JLCPCB Blog

Components & Sourcing

Ceramic Quad Flat Package (CQFP): Design, Reliability, Assembly, and When to Use It

When system failure is not acceptable, IC package selection becomes a reliability-driven engineering decision rather than a cost-driven one. In such scenarios, the limitations of plastic IC packages quickly emerge under sustained thermal stress, vibration, and harsh environmental exposure. This is precisely where the Ceramic Quad Flat Package (CQFP) remains a deliberate choice. Unlike plastic QFPs, CQFP packages offer hermetic sealing, superior dimensional stability, and predictable long-term aging—ch......

Jan 16, 2026

PCB Structures & Fundamentals

PCBs Explained: A Simple Guide to Printed Circuit Boards

Printed Circuit Boards (PCBs) are the essential building blocks behind almost all modern electronic devices. PCBs play an important role in that they provide electrical interconnections between electronic components, rigid support to hold components, and a compact package that can be integrated into an end product. They are the main component in an electronic device that is responsible for form and function, and they allow advanced semiconductors to communicate with each other at very high data rates.......

Nov 25, 2024

Components & Sourcing

Everything You Need to Know about BGA Technology in PCB Assembly

Ball Grid Array (BGA) is a leadless surface-mount package widely used in high-density and high-speed PCB designs. It features an array of solder balls on the underside, providing high I/O density, better signal integrity, and thermal performance. This guide covers what is BGA, different types of BGA packages, advantages and disadvantages, assembly requirements, inspection methods, and common defect solutions, helping engineers make informed decisions in PCB manufacturing. What is Ball Grid Array (BGA)......

Feb 27, 2024

Components & Sourcing

7 Types of BGA (Ball Grid Array) Packages Explained

Key Takeaways: BGA Package Types ● BGA packages enable high I/O density and improved electrical performance for HDI PCBs. ● Different BGA types are optimised for cost, thermal performance, signal integrity, or reliability. ● Selecting the wrong BGA package can lead to reflow defects, thermal failure, or SI/PI issues. ● Proper package selection must align with PCB stackup, reflow profile, and application environment. The Ball Grid Array (BGA) packages have made a very big impact on the High-Density Int......

Jan 15, 2026

PCB Materials Science

PCB Copper Pour Basics

What is Copper Pour in PCB Design? Copper pour refers to the technique of filling unused areas of a PCB's copper layers with solid copper planes. These planes are connected to power or ground nets, creating a continuous conductive path. Copper pour is typically used in the power and ground planes, as well as in signal layers for specific purposes. Purpose and Benefits of Copper Pour: Copper pour is primarily used to fill unused areas on PCB copper layers with solid (or hatched) copper connected to pow......

Aug 30, 2023

PCB Structures & Fundamentals

Guide to the Top 10 Commonly Used Electronic Components

Electronic components are fundamental elements of electronic technology serving as the essential building blocks of electronic circuits. As technology and its applications advance rapidly, the number of components used in design processes is increasing daily.It is crucial for electronic engineers or enthusiasts to master the characteristics and applications of commonly used electronic components. This article introduces the top ten electronic components commonly used by engineers and provides guidance......

Jan 30, 2024