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Browne, Robin Forsythe
Hepworth Browne
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ROYAUME UNI
Dae
28.05.20
[racer Pilcaton No PatentN,
BUR-P5893EP 114306808 8 - 1216 / 3021354
SRT ORT
Atcatel Lucent
Decision to grant a European patent pursuant to Article 97(1) EPC
Following examination of European patent application No, 14306808.8 a European patent with the title
and the supporting documents indicated in the communication pursuant to Rule 71(3) EPC (EPO Form
20040) or in the information (EPO Form 2004W, of, Notice from the EPO dated 8 June 2015, OJ EPO
2015, A52) dated 16.01.20 is hereby granted in respect of the designated Contracting States.
Patent No. 3021354
Date of filing 14.11.14
Priority claimed 1
Designated Contracting States
and Proprietor(s) AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HUIE IS IT LI
LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR.
Alcatel Lucent
Site Nokia Paris Saclay
Route de Villejust
91620 Nozay/FR.
This decision will take effect on the date on which the European Patent Bulletin mentions the grant
(An. 97(3) EPC),
The mention of the grant will be published in European Patent Bulletin 20/26 of 24.06.20.
Examining Division
‘Ohanovici, Zoltan-Ca Fedrigo, Enrico ‘Agreda Labrador, Alv
Registered letter to EPO postal service: 22.05.20
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14 May 2020
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BUR-P5893EP
[Link]
[Link] (2 p.)
CLMSTRAN-DE.pdfiS11102TRAAnsp
riche [Link] (2 p.)
[Link]
[Link] claims as
filed. pdf (3 p.)
[Link]
Online
14 May 2020, 14:37 (CEST)
[Link] :20:80:B7:12:B5:0E:DE:85:9A:A1:02:2D:6A:5F:08-F2:4A,
‘European Patent Office!
Page 1 of 11) Equipement (100, 200, 300, 400) comprenant :
une premiére source de chaleur (111, 260, 360, 411) ;
un fluide (112, 212, 312, 412) ;
une premiére chambre (113a, 213a, 313a, 413a) et une deuxiéme
chambre (113b, 213, 313b, 413b) connectée l'une & l'autre via un
canal (140, 240, 440) +
selon lequel la premiére source de chaleur (111, 260, 360, 411)
est configurée pour chauffer le fluide (112, 212, 312, 412) dans
la premiére chambre (113a, 213a, 313a, 413a) afin de faire affluer
le fluide (112, 212, 312, 412), a travers le canal, depuis la
premiére chambre dans la deuxiéme chambre et afin d'établir un
contact thermique avec une deuxiéme source de chaleur pour
absorber de la chaleur de la deuxiéme source de chaleur (120, 220,
420).
2) Bquipement (100, 200, 300, 400) selon la revendication 1, selon
lequel le fluide est configuré pour affluer dans une premiére
direction en réponse a la réception de chaleur dans la premiére
chambre et pour affluer dans une deuxiéme direction en réponse a
la réception de chaleur dans la deuxiéme chambre.
3) Bquipement (100, 200, 300, 400) selon la revendication 1, selon
lequel le fluide est configuré pour affluer dans une premiére
direction en réponse a la réception de chaleur dans la premiére
chambre et pour affluer dans la méme premiére direction en réponse
A la réception de chaleur dans la deuxiéme chambre.
4) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendications 1 4 3, selon lequel le fluide est configuré pour
changer de phase d'un liquide vers un gaz en réponse A la
réception de chaleur en provenance de la premiére source de
chaleur.
5) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendicetions 1 4 3, selon lequel le fluide est configuré pour
effectuer une expansion thermique en réponse a la réception de
chaleur en provenance de la premiére source de chaleur.
6) Equipement (100, 200, 300, 400) selon 1’une quelconque des
revendications précédentes, selon lequel 1'équipement comprend en
outre une buse (152, 154) et un diffuseur (151, 153) situés dans
un chemin de flux du fluide selon lequel une buse (152, 154) estconfigurée pour fournir une résistance supérieure au flux du
fluide qu'un diffuseur.
7) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendications précédentes, selon lequel la premiére source de
chaleur est configurée pour chauffer le fluide dans la premiére
chambre et refroidir le fluide dans la deuxiéme chambre.
&) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendications précédentes, selon lequel la premiére source de
chaleur est un refroidisseur thermoélectrique.
9) Equipement (100, 200, 300, 400) selon la revendication 8, selon
lequel la premiére source de chaleur est située entre la premiére
chambre et la deuxiéme chambre.
10) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendications précédentes 1 @ 7, selon lequel la premiére source
de chaleur est située en dehors de la premiére chambre et
1'équipement comprend une troisiéme source de chaleur située en
dehors de la deuxiéme chambre, la troisiéme source de chaleur
étant configurée pour chauffer le fluide dans la deuxiéme chambre.
11) Bquipement (100, 200, 300, 400) selon 1"une quelconque des
revendications précédentes 1 4 7, selon lequel la premiére source
de chaleur est située dans la premiére chambre et 1'équipement
comprend une troisiéme source de chaleur située dans la deuxiéme
chambre, la troisiéme source de chaleur étant configurée pour
chauffer le fluide dans la deuxiéme chambre.
12) Equipement (100, 200, 300, 400) selon la revendication 11,
selon lequel la premiére source de chaleur et la troisiéme source
de chaleur comprennent chacune un ou plusieurs composants
électroniques ou optiques configurés pour générer de la chaleur
pendant son fonctionnement.
13) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendications précédentes, comprenant en outre une chambre de
refroidissement configurée pour refroidir le fluide avant que ce
dernier n'atteigne la deuxiéme source de chaleur.
14) Equipement (100, 200, 300, 400) selon l'une quelconque des
revendications précédentes, comprenant en outre une pluralité de
clapets unidirectionnels (461, 462, 463, 464) disposées de maniére
A permettre au fluide d'affluer dans une direction et 4 bloguer le
flux du fluide dans une direction opposée a la premiére direction.15) Ensemble de transfert de chaleur comprenant 1'équipement
selon l'une quelconque des revendications précédentes 1 a 14 et
comprenant en outre un mécanisme d'enlévement d’énergie thermique
(130, 230, 330, 430).EP 14 306 808.8 Claims (14.11.2014)
Anspriiche
1
Vorrichtung (100, 200, 300, 400) umfassend
~ eine erste Warmequelle (111, 260, 360, 411);
~ ein Fluid (112, 212, 312, 412);
7 eine erste Kammer (113a, 213a, 313a, 413a) und eine zweite Kammer (113b, 213b,
313b, 413b), die durch einen Kanal miteinander verbunden sind:
wobei die erste Warmequelle (111, 260, 360, 411) konfiguriert ist, um das Fluid (112,
212, 312, 412) in der ersten Kammer (113a, 213a, 313a, 413a) zu erwarmen, um zu
bewirken, dass das Fluid (112, 212, 312, 412) durch den Kanal, von der ersten
Kammer zur zweiten Kammer fliesst und um thermischen Kontakt mit einer zweiten
Warmequelle herzustelien, um Warme von der zweiten Warmequelle (120, 220, 420)
Zu absorbieren,
Vorrichtung (100, 200, 300, 400) nach Anspruch 1, wobei das Fluid konfiguriert ist,
um in Reaktion auf das Aufnehmen von Warme in der ersten Kammer in eine erste
Richtung zu fliessen und in Reaktion auf das Aufnehmen von Warme in der zweiten
Kammer in eine zweite Richtung zu fliessen.
Vorrichtung (100, 200, 300, 400) nach Anspruch 1, wobei das Fluid konfiguriert ist,
um in Reaktion auf das Aufnehmen von Warme in der ersten Kammer in eine erste
Richtung zu fliessen und in Reaktion auf das Aufnehmen von Warme in der zweiten
Kammer in dieselbe erste Richtung zu fliessen
Vorrichtung (100, 200, 300, 400) nach einem der Anspriiche 1 bis 3, wobei das Fluid
konfiguriert ist, um in Reaktion auf das Aufnehmen von Warme aus der ersten
Warmequelle die Phase, von Fliissigkeit zu Gas, zu wechseln.
Vorrichtung (100, 200, 300, 400) nach einem der Anspriiche 1 bis 3, wobei das Fluid
konfiguriert ist, um in Reaktion auf das Aufnehmen von Warme aus der ersten
Warmequelle eine Warmeausdehnung zu erfahren
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche, wobei
die Vorrichtung ferner eine Duse (152, 154) und einen Diffusor (151, 153) umfasst,
die auf einem Strémungsweg des Fluids angeordnet sind, wobei eine Diise (152,
184) konfiguriert ist, um der Fluidstrémung einen hoheren Widerstand
entgegenzusetzten als ein Diffusor.
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche, wobei
die erste Warmequelle konfiguriert ist, um das Fluid in der ersten Kammer zu
erwarmen und das Fluid in der zweiten Kammer zu kuhlen.
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche, wobei
die erste Warmequelle ein thermoelekttischer Kihler ist.
$11102TRA10.
11.
12
13.
14.
15.
Vorrichtung (100, 200, 300, 400) nach Anspruch 8, wobei die erste Warmequelle
zwischen der ersten Kammer und der zweiten Kammer angeordnet ist
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche 1 bis 7,
wobei die erste Warmequelle ausserhalb der ersten Kammer angeordnete ist und die
Vorrichtung eine dritte Warmequelle aufweist, die ausserhalb der zweiten Kammer
angeordnet ist, wobei die dritte Warmequelle konfiguriert ist, um das Fluid in der
zweiten Kammer zu erwarmen
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche 1 bis 7,
wobei die erste Warmequelle innerhalb der ersten Kammer angeordnet ist und die
Vorrichtung eine in der zweiten Kammer angeordnete dritte Warmequelle umfasst,
wobei die dritte Warmequelle konfiguriert ist, um das Fluid in der zweiten Kammer zu
erwarmen,
Vorrichtung (100, 200, 300, 400) nach Anspruch 11, wobei die erste Warmequelle
und die dritte Warmequelle jeweils eine oder mehrere elektronische oder optische
Komponenten umfassen, die konfiguriert sind, um wahrend des Betriebs Warme zu
erzeugen.
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche, wobei
diese ferner eine Kiihlkammer aufweist, die konfiguriert ist, um das Fluid zu kihlen,
bevor das Fluid die zweite Warmequelle erreicht.
Vorrichtung (100, 200, 300, 400) nach einem der vorhergehenden Anspriiche, wobei
diese ferner eine Vielzahl von Einwegventilen (461, 462, 463, 464) umfasst, die so
angeordnet sind, um einen Durchfluss des Fluids in eine Richtung zu erméglichen
und einen Durchfluss des Fluids in eine zu der einen Richtung entgegengesetzten
Richtung zu blockieren.
Warmelibertragungsanordung, umfassend die Vorrichtung nach einem der
vorhergehenden Anspriiche 1 bis 14 und ferner umfassend einen Mechanismus
8130, 230, 330, 430) zum Abfuhren von thermischer Energie.
$11102TRAOtte européen
Representative:
Robin Browne
Hepworth Browne
15 St Pauls Street
Leeds LS12 IG
United Kingdom,
Phone: 01132364630
Fax: 01132434275
E-mail: rfo@[Link]
Id FECRT Bice Letter accompanying subsequently filed items
80298 Munich
Germany
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BUR-PSBO3EP
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‘Atcatel Lucent
Description of document
(Crigina fe name Assigned fle name
Franch translation ofthe claims
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2___| German translation of the claims S1T10ZTRA-Anspriche komplettpdf_ | CLMSTRAN-DE pdf
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including fee for publication of the European patent
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Annotations
Form 1038 Public annotation(Hannah Rhodes; 13-05-2020)
1038-CMS-SE BUR-P5893EP
Page 1 of 2Romark(Annotat):
In response to the communication under Rule 71(), please find enclosed the French and German ciaim tanstations along with payment of
the grant fee n order to approve te txt.
Signature 1
Place Leeds, UK
Date ‘4 May 2020
Signed by ‘Robin Browne!
Capacity: Representative 1
‘Smartcard cerifcate 1
commen name: Hannah Rhodes 46436
EPO ID 46436
Isoued by: European Patent Ofice CA G2
1038-CMS-SE BUR-P5893EP Page 2 of 2‘Jor e089 20000
Annex to EPO Form 2004, Communication pursuant to Rule 71(3) EPC
Bibliographical data of European patent application No. 14 306 808.8
For the intended grant of the European patent, the bibliographical data are set out bolow, for information:
Title of invention: = Fiuidische Pumpe
= Afiuidic pump
= Pompe fluidique
Classification: INV. F04B19224 FO4B1900 HO1L23473
Date of filing: 14.11.2014
Priority claimed:
Contracting States*
for which fees have
been paid! AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GRHR HUIE IS IT LILTLU
LV MC MK MT NL NO PL PT RO RS SE SISK SMTR
Extension States*
for which fees have
boon paid:
Validation States*
for which fees have
been paid!
