To date the ion beam sputtering deposition (IBSD) technique has been used to deposit metallic, di... more To date the ion beam sputtering deposition (IBSD) technique has been used to deposit metallic, dielectric, superconductor and semiconductor films ∣1∣. Many promising results have been obtained, for example good mechanical characteristics of the films. In the demanding domain of microelectronics, a thorough knowledge, theoretical as well as experimental, of the sputtering and deposition processes seems to be necessary for determining the potential for using IBSD technique to deposit thin films ∣2∣. We have studied IBSD underlying mechanism with the aim of forming epitaxial thin films. This paper reports some results of this study.
ABSTRACT This paper presents hermeticity tests carried out on organically sealed MEMS micro-packa... more ABSTRACT This paper presents hermeticity tests carried out on organically sealed MEMS micro-packages, using Fourier Transform Infra Red (FTIR) spectroscopy. Infrared spectroscopy, classically dedicated to material analysis, can be used to monitor the internal pressure of micro-packages, and to assess so their hermeticity. This technique was applied to BCB sealed micro-packages to study the influence of different parameters on their hermeticity properties, like the sealing ring dimensions or the addition of an external coating. The technique was validated for silicon micro-packages with a volume of 5 mm3 or more. Moreover, measurements carried out on micro-cavities with external parylene coatings have demonstrated that infrared spectroscopy measurements could be performed on MEMS packages with hermetic organic coatings.
This paper presents hermetic packaging for MEMS with integrated temperature and pressure sensors ... more This paper presents hermetic packaging for MEMS with integrated temperature and pressure sensors based on Silicon On Insulator technology. Temperature and pressure are measured with a single device composed of an aluminium resistor on a suspended silicon ...
The evolution of advanced packaging techniques like multi chip modules makes the realization of p... more The evolution of advanced packaging techniques like multi chip modules makes the realization of prototypes necessary. This can be a long and costly operation. Therefore we developed methods permitting time gains to be made in two of the steps of this operation. To avoid the use of physical masks we have experimented a laser beam set for direct writing of metal and insulating layers in microcircuits. To shorten preliminary tests, we propose a theoretical model of the interaction between the laser beam and the photoresist. It permits us to predict the line widths etched in the photoresist and thus avoids the need of long calibration processes. Electrical test lines of various widths have been used as a validation tool. The precision obtained is better than 5%. Polyimides (PI) meet most of the requirements for dielectric materials. As the curing process is crucial for the properties of the final PI film, thermal treatment was the subject of optimization leading however to process time ...
Systems in Package (SiP) contain an increasing number of MEMS components such as resonators for t... more Systems in Package (SiP) contain an increasing number of MEMS components such as resonators for time references or RF filtering. These resonators are packaged at wafer level and the cavity quality has to be guaranteed in terms of pressure and moisture level by the ...
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1986
ABSTRACT Angular distributions of heavy particles — target material and energetic rare gas atoms ... more ABSTRACT Angular distributions of heavy particles — target material and energetic rare gas atoms — emitted from a Si target during a sputter process generated by 10–20 keV rare gas ions have been measured. The influence of beam characteristics — mass, energy, incidence — have been studied. The angular distribution of sputtered target material follows a cos2δ function. The rare gas distribution has a sharp shape with a maximum near the direction of the ion beam specular reflection.
ABSTRACT Temperature cycling has been used associated to FEM simulations to evaluate thermomechan... more ABSTRACT Temperature cycling has been used associated to FEM simulations to evaluate thermomechanical stresses in a MCM-V packaged MEMS. The places of maximum stresses have been localized by the simulations. The results are coherent with electrical measurements done on the assembly during and after the thermal cycling. Modifications are proposed (type of material , geometry of the package) in order to improve the reliability.
Measuring relative humidity in breath is useful for diagnosing pulmonary diseases. Humidity capac... more Measuring relative humidity in breath is useful for diagnosing pulmonary diseases. Humidity capacitive sensors were developed to equip a portable clinical device. Simulation is needed to design an electronic interface circuit to be integrated on the same chip as the sensors. A behavioral model of one of these sensors is set out in this paper. It is designed to be included in the model of the microsystem-to-be. It is based on experimental results on the static and dynamic responses of the sensor to humidity and temperature changes. Simulation results fit experimental data with an error inferior to 1%. The model is an illustration of VHDL-AMS capabilities as a modeling language to describe physical phenomena. The method of modeling can be extended to other kinds of sensors. Including the model in a simple microsystem model provides encouraging results.
IEEE Transactions on Instrumentation and Measurement, 2004
His work focuses on microtechnology, microsystem development, assembly technology, microsystems r... more His work focuses on microtechnology, microsystem development, assembly technology, microsystems reliability, and microsystems for medical applications.
