Lingkang ZHU
I am a first year PhD student in Electrical and Electronic Engineering at The Hong Kong Polytechnic University (PolyU), with research interests in computer architecture and the intersection between software and hardware systems.
Prior to starting my PhD journey, I received a BSc in Computer Science with First Class Honours from the University of Nottingham Ningbo China (UNNC), supervised by Prof. Heng Yu. I was also honored as an Outstanding Graduate. During my third undergraduate year, I participated in an exchange program at the University of Nottingham, UK.
news
| Nov 05, 2025 | 📄 Our paper Multi-Level Interconnect Planning for Signal-Power-Thermal Integrity in 2.5D/3D Integration was accepted by ISPD’26! |
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| Jul 13, 2025 | 🎓 I am graduated with BSc Computer Science (First Class Honours) from UNNC, awarded Outstanding Graduate! Next step: beginning my PhD at PolyU. Hello, Hong Kong! |
| May 11, 2025 | 📄 Our paper Electrothermal Simulation and Vertical Interconnect Planning for Integrated Chiplets was presented at ISEDA’25 and received the Honorable Mention Paper Award! |
- Kowloon, Hong Kong
Google Scholar
- GitHub
- ORCID
- ResearchGate
selected publications
- ISPD’26Multi-Level Interconnect Planning for Signal-Power-Thermal Integrity in 2.5D/3D IntegrationIn 2026 35th International Symposium on Physical Design (ISPD), Bonn, Germany, Mar 2026
- FCCM’25