Applicant(s)**: Aicatel Lucent
Site Nokia Paris Saclay
Route de Villejust
91620 Nozay
FR
Inventor(s): Jeffers, Nicholas
ALCATEL-LUCENT IRELAND LTD
Blanchardstown Business
Tech P
‘Snugborough Road
Dublin, Blanchardstown
le
Stafford, Jason
‘ALCATEL-LUCENT IRELAND LTD
Blanchardstown Business
Tech P
Snugborough Road
Dublin, Blanchardstown
leEuropean Patent Ofice
nose MUNICH
GERMANY
49'89 2909 0
Donnelly, Brian
ALCATEL-LUCENT IRELAND LTD
Blanchardstown Business
Tech P
‘Snugborough Road
Blanchardstown
Dublin, Blanchardstown
le
Nolan, Kevin
ALCATEL-LUCENT IRELAND LTD
Blanchardstown Business
Tech P
‘Snugborough Road
Dublin, Blanchardstown
le
*) Ifthe time limit for the payment of designation fees according to Rule 39(1) EPC has not yet
expired and the applicant has not withdrawn any designation, all Contracting
States Extension StatesiVali
\n States are currently still deemed to be designated
at
See also Rule 71a(3) EPC and, if applicable, the above Note to users of the automatic debiting
procedure.
)_Iftwo or more applicants have designated different Contracting States, this is indicated here.‘Jor e089 20000
Browne, Robin Forsythe
Hepworth Browne
16 St Paul's Stroot
Loods LS1 2UG
ll Ill ll ll ll ee
“St 7034045 00
ROYAUME-UNI
“Replication No Fat Dae
14-306 808.8 - 1216 BUR-P5893EP 16.01.2020
‘eplcart
Aleatel Lucent
Communication under Rule 71(3) EPC
1. Intention to grant
You are informed that the examining division intends to grant a European patent on the basis of the above
application, with the text and drawings ang the related bibliographic data as indicated below.
A-copy of the relevant documents is enclosed,
4.1. Inthe text for the Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HUIE IS IT LILT LU LV MC MK MT NLNO PL PT
RO RS SE SISK SM TR
Description, Pages
1,347 as originally filed
Claims, Numbers
115 as originally fled
Drawings, Sheets
10-38 as originally filed
With the following amendments to the above-mentioned documents proposed by the division
Description, Pages 1,3, 17
Delete Previous: 2
Claims, Numbers 1-15
Registered letterDate 16.01.2020 Sheet 2 Application No.: 14 306 808.8
Comments
DESCRIPTION
Page 1: Deletion of irrelevant andlor supertiuous information (Rule 48(1)(c) EPC, Guidelines F-I
74)
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CLAIMS
Pages 18-20, CLAIMS 1-15: Insertion of reference signs in claims (Rule 43(7) EPC)
Page 18, Ciaim 6: Article 84 EPC
1.2 Bibliographic data
The tile of the invention in the three official languages of the European Patent Office, the international patent
classification, the designated contracting states, the registered name(s) of the applicant(s) and the other
bibliographic data are shown on EPO Form 2056 (enclosed).
2. Invitation
You are invited, within a non-extendable period of four months of notification of this communication
2.1 to EITHER approve the text communicated above and verify the bibliographic data (Rule 71(5) EPC)
(1) _ by fling a translation of the claim(s) in the other two official languages of the EPO
Fee code EUR
(2a) by paying the fee for grant including the fee
for publication: 007 925.00
minus any amount already paid (Rule 71a(5) EPC) 0.00
Total amount: 925.00
(3) _ by paying additional claims fees under Rule 71(4) EPC:
number of claims fees payable: 0 016 0.00
minus any amount already paid (Rule 71a(5) EPC) 0.00
Total amount: 0.00
Important: Ifthe translations of the claims and foos have already been filed and paid respectively in reply to a
previous communication under Rule 71(3) EPC, e.g. in the case of resumption of examination after approval
(see Guidelines C-V, 6), agreement as to the text to be granted (Rule 71a(1) EPC) must be expressed
within the same time limit (¢.g. by approving the text and verifying the bibliographic data, by confirming that
grant proceedings can go ahead with the documents on file andior by stating which translations of the claims
already on file are to be used).
Note 1: See "Notes concerning fee payments” below.
Note 2: Any overpaid "minus" amounts will be refunded when the decision to grant (EPO Form
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Registered letterDate 16.01.2020 Sheet 3 Application No.: 14 306 808.8
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‘Such clean copy is made available via on-line file inspection only,
22 OR, in the case of disapproval, to request reasoned amendments or corrections to the text,
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In this case the transiations of the claims and fee payments mentioned under point 2.1 above are NOT due.
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23° Bit
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Registered letter42
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Date 16.01.2020 Sheet 4 Application No.: 14 306 808.8
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Examining Division:
Chairman: Agreda Labrador, A
2nd Examiner: Fodrigo, Enrico
Ast Examiner Ohanovici, Z
1 Pato
nts Pong,
* me,
# 4
Eich, Martine
For the Examining Division
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Application No.
\V.2. Patent classification
The classification has been changed. It now is as follows:
14 306 808.8
INV. F04B19/24 F04B19/00 HO1L23/473
1V.3. Title of the invention
European Patent Office
‘0808 MUNICH
Geruany
‘Ter 49 8973990
Fax 49 9 2500 4465,
‘The title indicated on the published patent application remains unchanged. It reads as follows:
Fluidische Pumpe
A fluidic pump
Pompe fluidique
IV.4. Documentation
BALAP.
ate
4
Chaifman
Enclosure(s):
Ohianovial 2
istexaminer
2nd examiner
orem nea ea OTTEP 14306 608.8 DESCRIPTION (14.11.2014) "AMENDED" 133
The present disclosure relates to cooling techniques for electronic or optical
equipment using fluidic pumps.
BACKGROUND
The recent significant growth in data traffic in telecommunications requires more
functionality from future electronic or photonics packages. More functionality
implies comparatively higher levels of heat generation. The current thermal
10 solutions employed today do not appear to be capable of scaling sufficiently to
meet future network demands. One approach for cooling such components is
based on using fluidic pumps. 2. IB WO 2005/071748 A1 describes a cooling system
for an electronic device (1) comprising a first (3), second (13) and third (2) chamber and.
a heater placed in the first chamber. The first and second chambers are separated by a
membrane. The first chamber has also two valves (7) and (10) for directing the fluid between
the third, first and second chambers. By heating the fluid in the first chamber the membrane
pumps the liquid from the second chamber toward the third chamber. US 2006/078434A1
discloses a thermal actuation pump comprising a first, second chambers and a thermoelectric
element arranged between the first and second chambers. {
US 2910836 A describes a fluid heating and cooling apparatus using a thermoelectric element.
US 20111/020140 At discloses a micro pump comprising a pump chamber including inflow and
outflow passages and corresponding two valves through which a drive fluid flows and a pump
chamber heating and cooling unit. | Z
SUMMARY FFT
The present invention relates to an apparatus and a system according to the wording of claims
1 and 15 respectively. Further aspects and details of the invention are set out in the dependent
claims. gj 2
eC : aeEP 14306 608.8 DESCRIPTION (14.11.2014) "AMENDED" 1 p23EP 14306 608.8 DESCRIPTION (14.11.2014) "AMENDED" aa4
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BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1A, 1B and 1C are various exemplary schematic representations
corresponding to a pump according to some embodiments.
Figure 2A and 2B are exemplary schematic representations corresponding to a
pump according to some embodiments.
Figure 3 is an exemplary schematic representation corresponding to a pump
according to some embodiments.
Figure 4 is an exemplary schematic representation corresponding to a pump
according to some embodiments.
DETAILED DESCRIPTION
Due to an increasing trend in designing small-size and highly reliable devices, a
cooling mechanism used in such devices is also desired to be small and highlyEP 14306 6088 DESCRIPTION (14.11.2014) 425
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reliable. It is further desired that such cooling mechanism is capable of being
situated within a package of reduced size and of delivering the required pressure
rise in the working fluid (e.g. in the range of 10kPa or higher at a flow rate in the
range of Smi/min or higher)
Various known cooling techniques rely on the use of moving parts to cause a
fluid (liquid or gas) to flow in the vicinity of the component to be cooled to thereby
absorb heat from the component through thermal contact and transfer it to other
environments (e.g. the ambient). Such solutions however are typically not
sufficiently reliable because the moving parts will typically suffer from mechanical
failure (e.g. wearing out or breakage) after some usage.
Furthermore, the pumping mechanisms using moving parts (e.g. piezoelectric
diaphragm pumps) occupy some space which is typically relatively large as
compared to the overalll size of the device. This makes the miniaturization of the
device difficult.
Some known devices such as electro-osmotic pumps have no moving parts,
however these devices typically do not have the required fluidic performance and
therefore are typically not suitable for applications such as micro-fluidic cooling,
The solution proposed herein takes advantage of the fact that under an increase
in temperature due to absorption of heat, the volume of a fluid increases for a
fixed pressure. Conversely, the pressure of the fluid increases if the volume in
which it is contained is fixed.
This pressure increase may, in some cases, be the result of imposing a phase
change in the fluid (e.g. liquid turning into vapor); and in some other cases, it
may simply be the result of the thermal expansion in a fluid in response to an
increase in temperature,EP 14306 6088 DESCRIPTION (14.11.2014) 526
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5.
Therefore, when a fluid is heated within in a volume that is provided with an
outlet, the increase in the pressure of the fluid within that volume causes the fluid
to move (flow) out of that volume through its outlet.
Embodiments of the disclosure aim at hamessing the above-described effect of
fiuid motion induced by the pressure changes in the fluid, due to variation in
temperature, to obtain a pumping effect. This pumping effect can be provided in
any suitable manner. Two non-limiting examples of preferred approaches are
provided below and described in further details with reference to the drawings.
A first approach is to cause the fluid to move in two opposing direction (e.g.
backwards and forwards, as in a shuttle) over the components to be cooled
Assecond approach relates providing a flow of the fluid on only one direction over
the component to be cooled. This second approach can be achieved for example
by using one-directional valves to make a pump mechanism with continuous flow
in one direction
In the context of the present description the term “thermal contact” and
derivations thereof are to be understood to refer to both a direct contact, without
an interface, between two elements that are meant to transfer heat between each
other; an a contact through an interface (a third element) located between the
two elements and capable of transferring heat from one of the two elements to
the other.
In the following, some exemplary embodiments are provided in relation to micro-
fluidic pumps. These pumps typically use micro-channels for the flow of fluid
within the cooling mechanism. Micro-fluidie pumps may be used in applications
where small size components need to be cooled, such as for example in
telecommunications. Herein, a micro-channel is to be understood to refer to a
channel having at least one cross sectional dimension below 1mm in length. ForEP 14306 8088 DESCRIPTION (14.11.2014) 6-7
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example a rectangular micro-channel cross section can have the following
dimensions: 0.9mm x 5mm
However the disclosure is not limited to the use of micro-channels in pumps and
is likewise applicable to larger pumping applications where a reliable pump is
required, for example in larger scale pumps for XFP cooling or for biomedical
application where channel may have a cross-sectional dimension over 1mm.
Figures 1A, 1B and 1C illustrate an example embodiment of a heat transfer
assembly comprising a micro-fluidic pump according to the first approach. In
these figures, by way of illustration and not limitation, a pump mechanism is
shown that uses the concept of phase change (e.g. liquid-vapor). However, those
skilled in the related art will understand that pump mechanism without phase
change, and merely using the expansion/contraction effect of a fluid in response
to variation in temperature, may also be made using the principles of the
disclosure.
Referring first to figure 1A, there is shown a heat transfer assembly 100,
comprising a pump 110 (in this example being a multi-phase pump), a heat
source 120 which may comprise one of more optical component or one or more
electronic components, to be cooled and a thermal energy removal mechanism
130 such as a heat sink.
A working fluid 112 is used for heat transfer operations. The working fluid 112 is
capable of flowing through micro-channels 140 in backward or forward directions,
The heat transfer assembly 100 further comprises a cooling chamber 150
through which the working fluid can flow.