To date the ion beam sputtering deposition (IBSD) technique has been used to deposit metallic, di... more To date the ion beam sputtering deposition (IBSD) technique has been used to deposit metallic, dielectric, superconductor and semiconductor films ∣1∣. Many promising results have been obtained, for example good mechanical characteristics of the films. In the demanding domain of microelectronics, a thorough knowledge, theoretical as well as experimental, of the sputtering and deposition processes seems to be necessary for determining the potential for using IBSD technique to deposit thin films ∣2∣. We have studied IBSD underlying mechanism with the aim of forming epitaxial thin films. This paper reports some results of this study.
ABSTRACT This paper presents hermeticity tests carried out on organically sealed MEMS micro-packa... more ABSTRACT This paper presents hermeticity tests carried out on organically sealed MEMS micro-packages, using Fourier Transform Infra Red (FTIR) spectroscopy. Infrared spectroscopy, classically dedicated to material analysis, can be used to monitor the internal pressure of micro-packages, and to assess so their hermeticity. This technique was applied to BCB sealed micro-packages to study the influence of different parameters on their hermeticity properties, like the sealing ring dimensions or the addition of an external coating. The technique was validated for silicon micro-packages with a volume of 5 mm3 or more. Moreover, measurements carried out on micro-cavities with external parylene coatings have demonstrated that infrared spectroscopy measurements could be performed on MEMS packages with hermetic organic coatings.
This paper presents hermetic packaging for MEMS with integrated temperature and pressure sensors ... more This paper presents hermetic packaging for MEMS with integrated temperature and pressure sensors based on Silicon On Insulator technology. Temperature and pressure are measured with a single device composed of an aluminium resistor on a suspended silicon ...
The evolution of advanced packaging techniques like multi chip modules makes the realization of p... more The evolution of advanced packaging techniques like multi chip modules makes the realization of prototypes necessary. This can be a long and costly operation. Therefore we developed methods permitting time gains to be made in two of the steps of this operation. To avoid the use of physical masks we have experimented a laser beam set for direct writing of metal and insulating layers in microcircuits. To shorten preliminary tests, we propose a theoretical model of the interaction between the laser beam and the photoresist. It permits us to predict the line widths etched in the photoresist and thus avoids the need of long calibration processes. Electrical test lines of various widths have been used as a validation tool. The precision obtained is better than 5%. Polyimides (PI) meet most of the requirements for dielectric materials. As the curing process is crucial for the properties of the final PI film, thermal treatment was the subject of optimization leading however to process time ...
Systems in Package (SiP) contain an increasing number of MEMS components such as resonators for t... more Systems in Package (SiP) contain an increasing number of MEMS components such as resonators for time references or RF filtering. These resonators are packaged at wafer level and the cavity quality has to be guaranteed in terms of pressure and moisture level by the ...
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1986
ABSTRACT Angular distributions of heavy particles — target material and energetic rare gas atoms ... more ABSTRACT Angular distributions of heavy particles — target material and energetic rare gas atoms — emitted from a Si target during a sputter process generated by 10–20 keV rare gas ions have been measured. The influence of beam characteristics — mass, energy, incidence — have been studied. The angular distribution of sputtered target material follows a cos2δ function. The rare gas distribution has a sharp shape with a maximum near the direction of the ion beam specular reflection.
ABSTRACT Temperature cycling has been used associated to FEM simulations to evaluate thermomechan... more ABSTRACT Temperature cycling has been used associated to FEM simulations to evaluate thermomechanical stresses in a MCM-V packaged MEMS. The places of maximum stresses have been localized by the simulations. The results are coherent with electrical measurements done on the assembly during and after the thermal cycling. Modifications are proposed (type of material , geometry of the package) in order to improve the reliability.
Measuring relative humidity in breath is useful for diagnosing pulmonary diseases. Humidity capac... more Measuring relative humidity in breath is useful for diagnosing pulmonary diseases. Humidity capacitive sensors were developed to equip a portable clinical device. Simulation is needed to design an electronic interface circuit to be integrated on the same chip as the sensors. A behavioral model of one of these sensors is set out in this paper. It is designed to be included in the model of the microsystem-to-be. It is based on experimental results on the static and dynamic responses of the sensor to humidity and temperature changes. Simulation results fit experimental data with an error inferior to 1%. The model is an illustration of VHDL-AMS capabilities as a modeling language to describe physical phenomena. The method of modeling can be extended to other kinds of sensors. Including the model in a simple microsystem model provides encouraging results.
IEEE Transactions on Instrumentation and Measurement, 2004
His work focuses on microtechnology, microsystem development, assembly technology, microsystems r... more His work focuses on microtechnology, microsystem development, assembly technology, microsystems reliability, and microsystems for medical applications.
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