advantage may come down to material choices and precise interconnect decisions.
Copper’s Grip On AI Scaling Is Starting To Slip

By: Bryon Moyer

As AI clusters push beyond rack-scale limits, optical interconnects and circuit switching are reshaping how data centers scale.
HBM Becomes Testbed For 3D Assembly Yield

By: Laura Peters

High-bandwidth memory has become a proving ground for 3D stack testing, DFT, and reliability.

 more »

Top Stories

How Will The Custom HBM Business Work?

 There is no one-size-fits-all — yet.
August 20th, 2026 By Bryon Moyer

Managing Thermal Expansion And Electromigration Through Interposer Design

 New deep learning models may provide a pathway for modeling warpage.
August 20th, 2026 By Katherine Derbyshire

The Future Of AI Compute Won’t Run On Just One Kind Of Chip

 Power, token cost, interconnects, and software orchestration are pushing data centers t...
August 19th, 2026 By Liz Allan

Semiconductor Earnings Roundup: Revenue, Growth and Takeaways

 Company-by-company breakdown: Earnings across 80 semiconductor companies show AI-driven...
August 18th, 2026 By Linda Christensen

800VDC Pushes AI Power Design From Grid To Gate

 The next power bottleneck is no longer just inside the accelerator — it is the full c...
August 17th, 2026 By Liz Allan

The 1-Megawatt Rack Debate

 Is it better to cram more compute into each rack or rethink the architecture?
August 13th, 2026 By Ann Mutschler

Vertical Integration Becoming Pervasive

 No system can be optimized without an understanding of both the hardware and software, ...
August 13th, 2026 By Brian Bailey

How Long Does A Measurement Remain Valid?

 Measurements can be misleading after the chip, the test path, or the assumptions behind...
August 11th, 2026 By Gregory Haley

CPO Test Won’t Scale Without Standardization

 Across the CPO ecosystem, profitability will not happen until standardization occurs.
August 11th, 2026 By Anne Meixner

As Space Gets Connected, Security Gets Critical

 NASA is in the process of bringing terrestrial internet capabilities to astronauts, rov...
August 6th, 2026 By Liz Allan

The Next Big Chip Failure May Be A Security One

 Semiconductor leaders say hardware trust, verification, and lifecycle resilience must b...
August 6th, 2026 By Ann Mutschler

Scale Up, Scale Out Challenges Amplified For Clusters

 Compute clusters offer more processing capacity but at the cost of higher power. Softwa...
August 5th, 2026 By Liz Allan

Self-Driving Cars Have An Aging Problem

 AI workloads are pushing automotive sensors harder, forcing engineers to rethink how lo...
August 3rd, 2026 By Brendan Heffernan

Compute Clusters Break Out Of National Labs To Scale AI

 For compute-intensive applications, clusters of nodes that act as a single computer off...
July 30th, 2026 By Liz Allan

Flat Enough? Warpage Management Gets Harder In Advanced Packaging

 As packages get larger and thinner, warpage is becoming a process-control problem rathe...
July 29th, 2026 By Gregory Haley

Preparing For AI-Driven Chip Design And Verification

 Jobs, markets, and economics are undergoing dramatic changes, but it's still too early ...
July 27th, 2026 By Ed Sperling

Untangling Chip Traffic Jams

 Scaling NoCs across chiplets requires earlier validation of coherency, congestion, ther...
July 23rd, 2026 By Liz Allan

Designing Electro-Optical Chips

 Photonics is forcing EDA to verify not just chips, but the physics of light inside full...
July 23rd, 2026 By Ann Mutschler

The Impact Of AI Automation On Chip Design

 Change is coming, but how quickly depends on the availability of data and when chipmake...
July 23rd, 2026 By Brian Bailey

From Highways To Health Care: Portability Proves Key To Physical AI

 Success at the edge takes advantage of common threads — lithography, imaging, chiplet...
July 22nd, 2026 By Laura Peters

more top stories »

Latest News

Chip Industry Week In Review

 New Micron lab; chip/AI price jump; multi-die monitoring; cryo links for quantum chips; interconnect RC bottleneck; 18A win; CPO roadmap; 2 new CEOs; humanoid rea...
August 21st, 2026 By The SE Staff

Blog Review: Aug. 19

 Memory tagging; digital twin of the Moon; packaging moves front-and-center; streaming sensor data.
August 19th, 2026 By Jesse Allen

Semiconductor Earnings Roundup: Revenue, Growth and Takeaways

 Company-by-company breakdown: Earnings across 80 semiconductor companies show AI-driven demand extending well beyond the usual suspects.
August 18th, 2026 By Linda Christensen

more news »



Opinion

How Data Center AI Can Keep Growing, Despite Supply Chain Bottlenecks

 Efficiency is key for the next two to five years. But what hap...
August 10th, 2026 By Geoff Tate

Invest In Junior Engineers

 Instead of working out how to replace junior engineers with AI...
August 4th, 2026 By Brian Bailey

more opinions »



Research

Chip Industry Technical Paper Roundup: Aug. 18

 2D CFET scaling; PIM chiplet voltage-droop control; advanced-n...
By Linda Christensen

Research Bits: Aug. 18

 Edge AI hardware/algorithm co-design; memtransistor with progr...
By Jesse Allen

Chip Industry Technical Paper Roundup: Aug. 10

 Ultrafast optical switching in doped semis; PIM simulation; fo...
By Linda Christensen

more research »



Startup Corner

Startup Funding: Q2 2026

 Plenty of cash for AI and its enablers; 80 startups raise over...
By Jesse Allen

Startup Funding: Q1 2026

 Massive rounds for AI, EDA, and manufacturing; 80 startups rai...
By Jesse Allen

more startups »

Videos

AI Agent Orchestration For ASIC Autonomy

July 27th, 2026

Verifying Networks On Chip

July 20th, 2026

AI Models On The Edge

July 14th, 2026

How Far Left Can You Shift?

June 24th, 2026

Knowledge Centers / Entities, people and technologies explored

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