The pump 110 comprises a thermoelectric cooler (TEC) 111. A TEC is a known
solid-state heat pump that is capable of pumping the heat from one side to the
other in response to a supplied voltage. The direction of pumping the heat
depends on the polarity of the supplied voltage. If the voltage applied to the TECEP 14306 6088 DESCRIPTION (14.11.2014) 728
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is reversed, the direction of the heat pumping effect will be reversed also.
Therefore, under ambient temperature, this heat transfer therefore results in one
side of the TEC being above and the other side being below the ambient
temperature.
Figure 1B shows the pump 110 of figure 1A in a larger scale. The pump 110 has
a housing 113 comprising a first chamber 113a and a second chamber 113b.
With simultaneous reference to both figures 1A and 1B, it is assumed that the
TEC 111 is excited by a voltage applied thereto. As a result, one side 1112 of the
TEC heats up while the other side 111b cools down relative to the initial
temperature within the TEC (e.g. ambient temperature). Therefore, the hot side
111 of the TEC causes the working fluid 112 to change phase from liquid to
vapor 112a, thereby increasing in pressure within the boundaries 113 of the first
chamber 11a. The opposing side 111b of the TEC cools the fluid, resulting in
the fluid changing phase from vapor to liquid, or simply contracting in volume,
thus decreasing the pressure inside the second chamber 113b. This operation
causes the fluid to be shuttled in a first direction (anticlockwise in the example
shown in figures 1A and 1B). As a result the fluid can move through the micro-
channels 140 and enter the cooling chamber 150 (figure 1A). The cooling
chamber 150 is in thermal contact with the thermal energy removal mechanism
130 through which it exchanges heat with the ambient. Therefore, the fluid 112
may be cooled down to some degree in the cooling chamber before it flows
further to reach the heat source 120. Further details related to the movement of
the fluid within the heat chamber are provided below.
After the fluid 112 has entered in thermal contact with the heat source 120 and
absorbed heat therefrom, the heated fluid 112 then continues to flow out of the
cooling chamber 150 and through micro-channels 140 to finally reach the second
chamber 113b and the cooler side 111b of the TEC 111. In this manner a closedEP 14306 6088 DESCRIPTION (14.11.2014) e=9
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loop is provided in which the fluid is made to move, i.e. pumped, from the pump
110 toward the heat source 120 and back to the pump 110, as shown by arrows
in figure 1A.
Referring now to figure 1C a scenario is shown in which the polarity of the
voltage applied to the TEC 111 is reversed thereby causing the fluid 112 to move
in the reverse direction (clockwise in the example shown in figure 1C) due to the
same effects as described with reference to figure 1A.
The polarity of the applied voltage may be varied according to any desired
frequency to meet the cooling demands of each particular application and to suit
the performance of the heat transfer assembly of figures 1A, 1B and 1C.
As an additional measure to ensure efficient cooling the heat source 120 may be
situated such that the fluid 112 heated by the TEC 111 does not directly reach it.
For example the heat source 120 may be located at a distance from the pump
which is longer than the distance along which the pump can push the fluid from
the TEC 111. Therefore, with each stroke (back and forth), the fluid heated by the
TEC 111 moves away from the TEC without reaching the heat source 120.
The pump may be configured such that relatively little amount of energy would be
required to cause a phase transformation or thermal expansion in the fluid and
thus relatively little heating is caused. For example, if the working fluid is water at
atmospheric pressure, and if the system is set to operate at 99C then the TEC
only needs to heat the water by 1C to trigger the phase change from a liquid to a
gas; which is very little heating. On the other hand, if the pressure is reduced by
applying a vacuum on the system then the phase transition temperature can be
changed from 100C to another, say 50C, and the process can be repeated. In
this manner the pump can be configured so that the TEC 111 does very little
sensible heating of the fluid, Other fluids, for example dielectric fluids, may also
be used in a similar manner.EP 14306 6088 DESCRIPTION (14.11.2014) 9>10
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The cooling chamber 150 comprises nozzles and diffusers 151-154. These
nozzles and diffused are employed to prevent re-entrainment of the heated fluid
112 into the cooling chamber 150 after it has been heated by entering into
thermal contact with the heat source 120.
In the context of the present disclosure, a nozzle may be considered to be a
contraction in the cross sectional area of the micro-channel relative to the
direction of flow of the fluid. Likewise, a diffuser may be considered as an
expansion in the cross sectional area of the micro-channel relative to the
direction of flow of the fluid. Therefore, by changing the direction of flow of the
fluid, a nozzle may become a diffuser and vice-versa.
For example in figure 1A, elements shown by reference numerals 14 and 152
are nozzles; and elements shown by reference numerals 151 and 153 are
diffusers. Diffusers have a lower resistance to fluid flow than nozzles of
comparable size; therefore the fluid will tend to pass through a diffuser easier
than through a nozzle.
The cooling chamber 150 comprises two sections 150a and 150b separated by a
wall 155. As can be seen in the figures 1A and 1C, a nozzle 152 and a diffuser
151 are located in one section 150b of the cooling chamber and a nozzle 154
and a diffuser 153 are located in the other section 150a
In the example of figure in figure 1A, the fluid is shown to be moving away from
the right hand side of the TEC 111. It enters the right hand side section 150a of
the cooling chamber and flows through the diffuser 153 and on towards the heat
source 120 where it receives thermal energy. Then the fluid flows into the left
hand side section 150b of the cooling chamber and finally flows toward the TEC
111 by passing through the diffuser 151 and out of the left hand section 150b of
the cooling chamber. When the polarity of the voltage applied to the TEC 111 is
reversed, the direction of the flow of the fluid 112 reverses (figure 1C) andEP 14306 6088 DESCRIPTION (14.11.2014) tot
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10-
therefore elements 152 and 154 (that were nozzles in the previous cases)
become diffusers because of the change in the direction of the flow.
Another embodiment of the disclosure, according to the first approach, is
provided with reference to figures 2A and 2B.
Figure 2A is an exemplary schematic representation of a heat transfer assembly
200 comprising a pump 210 (in this example being a multi-phase pump), a heat
source 220 such as an optical or electronic component to be cooled and a
thermal energy removal mechanism 230 such as a heat sink.
A working fluid 212 is used for heat transfer operations. The working fluid 212 is
provided inside a housing 213. The housing 213 comprises a first chamber 213a
and a second chamber 213b. The two chambers 213a and 213b are separated
by a wall 250 and connected to each other by the micro-channels 240 (figure
2B).
The fluid 212 is capable of flowing through micro-channels 240 (figure 2B) in
backward or forward directions between the first chamber 213a and the second
chamber 213b.
The heat transfer assembly further comprises heater elements 260 provided at
predetermined locations relative to the first chamber 213a and the second
chamber 213b so as to be able to transfer heat, upon activation, to the working
fluid in the first chamber or in the second chamber respectively. The heater
elements 260 may be external to the body of the housing 213 (as shown in figure
2A), or they may be located inside the housing 213 in each of the first chamber
and the second chamber. The heater elements may be chosen from any known
components suitable for the application, such as for example a resistive element.
In the embodiments of figure 2A, the heat source 220, e.g. electronic or photonic
component, may be submerged inside the working fluid. In such a case, the
working fluid is preferably a dielectric material such as hydrofluoroether.EP 14306 6088 DESCRIPTION (14.11.2014) 19
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-11-
‘As shown in figure 2B, the micro-channels define a path for the flow of the fluid
provided adjacent (e.g. below or above) the heat source 220. The working fluid
212 is capable of flowing through the micro-channels 240 in both directions.
In operation, a first heater 260 e.g. inside the first chamber 213a is activated for
‘example by applying electricity to a resistive element. As a result the the heater
element 260 generates heat which is transferred to the fluid (either directly when
the heater element is inside the housing or through the body of the housing 213
when the heater element is located outside the housing). Such heat transfer to
the fluid causes the working fluid to heat up. In case a multi-phase pump is used,
the heat causes the working fluid 212 to change phase locally, thereby pushing
the bulk fluid from the first chamber 213a, through the micro-channels 240 into
the second chamber 213b. Preferably only one heater is activated at any given
time. As the fluid 212 moves from one chamber to the other, it makes thermal
contact with the heat source 220 thereby absorbing heat from the latter.
Subsequently, the fluid exits from the micro-channel 240 and enters into the
opposing chamber. Heat is removed from this heated fluid while it is in the
opposite chamber.
A reverse operation is performed in a similar fashion. For example referring back
to figure 2A, upon activating the heater element 260 on the left-hand side of the
figure- which was previously off - and turning off the heater element 260 on the
right-hand side — which was previously on -, the direction of flow will change and
the fluid will then flow from the second chamber 213b to the first chamber 213a.
Preferably a valve system may be set up on the entrance and exit to the micro-
channels to ensure that heated fluid does not return to the heat source to be
cooled. Figure 28 illustrates a cross-sectional view, along the line A-A in figure
2A, of an area in which the heat source 220 and the micro-channels 240 are
located.EP 14306 6088 DESCRIPTION (14.11.2014) 12518
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A2-
‘As can be seen from the example shown in figure 2B, according to one direction
of flow (e.g. left to right as shown by arrows in the figure) the fluid can flow from
chamber 213b (figure 2A) into the micro-channel through diffuser 241, enter into
thermal contact with the heat source 220, flow though a micro-channel that
terminates in diffuser 242 and finally exit from the diffuser 242 to enter into the
opposing chamber 213a
In a reverse operation, upon changing the direction of flow, the fluid can flow
from chamber 23a (figure 2A) into the micro-channel through diffuser 243, enter
into thermal contact with the heat source 220, flow though a micro-channel that
terminates in diffuser 244 and finally exit from the diffuser 244 to enter into the
opposing chamber 213b.
Here again when the direction of is reversed a nozzle becomes a diffuser and
vice-versa
The special arrangement of the nozzles and diffusers not only ensures that the
fluid is directed through the desired channels and heated fiuid is not returned to
the heat source, but it also ensures that the heated fluid is entered into the new
chamber at a position which is at certain distance from the position where cooled
fiuid is going to flow back toward the heat source. For example in a left to right
direction of flow in figure 2B the fluid flows out of diffuser 242 which is at a certain
distance from the nozzle 243 (according to that direction of flow). When the
direction of flow is reversed the now diffuser (previously nozzle) 243 allows the
passage of fluid which is in proximity to the entrance of this diffuser and the
heated fiuid entered in the chamber 213a in proximity of the now nozzle
(previously diffuser) 242 is prevented from entering the micro-channel 240.
Furthermore, as the nozzle 242 is at certain distance from the diffuser 243,
heated fluid in proximity of the nozzle 242 is also at certain distance from diffuser
and would not enter into the diffuser 243. A repeated reversal of the direction ofEP 14306 6088 DESCRIPTION (14.11.2014) 3514
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A13-
flow causes the heated fluid in chamber 252 to circulate within the chamber
where it exchanges heat with the thermal energy removal mechanism 230 and
cools off before it is returned back to the micro-channel, this time through diffuser
243.
Figure 3 is an exemplary schematic representation of a heat transfer assembly
comprising a pump according to another embodiment of the disclosure.
The heat transfer assembly 300 of figure 3 is in many aspects similar to that of
figures 2A and 2B, and therefore a detailed description of its structure and
‘components is considered not necessary. However the heat transfer assembly of
figure 3 is different from the embodiment of figures 2A and 2b in that instead of
heater elements (or TECs), use is made of electronic or optical components
which generate heat during their operation and this generated heat is used to
cause the fluid to move in a back and forth direction.
In operation, a first component or group of components 360, e.g. components
inside the first chamber 313a, is activated thereby generating heat. The heat
generated is transferred to the fluid 312, thereby causing the bulk fluid from the
first chamber 313a to move through micro-channels (not explicitly shown) into the
‘opposing chamber 313b. This reverse operation may be made by activating the
components 360 within the second chamber 313b to cause the bulk fluid from the
second chamber 313b to move through micro-channels into the opposing
chamber 313a. This operation may be repeated in the two direction to remove
heat from the heat source to be cooled
A valve system similar to the one described with reference to figure 2B may be
set up in the apparatus of figure 3 to obtain similar effects,
Figures 4A, 4B and 4C show different representations of a heat transfer
assembly comprising a pump according to a further embodiment of theEP 14306 608.8 DESCRIPTION (14.11.2014) 14518
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14.
disclosure. The embodiment implements the second approach as referred to
above
The principle of operation of the heat transfer assembly of this embodiment is
based on the use of one way valves to convert the periodical (back and forth)
operation of the pump into a continuous one-directional flow. This principle of
operation may be better understood by simulating it to an electrical AC-DC bridge
rectifier as shown in figure 4B and described below.
Referring simultaneously to figures 44 and 4B an exemplary schematic
representation of a heat transfer assembly 400 is shown comprising a pump 410
a heat source 420 such as an optical or electronic component to be cooled and a
thermal energy removal mechanism 430 such as a heat sink.
The pump 410 comprises a housing 413. The housing 413 has a first chamber
413a and a second chamber 413b.
Aworking fluid 412 is used for heat transfer operations. The working fluid 412 is
provided inside the first chamber 413a and the second chamber 413b of the
housing and is capable of flowing from one chamber to the other through micro-
channels 440.
Although in the figure the heat source 420 is shown to be adjacent to the micro-
channel 440 and not submerged into the working fluid, the disclosure is not so
limited and some embodiments may provide for submerging the heat source 420
inside a region where the working fluid flows, for example inside the cooling
chamber 450
The heat transfer assembly 400 further comprises a TEC 411 provided within the
pump 410. The TEC 411 may be similar to the TEC described with reference to
figures 1A, 1B and 1C. A cooling chamber 450 may also be provided to enhance
heat transfer from the working fluid to the thermal energy removal mechanism
430.EP 14306 6088 DESCRIPTION (14.11.2014) 18516
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15.
A plurality of directional valves, 461-464, are provided to provide a one-
directional flow path as will be described below.
In operation, when a voltage is applied to the TEC 411, one side 411a of the TEC.
heats up thereby increasing the pressure inside the boundaries of the chamber
413a where the fluid 412 is contained
In some embodiments, as shown in figure 4A, the pump is multi-phase therefore
the heating of the one side of the TEC may generate vapor in the form of a
bubble 416, In this case the formation and growth of a bubble 416 may be
compared to a diaphragm which can extend into the above-mentioned
boundaries, e.g. the right hand side of the pump in figure 4A, thereby pushing the
fluid out of the first chamber 413a,
In some embodiments the pump is not multi-phase therefore the heating of the
one side of the TEC may simply cause thermal expansion in the fluid which is
sufficient to push the fluid out of the first chamber 413a,
Referring back to figures 4A and 4B, when e.g. side 411a of the TEC 411 is
heated, fluid is made to move out of the pump 410 from outlets of the first
chamber 41a (right hand side in the figures). At the same time, side 411b of the
TEC 411 is cooled causing the fiuid to move into the pump 410 from inlets of the
second chamber 413b (left hand side in the figures),
However while the one-directional valve 461 allows the fluid to flow out of the first
chamber 413a, the valve 463 blocks the flow of the fluid in the opposite direction.
Therefore the fluid flows in one direction from out of valve 461 (e.g. upward in the
figures),
As the voltage applied to the TEC 411 is reversed, the opposite side 441b of the
TEC is heated up and therefore the fluid is made to move out of the pump 410
from outlets of second chamber 413b (left hand side in the figures). At the sameEP 14306 6088 DESCRIPTION (14.11.2014) 617
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time, side 41 1a of the TEC 411 is cooled causing the fluid to move into the pump
410 from inlets of the first chamber 43a (right hand side in the figures).
However while the one-directional valve 462 allows the fluid to flow out of the
second chamber 413b, the valve 464 blocks the flow of the fluid in the opposite
direction. Therefore the fluid flows in one direction out of valve 462 (e.g. upward
in the figures).
Therefore, for either one of the voltage polarities applied to the TEC 411, the fluid
is made to move in one direction out of the pump which is shown by arrows F in
figure 4B,
It is to be noted that when chamber 413a contains hot fluid, it is pressurized thus
pushing fluid out (as mentioned above). This effect will also push the one-
directional valve 463 to remain closed. At the same time chamber 413b is cooled
down and therefore has a reduced pressure therein. This effect will open the
one-directional valve 464 and pull the fluid into the chamber 413b
As shown in figure 4C, the directional, or one-way, valves may be active valves
471 (e.g. known check valves with moving parts) or passive valves 472 (e.g.
nozzlesidiffusers that have no moving parts). Active valves have greater fluidic
performance however they have reliability concerns due to said moving part;
while passive valves have poorer fluidic performance however they have higher
reliability. The choice of the valves may therefore be made in accordance to the
practical requirements of each application.
Active valves may also be used in the previous embodiments of figures 1A, 1B,
1C, 2A, 2B and 3 instead of nuzzles and diffusers.
The fluid 412 may be cooled down in the cooling chamber 450 before it flows
further to reach the heat source 420.
As can be appreciated from the foregoing, the present disclosure therefore offers
important advantages over the known solutions as it enables small scale, reliableEP 14306 6088 DESCRIPTION (14.11.2014) “AMENDED 17518
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in-package fluidic networks. This is due to the fact that the pumping mechanism
is typically one of the main concerns in designing a device as it requires high
reliability which is not easy to achieve using known solutions.
In addition to reliability, another unique benefit of the pump as proposed herein is
that it can be made of any suitable shape and size and therefore is not limited to
any specific footprint. Furthermore, since there are no moving parts in the
proposed pump, it can be easily built on a small scale.
Fhe varios embortrents OMe Present veto Tey AE COMET IS TOTS ES
Further it is to be noted that the list of structures corresponding to the claimed
means is not exhaustive and that one skilled in the art understands that
equivalent structures can be substituted for the recited structure without
departing from the scope of the invention.
It should be appreciated by those skilled in the art that any block diagrams herein
represent conceptual views of illustrative circuitry embodying the principles of the
invention.EP 14306 608.8 CLAIMS (14.17.2014) “AMENDED* 18418
18-
CLAIMS
1 An apparatus 2 [f¥(100, 200, 300, 400) gf 2 — comprising:
- afirst 2 PPheat source (111, 260, 360,411); al 2 hemtsourcer
5 - a& Miluid (112,212,312, 412); gl 2 eis
- afirst chamber 2 FF (113a, 213a, 313a, 413a) ff
2 and asecond chamber 2 IF(113b, 213b, 3136, 413b) J 2
connected to one another through
a. Bichannel (140, 240, 440); al 2 chrome:
wherein the first heat source @ WF(111, 260, 360,411) gf 2
is configured to heat the fluid @ WF(112, 212,312,412) ql 2 in the first chamber @
Fi(113a, 213a, 313a, 413a) a 2 to
cause the fluid 2 MF(112, 212, 312, 412) gf 2
to flow, through the channel, from the first chamber to the second
10 chamber and to make thermal contact with a second heat source to absorb heat
from the second 2 heat source (120, 220, 420). gl 2 heatseurce:
2. The apparatus @ I¥(100, 200, 300, 400) gf 2
of claim 1, wherein the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in a
second direction in response to receiving heat in the second chamber.
15 3. The apparatus 2 IP (100, 200, 300, 400) J 2
of claim 1, wherein the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in the
same first direction in response to receiving heat in the second chamber.
4, The apparatus 2 I (100, 200, 300, 400) gf 2
of any one of claims 1 to 3, wherein the fluid is configured
| to change phase from liquid to gas in response to receiving heat from the first
20 _ heat source.
5. The apparatus 2 IF(100, 200, 300, 400) gf z
of any one of claims 1 to 3, wherein the fluid is configured
to undergo thermal expansion in response to receiving heat from the first heat
source
6. The apparatus 2 [F(100, 200, 300, 400) gf 2
of any one of the preceding claims, wherein ecoreting-trEP 14306 6088 CLAIMS (14.11.2014) "AMENDED" 18 guna 19
TO SOMe-specit-eMpoMIMEMS; the apparatus further comprises a nozzle * F
(152, 154) 2 anda
diffuser 2 W(151, 158) 2
located on a flow path of the fluid wherein a nozzle
is configured to
2 W152, 154) gh 2
provide higher resistance to the flow of the fluid than a diffuser.EP 14306 608.8 CLAIMS (14.17.2014) “AMENDED* 1920
-19-
7. The apparatus 2 [F(100, 200, 300, 400) J 2
of any one of the preceding claims, wherein the first heat
source is configured to heat the fluid in the first chamber and cool the fluid in the
second chamber.
8. The apparatus 2 IF (100. 200, 300, 400) gf 2
of any one of the preceding claims, wherein the first heat
5 source is a thermoelectric cooler.
9. The apparatus 2 IF(100, 200, 300, 400) gf Z
of claim 8, wherein the first heat source is located between
the first chamber and the second chamber.
10. The apparatus 2 IF(100, 200, 300, 400) gf 2
of any one of the preceding claims 1 to 7, wherein the first
heat source is a located outside the first chamber and the apparatus comprises a
10 third heat source located outside the second chamber, the third heat source
being configured to heat the fluid in the second chamber.
44, The apparatus 2 [F(100, 200, 300, 400) J 2
of any one of the preceding claims 1 to 7, wherein the first
heat source is a located inside the first chamber and the apparatus comprises a
third heat source located inside the second chamber, the third heat source being
15 configured to heat the fluid in the second chamber.
12. The apparatus 2 IF (100, 200, 300, 400) J 2
of claim 11, wherein the first heat source and the third heat
source each comprise one or more electronic or optical components configured
to generate heat during operation.
13. The apparatus 2 [(100, 200, 300, 400) fl 2
of any one of the preceding claims, further comprising a
20 cooling chamber configured to cool the fluid prior to the fluid reaching the second
heat source.
44. The apparatus 2 [F(100, 200,300,400) gf 2
of any one of the preceding claims further comprising a
plurality of one-directional valves IF (461, 462, 463, 464) J 2
being arranged so as to allow a flow of the fluidEP 14306 6088 CLAIMS (14.11.2014) "AMENDED" 19 guna +20
in one direction and to block a flow of the fluid in a direction opposite to the one
25 direction.EP 14306 608.8 CLAIMS (14.11.2014) _ "AMENDED* 2018
-20-
15. A heat transfer assembly comprising the apparatus of any one of the
previous claims 1 to 14 and further comprising a thermal energy removal
2 mechanism (130, 230, 330, 430). J 2 mechantsnEP 14306 6088 DRAWING (14.11.2014) 1133 218
0
112
1130
18
13
{
4
TO
FI¢.
411
100
a”?
1A
1C
FIG.
FIG.EP 14306 6088 DRAWING (14.11.2014)
2/3
FIG. 24
230
260 CAML
BE Ley
213
212" ato 250 220
FI¢. 2B
242
244. 7
260
24 240 220 240 243
FIG. 3
330
313b ——
35t
312 H2
2838
200
4
260
213
2130
212
300
J
B30DRAWING (14.11.2014) 38
EP 14306 608.8
3/3
Ly
vw Old
Oey
oor
ogy
ah “Old
sah,
Oly
9t
‘y
ay
aely
‘34
Ww
‘OldEP 14306 608.8 DESCRIPTION (14.11.2014) "AMENDED" 133
The present disclosure relates to cooling techniques for electronic or optical
equipment using fluidic pumps.
BACKGROUND
The recent significant growth in data traffic in telecommunications requires more
functionality from future electronic or photonics packages. More functionality
implies comparatively higher levels of heat generation. The current thermal
10 solutions employed today do not appear to be capable of scaling sufficiently to
meet future network demands. One approach for cooling such components is
based on using fluidic pumps. WO 2005/071748 At describes a cooling system for
an electronic device (1) comprising a first (3), second (13) and third (2) chamber and a heater
placed in the first chamber. The first and second chambers are separated by a membrane. The
first chamber has also two valves (7) and (10) for directing the fluid between the third, first and
second chambers. By heating the fluid in the first chamber the membrane pumps the liquid
from the second chamber toward the third chamber. US 2006/078434A1 discloses a thermal
actuation pump comprising a first, second chambers and a thermoelectric element arranged
between the first and second chambers.
US 2910836 A describes a fluid heating and cooling apparatus using a thermoelectric element. |
US 2011/020140 At discloses a micro pump comprising a pump chamber including inflow and
outflow passages and corresponding two valves through which a drive fluid flows and a pump
chamber heating and cooling unit.
SUMMARY
The present invention relates to an apparatus and a system according to the wording of claims
1 and 15 respectively. Further aspects and details of the invention are set out in the dependent
claims
15EP 14306 608.8 DESCRIPTION (14.11.2014) "AMENDED" aa4
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BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1A, 1B and 1C are various exemplary schematic representations
corresponding to a pump according to some embodiments.
Figure 2A and 2B are exemplary schematic representations corresponding to a
pump according to some embodiments.
Figure 3 is an exemplary schematic representation corresponding to a pump
according to some embodiments.
Figure 4 is an exemplary schematic representation corresponding to a pump
according to some embodiments.
DETAILED DESCRIPTION
Due to an increasing trend in designing small-size and highly reliable devices, a
cooling mechanism used in such devices is also desired to be small and highlyEP 14306 6088 DESCRIPTION (14.11.2014) 425
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reliable. It is further desired that such cooling mechanism is capable of being
situated within a package of reduced size and of delivering the required pressure
rise in the working fluid (e.g. in the range of 10kPa or higher at a flow rate in the
range of Smi/min or higher)
Various known cooling techniques rely on the use of moving parts to cause a
fluid (liquid or gas) to flow in the vicinity of the component to be cooled to thereby
absorb heat from the component through thermal contact and transfer it to other
environments (e.g. the ambient). Such solutions however are typically not
sufficiently reliable because the moving parts will typically suffer from mechanical
failure (e.g. wearing out or breakage) after some usage.
Furthermore, the pumping mechanisms using moving parts (e.g. piezoelectric
diaphragm pumps) occupy some space which is typically relatively large as
compared to the overalll size of the device. This makes the miniaturization of the
device difficult.
Some known devices such as electro-osmotic pumps have no moving parts,
however these devices typically do not have the required fluidic performance and
therefore are typically not suitable for applications such as micro-fluidic cooling,
The solution proposed herein takes advantage of the fact that under an increase
in temperature due to absorption of heat, the volume of a fluid increases for a
fixed pressure. Conversely, the pressure of the fluid increases if the volume in
which it is contained is fixed.
This pressure increase may, in some cases, be the result of imposing a phase
change in the fluid (e.g. liquid turning into vapor); and in some other cases, it
may simply be the result of the thermal expansion in a fluid in response to an
increase in temperature,EP 14306 6088 DESCRIPTION (14.11.2014) 526
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5.
Therefore, when a fluid is heated within in a volume that is provided with an
outlet, the increase in the pressure of the fluid within that volume causes the fluid
to move (flow) out of that volume through its outlet.
Embodiments of the disclosure aim at hamessing the above-described effect of
fiuid motion induced by the pressure changes in the fluid, due to variation in
temperature, to obtain a pumping effect. This pumping effect can be provided in
any suitable manner. Two non-limiting examples of preferred approaches are
provided below and described in further details with reference to the drawings.
A first approach is to cause the fluid to move in two opposing direction (e.g.
backwards and forwards, as in a shuttle) over the components to be cooled
Assecond approach relates providing a flow of the fluid on only one direction over
the component to be cooled. This second approach can be achieved for example
by using one-directional valves to make a pump mechanism with continuous flow
in one direction
In the context of the present description the term “thermal contact” and
derivations thereof are to be understood to refer to both a direct contact, without
an interface, between two elements that are meant to transfer heat between each
other; an a contact through an interface (a third element) located between the
two elements and capable of transferring heat from one of the two elements to
the other.
In the following, some exemplary embodiments are provided in relation to micro-
fluidic pumps. These pumps typically use micro-channels for the flow of fluid
within the cooling mechanism. Micro-fluidie pumps may be used in applications
where small size components need to be cooled, such as for example in
telecommunications. Herein, a micro-channel is to be understood to refer to a
channel having at least one cross sectional dimension below 1mm in length. ForEP 14306 8088 DESCRIPTION (14.11.2014) 6-7
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example a rectangular micro-channel cross section can have the following
dimensions: 0.9mm x 5mm
However the disclosure is not limited to the use of micro-channels in pumps and
is likewise applicable to larger pumping applications where a reliable pump is
required, for example in larger scale pumps for XFP cooling or for biomedical
application where channel may have a cross-sectional dimension over 1mm.
Figures 1A, 1B and 1C illustrate an example embodiment of a heat transfer
assembly comprising a micro-fluidic pump according to the first approach. In
these figures, by way of illustration and not limitation, a pump mechanism is
shown that uses the concept of phase change (e.g. liquid-vapor). However, those
skilled in the related art will understand that pump mechanism without phase
change, and merely using the expansion/contraction effect of a fluid in response
to variation in temperature, may also be made using the principles of the
disclosure.
Referring first to figure 1A, there is shown a heat transfer assembly 100,
comprising a pump 110 (in this example being a multi-phase pump), a heat
source 120 which may comprise one of more optical component or one or more
electronic components, to be cooled and a thermal energy removal mechanism
130 such as a heat sink.
A working fluid 112 is used for heat transfer operations. The working fluid 112 is
capable of flowing through micro-channels 140 in backward or forward directions,
The heat transfer assembly 100 further comprises a cooling chamber 150
through which the working fluid can flow.
The pump 110 comprises a thermoelectric cooler (TEC) 111. A TEC is a known
solid-state heat pump that is capable of pumping the heat from one side to the
other in response to a supplied voltage. The direction of pumping the heat
depends on the polarity of the supplied voltage. If the voltage applied to the TECEP 14306 6088 DESCRIPTION (14.11.2014) 728
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is reversed, the direction of the heat pumping effect will be reversed also.
Therefore, under ambient temperature, this heat transfer therefore results in one
side of the TEC being above and the other side being below the ambient
temperature.
Figure 1B shows the pump 110 of figure 1A in a larger scale. The pump 110 has
a housing 113 comprising a first chamber 113a and a second chamber 113b.
With simultaneous reference to both figures 1A and 1B, it is assumed that the
TEC 111 is excited by a voltage applied thereto. As a result, one side 1112 of the
TEC heats up while the other side 111b cools down relative to the initial
temperature within the TEC (e.g. ambient temperature). Therefore, the hot side
111 of the TEC causes the working fluid 112 to change phase from liquid to
vapor 112a, thereby increasing in pressure within the boundaries 113 of the first
chamber 11a. The opposing side 111b of the TEC cools the fluid, resulting in
the fluid changing phase from vapor to liquid, or simply contracting in volume,
thus decreasing the pressure inside the second chamber 113b. This operation
causes the fluid to be shuttled in a first direction (anticlockwise in the example
shown in figures 1A and 1B). As a result the fluid can move through the micro-
channels 140 and enter the cooling chamber 150 (figure 1A). The cooling
chamber 150 is in thermal contact with the thermal energy removal mechanism
130 through which it exchanges heat with the ambient. Therefore, the fluid 112
may be cooled down to some degree in the cooling chamber before it flows
further to reach the heat source 120. Further details related to the movement of
the fluid within the heat chamber are provided below.
After the fluid 112 has entered in thermal contact with the heat source 120 and
absorbed heat therefrom, the heated fluid 112 then continues to flow out of the
cooling chamber 150 and through micro-channels 140 to finally reach the second
chamber 113b and the cooler side 111b of the TEC 111. In this manner a closedEP 14306 6088 DESCRIPTION (14.11.2014) e=9
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loop is provided in which the fluid is made to move, i.e. pumped, from the pump
110 toward the heat source 120 and back to the pump 110, as shown by arrows
in figure 1A.
Referring now to figure 1C a scenario is shown in which the polarity of the
voltage applied to the TEC 111 is reversed thereby causing the fluid 112 to move
in the reverse direction (clockwise in the example shown in figure 1C) due to the
same effects as described with reference to figure 1A.
The polarity of the applied voltage may be varied according to any desired
frequency to meet the cooling demands of each particular application and to suit
the performance of the heat transfer assembly of figures 1A, 1B and 1C.
As an additional measure to ensure efficient cooling the heat source 120 may be
situated such that the fluid 112 heated by the TEC 111 does not directly reach it.
For example the heat source 120 may be located at a distance from the pump
which is longer than the distance along which the pump can push the fluid from
the TEC 111. Therefore, with each stroke (back and forth), the fluid heated by the
TEC 111 moves away from the TEC without reaching the heat source 120.
The pump may be configured such that relatively little amount of energy would be
required to cause a phase transformation or thermal expansion in the fluid and
thus relatively little heating is caused. For example, if the working fluid is water at
atmospheric pressure, and if the system is set to operate at 99C then the TEC
only needs to heat the water by 1C to trigger the phase change from a liquid to a
gas; which is very little heating. On the other hand, if the pressure is reduced by
applying a vacuum on the system then the phase transition temperature can be
changed from 100C to another, say 50C, and the process can be repeated. In
this manner the pump can be configured so that the TEC 111 does very little
sensible heating of the fluid, Other fluids, for example dielectric fluids, may also
be used in a similar manner.EP 14306 6088 DESCRIPTION (14.11.2014) 9>10
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The cooling chamber 150 comprises nozzles and diffusers 151-154. These
nozzles and diffused are employed to prevent re-entrainment of the heated fluid
112 into the cooling chamber 150 after it has been heated by entering into
thermal contact with the heat source 120.
In the context of the present disclosure, a nozzle may be considered to be a
contraction in the cross sectional area of the micro-channel relative to the
direction of flow of the fluid. Likewise, a diffuser may be considered as an
expansion in the cross sectional area of the micro-channel relative to the
direction of flow of the fluid. Therefore, by changing the direction of flow of the
fluid, a nozzle may become a diffuser and vice-versa.
For example in figure 1A, elements shown by reference numerals 14 and 152
are nozzles; and elements shown by reference numerals 151 and 153 are
diffusers. Diffusers have a lower resistance to fluid flow than nozzles of
comparable size; therefore the fluid will tend to pass through a diffuser easier
than through a nozzle.
The cooling chamber 150 comprises two sections 150a and 150b separated by a
wall 155. As can be seen in the figures 1A and 1C, a nozzle 152 and a diffuser
151 are located in one section 150b of the cooling chamber and a nozzle 154
and a diffuser 153 are located in the other section 150a
In the example of figure in figure 1A, the fluid is shown to be moving away from
the right hand side of the TEC 111. It enters the right hand side section 150a of
the cooling chamber and flows through the diffuser 153 and on towards the heat
source 120 where it receives thermal energy. Then the fluid flows into the left
hand side section 150b of the cooling chamber and finally flows toward the TEC
111 by passing through the diffuser 151 and out of the left hand section 150b of
the cooling chamber. When the polarity of the voltage applied to the TEC 111 is
reversed, the direction of the flow of the fluid 112 reverses (figure 1C) andEP 14306 6088 DESCRIPTION (14.11.2014) tot
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therefore elements 152 and 154 (that were nozzles in the previous cases)
become diffusers because of the change in the direction of the flow.
Another embodiment of the disclosure, according to the first approach, is
provided with reference to figures 2A and 2B.
Figure 2A is an exemplary schematic representation of a heat transfer assembly
200 comprising a pump 210 (in this example being a multi-phase pump), a heat
source 220 such as an optical or electronic component to be cooled and a
thermal energy removal mechanism 230 such as a heat sink.
A working fluid 212 is used for heat transfer operations. The working fluid 212 is
provided inside a housing 213. The housing 213 comprises a first chamber 213a
and a second chamber 213b. The two chambers 213a and 213b are separated
by a wall 250 and connected to each other by the micro-channels 240 (figure
2B).
The fluid 212 is capable of flowing through micro-channels 240 (figure 2B) in
backward or forward directions between the first chamber 213a and the second
chamber 213b.
The heat transfer assembly further comprises heater elements 260 provided at
predetermined locations relative to the first chamber 213a and the second
chamber 213b so as to be able to transfer heat, upon activation, to the working
fluid in the first chamber or in the second chamber respectively. The heater
elements 260 may be external to the body of the housing 213 (as shown in figure
2A), or they may be located inside the housing 213 in each of the first chamber
and the second chamber. The heater elements may be chosen from any known
components suitable for the application, such as for example a resistive element.
In the embodiments of figure 2A, the heat source 220, e.g. electronic or photonic
component, may be submerged inside the working fluid. In such a case, the
working fluid is preferably a dielectric material such as hydrofluoroether.EP 14306 6088 DESCRIPTION (14.11.2014) 19
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-11-
‘As shown in figure 2B, the micro-channels define a path for the flow of the fluid
provided adjacent (e.g. below or above) the heat source 220. The working fluid
212 is capable of flowing through the micro-channels 240 in both directions.
In operation, a first heater 260 e.g. inside the first chamber 213a is activated for
‘example by applying electricity to a resistive element. As a result the the heater
element 260 generates heat which is transferred to the fluid (either directly when
the heater element is inside the housing or through the body of the housing 213
when the heater element is located outside the housing). Such heat transfer to
the fluid causes the working fluid to heat up. In case a multi-phase pump is used,
the heat causes the working fluid 212 to change phase locally, thereby pushing
the bulk fluid from the first chamber 213a, through the micro-channels 240 into
the second chamber 213b. Preferably only one heater is activated at any given
time. As the fluid 212 moves from one chamber to the other, it makes thermal
contact with the heat source 220 thereby absorbing heat from the latter.
Subsequently, the fluid exits from the micro-channel 240 and enters into the
opposing chamber. Heat is removed from this heated fluid while it is in the
opposite chamber.
A reverse operation is performed in a similar fashion. For example referring back
to figure 2A, upon activating the heater element 260 on the left-hand side of the
figure- which was previously off - and turning off the heater element 260 on the
right-hand side — which was previously on -, the direction of flow will change and
the fluid will then flow from the second chamber 213b to the first chamber 213a.
Preferably a valve system may be set up on the entrance and exit to the micro-
channels to ensure that heated fluid does not return to the heat source to be
cooled. Figure 28 illustrates a cross-sectional view, along the line A-A in figure
2A, of an area in which the heat source 220 and the micro-channels 240 are
located.EP 14306 6088 DESCRIPTION (14.11.2014) 12518
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A2-
‘As can be seen from the example shown in figure 2B, according to one direction
of flow (e.g. left to right as shown by arrows in the figure) the fluid can flow from
chamber 213b (figure 2A) into the micro-channel through diffuser 241, enter into
thermal contact with the heat source 220, flow though a micro-channel that
terminates in diffuser 242 and finally exit from the diffuser 242 to enter into the
opposing chamber 213a
In a reverse operation, upon changing the direction of flow, the fluid can flow
from chamber 23a (figure 2A) into the micro-channel through diffuser 243, enter
into thermal contact with the heat source 220, flow though a micro-channel that
terminates in diffuser 244 and finally exit from the diffuser 244 to enter into the
opposing chamber 213b.
Here again when the direction of is reversed a nozzle becomes a diffuser and
vice-versa
The special arrangement of the nozzles and diffusers not only ensures that the
fluid is directed through the desired channels and heated fiuid is not returned to
the heat source, but it also ensures that the heated fluid is entered into the new
chamber at a position which is at certain distance from the position where cooled
fiuid is going to flow back toward the heat source. For example in a left to right
direction of flow in figure 2B the fluid flows out of diffuser 242 which is at a certain
distance from the nozzle 243 (according to that direction of flow). When the
direction of flow is reversed the now diffuser (previously nozzle) 243 allows the
passage of fluid which is in proximity to the entrance of this diffuser and the
heated fiuid entered in the chamber 213a in proximity of the now nozzle
(previously diffuser) 242 is prevented from entering the micro-channel 240.
Furthermore, as the nozzle 242 is at certain distance from the diffuser 243,
heated fluid in proximity of the nozzle 242 is also at certain distance from diffuser
and would not enter into the diffuser 243. A repeated reversal of the direction ofEP 14306 6088 DESCRIPTION (14.11.2014) 3514
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A13-
flow causes the heated fluid in chamber 252 to circulate within the chamber
where it exchanges heat with the thermal energy removal mechanism 230 and
cools off before it is returned back to the micro-channel, this time through diffuser
243.
Figure 3 is an exemplary schematic representation of a heat transfer assembly
comprising a pump according to another embodiment of the disclosure.
The heat transfer assembly 300 of figure 3 is in many aspects similar to that of
figures 2A and 2B, and therefore a detailed description of its structure and
‘components is considered not necessary. However the heat transfer assembly of
figure 3 is different from the embodiment of figures 2A and 2b in that instead of
heater elements (or TECs), use is made of electronic or optical components
which generate heat during their operation and this generated heat is used to
cause the fluid to move in a back and forth direction.
In operation, a first component or group of components 360, e.g. components
inside the first chamber 313a, is activated thereby generating heat. The heat
generated is transferred to the fluid 312, thereby causing the bulk fluid from the
first chamber 313a to move through micro-channels (not explicitly shown) into the
‘opposing chamber 313b. This reverse operation may be made by activating the
components 360 within the second chamber 313b to cause the bulk fluid from the
second chamber 313b to move through micro-channels into the opposing
chamber 313a. This operation may be repeated in the two direction to remove
heat from the heat source to be cooled
A valve system similar to the one described with reference to figure 2B may be
set up in the apparatus of figure 3 to obtain similar effects,
Figures 4A, 4B and 4C show different representations of a heat transfer
assembly comprising a pump according to a further embodiment of theEP 14306 608.8 DESCRIPTION (14.11.2014) 14518
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14.
disclosure. The embodiment implements the second approach as referred to
above
The principle of operation of the heat transfer assembly of this embodiment is
based on the use of one way valves to convert the periodical (back and forth)
operation of the pump into a continuous one-directional flow. This principle of
operation may be better understood by simulating it to an electrical AC-DC bridge
rectifier as shown in figure 4B and described below.
Referring simultaneously to figures 44 and 4B an exemplary schematic
representation of a heat transfer assembly 400 is shown comprising a pump 410
a heat source 420 such as an optical or electronic component to be cooled and a
thermal energy removal mechanism 430 such as a heat sink.
The pump 410 comprises a housing 413. The housing 413 has a first chamber
413a and a second chamber 413b.
Aworking fluid 412 is used for heat transfer operations. The working fluid 412 is
provided inside the first chamber 413a and the second chamber 413b of the
housing and is capable of flowing from one chamber to the other through micro-
channels 440.
Although in the figure the heat source 420 is shown to be adjacent to the micro-
channel 440 and not submerged into the working fluid, the disclosure is not so
limited and some embodiments may provide for submerging the heat source 420
inside a region where the working fluid flows, for example inside the cooling
chamber 450
The heat transfer assembly 400 further comprises a TEC 411 provided within the
pump 410. The TEC 411 may be similar to the TEC described with reference to
figures 1A, 1B and 1C. A cooling chamber 450 may also be provided to enhance
heat transfer from the working fluid to the thermal energy removal mechanism
430.EP 14306 6088 DESCRIPTION (14.11.2014) 18516
10
15
20
25
15.
A plurality of directional valves, 461-464, are provided to provide a one-
directional flow path as will be described below.
In operation, when a voltage is applied to the TEC 411, one side 411a of the TEC.
heats up thereby increasing the pressure inside the boundaries of the chamber
413a where the fluid 412 is contained
In some embodiments, as shown in figure 4A, the pump is multi-phase therefore
the heating of the one side of the TEC may generate vapor in the form of a
bubble 416, In this case the formation and growth of a bubble 416 may be
compared to a diaphragm which can extend into the above-mentioned
boundaries, e.g. the right hand side of the pump in figure 4A, thereby pushing the
fluid out of the first chamber 413a,
In some embodiments the pump is not multi-phase therefore the heating of the
one side of the TEC may simply cause thermal expansion in the fluid which is
sufficient to push the fluid out of the first chamber 413a,
Referring back to figures 4A and 4B, when e.g. side 411a of the TEC 411 is
heated, fluid is made to move out of the pump 410 from outlets of the first
chamber 41a (right hand side in the figures). At the same time, side 411b of the
TEC 411 is cooled causing the fiuid to move into the pump 410 from inlets of the
second chamber 413b (left hand side in the figures),
However while the one-directional valve 461 allows the fluid to flow out of the first
chamber 413a, the valve 463 blocks the flow of the fluid in the opposite direction.
Therefore the fluid flows in one direction from out of valve 461 (e.g. upward in the
figures),
As the voltage applied to the TEC 411 is reversed, the opposite side 441b of the
TEC is heated up and therefore the fluid is made to move out of the pump 410
from outlets of second chamber 413b (left hand side in the figures). At the sameEP 14306 6088 DESCRIPTION (14.11.2014) 617
10
15
20
25
16-
time, side 41 1a of the TEC 411 is cooled causing the fluid to move into the pump
410 from inlets of the first chamber 43a (right hand side in the figures).
However while the one-directional valve 462 allows the fluid to flow out of the
second chamber 413b, the valve 464 blocks the flow of the fluid in the opposite
direction. Therefore the fluid flows in one direction out of valve 462 (e.g. upward
in the figures).
Therefore, for either one of the voltage polarities applied to the TEC 411, the fluid
is made to move in one direction out of the pump which is shown by arrows F in
figure 4B,
It is to be noted that when chamber 413a contains hot fluid, it is pressurized thus
pushing fluid out (as mentioned above). This effect will also push the one-
directional valve 463 to remain closed. At the same time chamber 413b is cooled
down and therefore has a reduced pressure therein. This effect will open the
one-directional valve 464 and pull the fluid into the chamber 413b
As shown in figure 4C, the directional, or one-way, valves may be active valves
471 (e.g. known check valves with moving parts) or passive valves 472 (e.g.
nozzlesidiffusers that have no moving parts). Active valves have greater fluidic
performance however they have reliability concerns due to said moving part;
while passive valves have poorer fluidic performance however they have higher
reliability. The choice of the valves may therefore be made in accordance to the
practical requirements of each application.
Active valves may also be used in the previous embodiments of figures 1A, 1B,
1C, 2A, 2B and 3 instead of nuzzles and diffusers.
The fluid 412 may be cooled down in the cooling chamber 450 before it flows
further to reach the heat source 420.
As can be appreciated from the foregoing, the present disclosure therefore offers
important advantages over the known solutions as it enables small scale, reliableEP 14306 6088 DESCRIPTION (14.11.2014) “AMENDED 17518
10
15
AT-
in-package fluidic networks. This is due to the fact that the pumping mechanism
is typically one of the main concerns in designing a device as it requires high
reliability which is not easy to achieve using known solutions.
In addition to reliability, another unique benefit of the pump as proposed herein is
that it can be made of any suitable shape and size and therefore is not limited to
any specific footprint. Furthermore, since there are no moving parts in the
proposed pump, it can be easily built on a small scale.
Further it is to be noted that the list of structures corresponding to the claimed
means is not exhaustive and that one skilled in the art understands that
equivalent structures can be substituted for the recited structure without
departing from the scope of the invention.
It should be appreciated by those skilled in the art that any block diagrams herein
represent conceptual views of illustrative circuitry embodying the principles of the
invention.EP 14306 608.8 CLAIMS (14.17.2014) “AMENDED* 18418
18-
CLAIMS
1 An apparatus (100, 200, 300, 400) comprising:
- afirst heat source (111, 260, 360, 411);
5 = a fluid (112, 212, 312, 412);
- afirst chamber (118a, 213a, 313a, 413a) and a second chamber (1130,
213b, 3130, 413b) connected to one another through
a. channel (140, 240, 440);
wherein the first heat source (111, 260, 360, 411) ig configured to heat the fluid
(112, 212, 312, 412) in the first chamber (18a, 213a, 318a, 41a) tg
cause the fluid (112, 212, 312, 412)
to flow, through the channel, from the first chamber to the second
10 chamber and to make thermal contact with a second heat source to absorb heat
from the second heat source (120, 220, 420).
2, The apparatus (100, 200, 300, 400)
of claim 1, wherein the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in a
second direction in response to receiving heat in the second chamber.
15 3. The apparatus (100, 200, 300, 400)
of claim 1, wherein the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in the
same first direction in response to receiving heat in the second chamber.
4. The apparatus (100, 200, 300, 400)
of any one of claims 1 to 3, wherein the fluid is configured
| to change phase from liquid to gas in response to receiving heat from the first
20 heat source.
5. The apparatus (100, 200, 300, 400)
of any one of claims 1 to 3, wherein the fluid is configured
to undergo thermal expansion in response to receiving heat from the first heat
source.
6. The apparatus (100, 200, 300, 400)
of any one of the preceding claims, wherein
(182, 154)
the apparatus further comprises a nozzle and aEP 14306 608.8 ‘CLAIMS (14.17.2014) “AMENDED* 18 guna 19
diffuser (151, 153) located on a flow path of the fluid wherein a nozzle
(152, 154) is configured to
provide higher resistance to the flow of the fluid than a diffuser.EP 14306 608.8 CLAIMS (14.17.2014) “AMENDED* 1920
-19-
7. The apparatus (100, 200, 300, 400)
of any one of the preceding claims, wherein the first heat
source is configured to heat the fluid in the first chamber and cool the fluid in the
second chamber.
8. The apparatus (100, 200, 300, 400)
of any one of the preceding claims, wherein the first heat
5 source is a thermoelectric cooler.
9. The apparatus (100, 200, 300, 400)
of claim 8, wherein the first heat source is located between
the first chamber and the second chamber.
10. The apparatus (100, 200, 300, 400)
of any one of the preceding claims 1 to 7, wherein the first
heat source is a located outside the first chamber and the apparatus comprises a
10 third heat source located outside the second chamber, the third heat source
being configured to heat the fluid in the second chamber.
14. The apparatus (100, 200, 300, 400)
of any one of the preceding claims 1 to 7, wherein the first
heat source is a located inside the first chamber and the apparatus comprises a
third heat source located inside the second chamber, the third heat source being
15 configured to heat the fluid in the second chamber.
12. The apparatus (100, 200, 300, 400)
of claim 11, wherein the first heat source and the third heat
source each comprise one or more electronic or optical components configured
to generate heat during operation.
43. The apparatus (100, 200, 300, 400)
of any one of the preceding claims, further comprising a
20 cooling chamber configured to cool the fluid prior to the fluid reaching the second
heat source.
14. The apparatus (100, 200, 300, 400)
of any one of the preceding claims further comprising a
plurality of one-directional valves (461, 462, 463, 464)
being arranged so as to allow a flow of the fluidEP 14306 6088 CLAIMS (14.11.2014) "AMENDED" 19 guna +20
in one direction and to block a flow of the fluid in a direction opposite to the one
25 direction.EP 14306 608.8 CLAIMS (14.11.2014) _ "AMENDED* 2018
-20-
15. A heat transfer assembly comprising the apparatus of any one of the
previous claims 1 to 14 and further comprising a thermal energy removal
mechanism (130, 230, 330, 430).EP 14306 6088 DRAWING (14.11.2014) 1133 218
0
112
1130
18
13
{
4
TO
FI¢.
411
100
a”?
1A
1C
FIG.
FIG.EP 14306 6088 DRAWING (14.11.2014)
2/3
FIG. 24
230
260 CAML
BE Ley
213
212" ato 250 220
FI¢. 2B
242
244. 7
260
24 240 220 240 243
FIG. 3
330
313b ——
35t
312 H2
2838
200
4
260
213
2130
212
300
J
B30DRAWING (14.11.2014) 38
EP 14306 608.8
3/3
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‘OldApplication No,: 143068088
‘Substantive examination has started on 11.12.19 (see Notice from the European Patent Office dated
29.01.2013, OJ EPO 2013, 153).
For the Examining DivisionTeme European Patent Offce
pase ‘50288 MUNICH
GERMANY
‘Questions about this communication ?
Contact Customer Services at www. po orgloontact
Browne, Robin Forsythe
Hepworth Browne
16 St Paul's Street
Leeds LS1 216
ROYAUME UNI
Dae
04.01.19
[racer Toplsaion No Patent
BUR-P5893EP 44306808 8 - 1211 / 3021354
SRT ORT
Atcatel Lucent
Notice drawing attention to Rule 51(2) EPC, Article 2 No. 5 of the Rules relating to Fees,
= Payment of the renewal fee plus additional fee -
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The current rate of the renewal fee amounts to EUR 820,00 (see current Schedule of fees and costs),
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‘Additional fee’ EUR 410,00
TOTAL AMOUNT EUR 1230.00
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shall be deemed to be withdrawn (Art, 86(1) EPC),
Note to users of the automatic debiting procedure
The basic time limit for payment of the above renewal fee had already expired when the automatic debit
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[racer Toplsaion No Patent
BUR-P5893EP 44306808 8 - 1211 / 3021354
SRT ORT
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Revocation of the automatic debit order
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Communication of amended entries concerning the representative (R. 143(1)(h) EPC)
‘As requested, for the above-mentioned European patent application / European patent the
entries concerning the representative have been amended as follows:
Browne, Robin Forsythe
Hepworth Browne
48 St Paul's Street
Leeds LS1 2/6
GB
‘The amendment will be recorded in the Register of European Patents,
For the Examining
EPO Form2548 08.13 @are/te) page t of cowz22096NOKIA Nokia Technologies
EPo joerc
114 Juni 2018
EUROPEAN PATENT OFFICE
D- 80298 MUNICH
GERMANY
Nozay, June 11, 2018
Re.: Withdrawal of current representative at EPO
Applicant : Alcatel Lucent
Dear Sirs,
We write to you as current Applicant on record at the European Patent Register for the
applications attached in the Annex.
‘As Applicant in this matter, we Alcatel Lucent, confirm that Bruce Dearling and Robin Browne
of Hepworth Browne are - and have been - sub-authorized as our professional representative
before the EPO in the applicationis) listed in Annex. We further confirm that their sub-
authorization was effective from 1 February 2018 and that all actions taken since 1 February
2018 were made in a timely fashion and recognized as being fully authorized by the Applicant.
With respect to ongoing prosecution of the identified applications listed in Annex, please
send any future correspondence relating to the identified applications to Bruce Dearing at:
Hepworth Browne
15 St Paul's Street
Leeds
LS12JG
United Kingdom.
We would be grateful if you could confirm to Mr Dearling when the register has been updated
to reflect this change in representation.
We also include, for your information, the Subdelegation of Authority granted by Mrs
Emmanuelle Wetzel to Karine Berthier and the Delegation of Authority granted by Mr. Thierry
ALCATEL LUCENT
Site Nokia Paris Saclay, Route de Villjust Paget
191620 NOZAY ~ FRANCEBoisnon, President of Alcatel Lucent, to Mrs. Emmanuelle Wetzel as well as a Delegation of
Signature granted by Mr. Thierry Boisnon to Mr. Jéréme Mouney.
Very truly yours,
x Ya-
Karine BERTHIER Jéréme Mouney
Tel +33 17323 4276
E-mail: _Karine.berthier@[Link]
Ce. : Bruce C. Dearling - Hepworth Browne
Enl.:
= Annex: List of patent applications
= Delegation of Authority of the signatories
Annex Page 2Annex - List of Patent applications
Hepworth Browne
Applicant Reference naiaaaa Filing Date | Application number
siti67-eP-ePT BUR-PSO43EP. 06 Nov2013 | 13795078.8
BI116G-EP-EPT ___—_—«*(BUR-PS942EP | OGNov2013_| _13795082.0
811186-EP-PT BUR-PSOI4EP | 07 Jan2013 13700807.4
[giiaea-cp-epr BUR-PS944EP | OG Nov 2013 13795080.4
|'805912-€P-PT BUR-PS913EP. 16 Dec 2010 10842583.6.
B05812-EP-EPA___—_—_—*|BUR-P5918EP. 24 Dec 2010 10196979.8
'807606-EP-EPA BUR-PSOL9EP 01 Dec 2010 10306332.7
'807877-EP-PT BUR-P5920EP 19Dec2011_| _11807821.1
§12185-EP-PA BUR-PSS2aEP 12 dec 2012 | 12290433.7
816497-EP-EPA BUR-P5926EP. 19 Dec 2014 14307101.7
816780-EP-EPA ___[BuR-p5927¢P 04Dec 2014 | 14306946.6
816838-EP-EPA BUR-P5928EP 15 Dec 2014 143070308
813557-EP-EPA BUR-PS923EP 20 Dec 2013 13306803.1
jDe Lind Van Wijngaarden 30- -
3(AJ-EP-EPT BUR-PS8B4EP 04Nov2010_| _10829067.7
811538-EP-EPA BUR-PSBB7EP 07 Nov 2012 12290385.9
811593-EP-EPA BUR-PSBB9EP 22 Nov 2012 12306452.9
('312330-€P-€PA | BUR-P58S0EP 30 Nov 2012 123064974
B14497-EP-EPA BUR-P5892EP 03 Dec 2013 133066555
817163-EP-£PA__ BUR-PSBO3EP. 14 Nov 2014 14306808.8
1578-EP-EPA BUR-PS8BSEP 21 Nov 2012 122904063
'813200-EP-EPA BUR-PS891EP 27 Nov 2013 13194668.3
809715-EP-EPA BUR-PSBO9EP. 13 Dec 2011 112905732
805477-EP-EPT BUR-P5897EP 23 Nov 2010 10793076.0
'805687-EP-EPT | [Link] 2010 107954943
810922-£P-EPA 14 Nov 2011 11306473.7__|
807961-E9-EPT | 30 Nov 2010 10838367.0
Farag 5 (EN) BUR-PS966EP 2iJul2006 | —_06788065.8
114802-EP-EPA BUR-PS967EP 28 Jul 2005 05291616.0
105766-EP-EPA BUR-PSOG6BEP | _07 Jul 2006 06116862.1
114541-£-EPA BUR-PS9G9EP (05 Jul 2005 05291455.3
103861-£P-EPA ___[bur-P5970€P 04 jul2003_| _03291662.9
800663-EP-EPT BUR-P597IEP 244ul2008 | _08786415.3
106235-EP-EPA BUR-P59726P 04 Jul 2007 071117360
114435-EP-EPA BUR-PSO73EP__| _15Jul 2004 (042918029
113468-EP-EPA BUR-PS978EP (08 Aug 2002 020178364 |
814664-EP EPA TeuR-pcoise> | 13sep 2013 | 132902206 |
813586-EP-EPA BUR-P6O13EP 29 Mar 2013 13161872.0
'809604-EP-EPT BUR-P6OO9EP 47 Apr 2012 12715384.9
'812306-EP-EPT BUR-P6OL1EP 26 Aug 2013 13786751.
‘Annex Page 1Hepworth Browne |
|__ Applicant Reference teas Filing Date
[Garrett 4-5(0)-€P ‘| BUR-P6023EP (02 Aug 2002
812637-EP-EPA. ‘BUR-P6012EP 27Sep 2012 | _12306173.1
[811232-EP-EPA [suR-psoo7eP | _27Jan2012__| 123600066
'806800-EP-EPT BUR-P6OOSEP 15 Sep 2011 11768193.2
811125-EP-PT _[sur-P6010EP 22Jan2013_ | 13703218.1
'814771-EP-EPA BUR-PGOLAEP 02 Aug 2013 | _13360015.5
'814739-EP-EPA BUR-P6O1GEP (09 Aug 2013 133061416 |
[815694-EP-EPA BUR-P6O17EP 14306148.9
[Bachi8-28-24-12 BUR-PGO18EP 116 Aug 2006 (06789770.2
801729-EP-EPA____—_—_—~(| BUR-P6026EP. (09 Aug 2007 (07301301.3,
812306-EP-EPT BUR-P6027EP 22 Aug2011_| 117491563,
'812290-EP-PT BUR-P6O28EP | _23 Aug 2013 137569745
Mooney 5-27 (CF-EP-EPT __[BUR-P60Z9EP__| _10 Jan 2007 07716496.0
812372-EP-EPA BUR-P6O3OEP 29 Aug 2012 12290285.1_
'807966-EP-EPA BUR-P6OB1EP 28 Jan 2011 "11290053.5
'811135-EP-EPA BUR-P6O32EP 26 Jan 2012 12305102.1
806414-EP-EPT BUR-P6O33EP__ | 12 Jul 2013, 13740164.2
814534-€P-EPA ___|BUR-P6034EP 22 Oct 2013, 13306454.3
816825-EP-EPA BUR-PGO3SEP 06 Jan 2015 | __15305007.5
809186-EP-EPT BUR-PGO3GEP 23 May 2012 | 127262871 _|
812488-EP-EPT BUR-P6037EP 30 Oct 2013 138523436 |
816933-EP-EPA BUR-P6O38EP 13 Oct 2014 14306613.2_
812313-EP-PT BUR-P6OSOEP 11 Jul 2013 13742091.5
'810098-EP-PT BUR-P604BEP 33 Jul 2012 12769461.0
'812029-EP-PT BUR-P6O49EP 03 Jul 2013 137404216 _
{811295-EP-EPT BUR-P6047EP 22 Jul 2013 13771594.2
811641-€P-EPA ____|pur-P60s4eP 16 Jan 2013 "13305042.7
BUR-P6O63EP _|-_0734908.2
i [BuR-PEOSGEP | 23 Nov.2010_ 10785282.4
|812077-€P-PT | BUR-P6OS9EP 22 May 2013 13727547.5
811825-EP-PT | BuR-P60SEP 13 Jun 2013, 13732321.8
'812604-EP-EPA ___|BuR-P6060EP 1iFeb2013 | 13290026.7
Dominique 11-8(F)-EP-EPA | BUR-P6O62EP 20 Jul 2005 _ 05254499.6
'800095-EP-EPD BUR-PGOSSEP | 30Nov2007 | 14290184.2
814868-EP-EPA BUR-PGOG7EP | _21 Jan 2014 14305078.9
150063-EP-PT BUR-PGOGGEP 16 Jan 2008 (08719874.3
801935-EP-EPT BUR-P6O75EP 29 Aug 2008 (08829870.8
|[803157-EP-EPA __|Bur-P6326eP 12 Aug 2009) 09167677.5
808712-EP-EPA BUR-P6332EP | _27 Jan 2011 11290047.7
809541-EP-EPT ‘BUR-P6333EP 15 Mar 2013 13713656.0
810894-EP-EPA [eur-peaa4ep | 31 Jan 2012 12290038.4
‘Annex Page 2Hepworth Browne
‘Applicant Reference Reoae Filing Date | Application number
135970-EP-EPA BUR-P6O78EP___| 10 Oct 2002 020229035 |
[[s00057-ep-EPT BUR-P6O99EP | 31 Aug 2007 (07849300.4
[800373-€P-EPT BUR-P61O1EP_ 20 Jul 2007 07787791.8
'801180-EP-EPT [BUR-P6102EP 26 Mar 2009_| __09726713.2
'803107-EP-EPT BUR-P6108EP 14 Dec 2009 (09803855.7
B03515-EP-EPA BUR-P6110EP (02 Nov 2009 091747725
804283-EP-EPA BUR-P61EP | _12Mar 2009 (09305228.0.
805516-EP-EPA BUR-P6117EP 12 Aug 2009 (093600385 _
|806114-€P-€PT [BuR-P61196P 10 Aug 2007_| _07801606.0
|(806957-EP-EPT BUR-P6123EP O5jul2011_| _11743092.6
'807101-£P-EPT_ BUR-P6124EP ~ 10 Jan 2012 127015709
17805-EP-EPT BUR-P6127EP 27 Jun 2011 117414755 __|
308362-EP-EPA BUR-P6129EP 16Dec 2010 | _10306424.2
809420-EP-EPA BUR-P6137EP 10 Aug 2011 11360036.5
'809503-EP-EPT BUR-P6138EP 30 Apr 2012 12720358.6
'809509-EP-EPA BUR-P6139EP 30 May 2011 11360021.7
809592-EP-EPA BUR-P6142EP 7 Jul 2023 113058713
£809628-EP-EPA BUR-P6145EP (06 May 2011 11305534.7
'809913-EP-EPA BUR-P6I50EP | 16 Jun 2011 11360024.1
'809922-EP-EPA BUR-P61S1EP_ 06 Sep 2011 11290397.6
810118-EP-EPT BUR-P61526P 27 Jun 2012 12737938.6
810660-EP-EPA BUR-P6163EP 21 Jun 2012 12305711.9
['810825-EP-EPA BUR-PEIGGEP | _11Jun 2012, 12305666.5
(810886-£P-EPA [BUR-P6169EP_ (02 Aug 2012 12360051.2
811121-EP-£PA | BUR-P6174EP 16 Mar 2012 | __12360018.1
811133-EP-EPA BUR-P6177EP 34. Jan 2012 12305115.3,
‘811155-EP-EPT BUR-P6178EP 25Sep2013_| _13774874.5
811663-£P-EPA BUR-P6191EP 25 Mar 2013 133053579 |
811959-EP-EPT BUR-P6197EP (08 May 2013 13724681.5
812659-EP-EPA BUR-P6208E 27 Sep 2012 12360070.2
812990-EP-EPA BUR-P6215EP (05 Nov 2012 12306366.1
813610-EP-EPA BUR-P6225EP | _04 Mar 2013, 133052423
813791-EP-EPA BUR-P6226EP | _ 26 Mar 2013, 131609984 |
813873-EP-EPA | BUR-P6230EP_ 30 May 2013 13305717.4
813919-EP-EPA "| pur-P6233EP 25Sep2013__| _ 13306307.3
814230-€P-EPT BUR-P6237EP 25 Mar 2015 157162603
814233-€P-EPT BUR-P6238EP 22 Oct 2014 14831067.5
814372-EP-EPA BUR-P6240EP | _ 26 Sep 2013 13306313.1
814033-EP-EPA BUR-P6241EP | __10 Apr 2014 143055226 |
([s14643-eP-EPA BUR-P6242EP 04Mar2014 | _14305306.4
[814656-€P-EPA [BUR-P6243EP 27Sep2013_| __13306338.8
Annex Page 3Hepworth Browne
__
Applicant Reference aeaee Date | Appi
814933-EP-€PT ‘BUR-P6247EP 202014 | 147937171
815632-EP-EPT BUR-P6256EP 11 Aug 2015 15837154.2
'815664-EP-EPA BUR-P6257EP 30 Jan 2014 143051282 |
815695-EP-EPA ___[Bur-P62sgeP 30 Jan 2014 14305121.7
817182-EP-EPA —_[pur-p6272eP 24 Apr 2015 -
817426-EP-EPA_ BUR-P6273EP 19 Dec 2014
['817662-EP-EPA BUR-P6276EP 24 Apr 2015 15305630.4
818246-EP-EPA BUR-P6278EP | _ 04 Aug 2015 15306264.1
819475-EP-EPA __[BuR-P6279EP 13 Sep 2016 16306154.2
105618-EP-EPA BUR-P6338EP 42 Jul2005 | __05106371.7
106278-EP-EPA [pur-p6asee | _23 Oct 2007 (07119074.8
BUR-P6340EP_ 11 Jul 2007 | __07290882.5
~_[BuR-P6367EP 28 Sep 2007_| _07291175.3
805130-EP-EPA BUR-P637SEP 12 Aug 2009 09305751.
805561-£P-EPA BUR-P6378EP 05 Jan 2010 | 10805007.
806615-EP-EPA BUR-P63B3EP 16 Aug 2010 103058939 |
807031-EP-EPA BUR-P6387EP 28 Jun 2010 103056883 |
'807967-EP-EPT_ BUR-P6396EP 28 Jul 2011 11743909.
‘808510-EP-EPT ‘BUR-P64O0EP (09 Jul 2004 047676515
| 808870-EP-EPT BUR-P64O3EP. 06 Sep 2011 117553073
808917-EP-EPT BUR-PEAOAEP 19 Nov 2012 127956928 __|
(s1i3ig-ep-eeT __—_—_—*| BUR-P6416EP 23Sep 2013 | _13844321.3
811577-EP-EPA BUR-P6AI7EP 06 Jun 2012 12305638.4
811873-EP-EPA BUR-P641SEP 10 Sep 2012 122902984
812158-EP-EPA___—_| BUR-P6421EP. 30 Oct 2012 12306353.9__
£812467-EP-EPA ___[pur-pea2ser 03Dec2012_| __12306506.2
813901-EP-EPA BUR-P6427EP "24 May 2013 13305677.0
BUR-PG428EP. 17 Jan 2014 14305063.1
IE BUR-P6433EP 30 Jan 2014 143051308
816763-EP-EPA BUR-P6434EP 29 Jan 2015 15305101.6
817272-EP-EPA BUR-P6436EP. 30 Jan 2015 15305138.8
Annex Page 4NOKIA
SUBDELEGATION DE POUVOIRS
SUBDELEGATION OF AUTHORITY
La Soussignée,
|, the undersigned,
Emmanuelle WETZEL,
Agissant en qualité de Director Patents, intellectual Property Business Group pour Alcatel
Lucent, Société par Actions Simplifiée au capital de 176 984 245.95 EUR, dont le siége social
est situé 4 Boulogne-Billancourt 92100, 148/152 route de la Reine, immatriculée sous le
numéro 542 019 096 R.C.S. NANTERRE, }, décide de déléguer des pouvoirs a:
Acting in my capacity as Director Patents, Intellectual Property Business Group for Alcatel
Lucent, société par actions simplifiée (simplified form limited company) with a share capital
of 176 984 245.95 EUR, Registered at 542.019 096 RCS Nanterre with its registered office
in Boulogne-Billancourt 92100, 148/152 route de la Reine, hereby grant authority to:
Karine BERTHIER
Responsable Brevets Sites FR
FR Sites Patenting Manager
Patent Business Organization
En cette qualité Karine BERTHIER disposera des pouvoirs suivants, conformément a la
numérotation de la délégation générale, sous les conditions ci-aprés précisées:
Karine BERTHIER, in her capacity of FR Sites Patenting Manager, is granted the following
authority according to the general delegation numbering:
4~ JURIDIQUE, CONTENTIEUX, ASSURANCE
LEGAL MATTERS, LITIGATION, INSURANCE
4.5. Protection, gestion, acquisition, disposition de droits de propriété intellectuelle
ae ee ‘intel separte Li
a) Faire toute demande de brevet, dépat de marque, de dessin et modéle, demande
d'enregistrement de nom de domaine et, généralement, effectuer toute démarche,
passer toutacte visant la protection de tout droit de propriété intellectuelle (brevet,
marque, dessin et modéle, droits de propriété intellectuelle et artistique, logiciel,
etc);
Submit patent requests and register trademarks, designs and models, requests for
domain names and in general take all measures, execute any instruments for the
purpose of protecting intellectual property rights (patents, trademarks, designs and
models, intellectual and artistic property rights, software etc);NOKIA
b) Acquérir, transférer, concéder ou recevoir en licence ou sous-licence, radier et
généralement disposer de tout droit de propriété intellectuelle, notamment de tout
brevet, toute marque, tout dessin et modéle, tout droit de propriété littéraire et
artistique, tout logiciel, de toute licence des droits précités et de tout
enregistrement de nom de domaine ;
‘Acquire, transfer, grant or receive licenses or sub-licenses, cancel and, in general
make use of any intellectual property right, in particular any patent, trademark,
design or model, literary and artistic property right, software, any license of said
rights and of any registration of domain name;
) Agir pour le compte de la Société pour toute question ou procédure judiciaire ou
administrative relative aux droits de propriété intellectuelle et les transactions y
afférentes ;
‘Manage on behalf of the Company alll legal, judicial and administrative matters and
proceedings relating to intellectual property rights and the settlements related
thereto;
d) Conclure tous accords relatifs aux droits des salariés en matiére de propri
intellectuelle.
Enter into agreements relating to employees’ rights with respect to intellectual
property.
Formalities
Accomplir toute formalité exigée par les lois francaises et étrangéres applicables
Ala Société.
Complete all formalities required by French and foreign laws that are applicable to the
Company.
ecm oe
Représenter la Société vis-a-vis de toute administration, de tout ministére, de tout
gouvernement, en dehors de I'administration fiscale, des douanes et des droits
indirects.
Represent the Company before third parties, ministries, governments, cities,
municipalities, local communities, administrations, except taxation authorities,
‘customs and indirect right authorities.> Pouvoirs pouvant atre exercés conformément a la réglementation des signatures du
Groupe Nokia telle que décrite dans les documents “Standard Operating Procedure
Policy on Signatory Rights” et “Limits of Authorization”
Authority that may be exercised strictly in accordance with the Nokia Group signature
policies as stated in the documents “Standard Operating Procedure Policy on Signatory
Rights” and “Limits of Authorization";
> Pouvoirs pouvant étre exercés a l’exclusion des marques, noms de domaines et droits
d'auteur et dans la limite de 50 million d'euros par opération :
Authority that may be exercised except for trademarks and domain names and copyrights
and within the limits of 50 million euro per operation:
45a)
> Pouvoirs pouvant étre exercés & 'exclusion des marques, des noms de domaines, des
droits d'auteur et des accords de licences et dans la limite de 100 million d’euros par
opération :
‘Authority that may be exercised except for trademarks and domain names and copyrights
and except for license agreements and within the limits of 100 million euro per operation:
4.5b)
> Pouvoirs pouvant étre exercés pour chacun des points a l'exclusion des marques, des
noms de domaines et des droits d'auteur, et pour 1.1), & l'exclusion des accords de
licences:
Authority that may be exercised, each for except trademarks and domain names and
copyrights, and for 1.1 c} except for license agreements:
45d), 4.50)
Cette subdélégation a durée indéterminée prend effet & compter de la signature des
présentes et prendra fin de plein droit avec les fonctions du délégataire ou par révocation
expresse du délégant.
This subdelegation is of indefinite duration and enters into effect as from the signing of the
present document. It shall be automatically terminated in case of termination of the
delegate’s mandate or if expressly revoked by the delegator.
Fait a Stuttgart, le 13 mars 2017 Bon pour acceptation
Executed in Stuttgart, on March 13”, 2017 Delegation of authority accepted
he ct
Emmanuelle WETZEL Karine BERTHIER
Director Patents
Intellectual Property Business GroupNOKIA
DELEGATION DE POUVOIRS
DELEGATION OF AUTHORITY
Je soussigné,
4 the undersigned,
‘Thierry BOISNON,
agissant en qualité de Président d'Akatel Lucent, Société par Actions Simplfiée au capital de
176.984 245.95 EUR, dont le siége social est situé & Boulogne-Billancourt 92100, 148/152 route de
la Reine, immatriculée sous le numéro 542 019 096 [Link]. NANTERRE, décide de déléguer des
powoirs.
acting in my capacity as President of Alcatel Lucent, société par actions simplifige (simplified form
limited company] with a share capital of 176 984 245.95 EUR, Registered at 542 019 096 RCS
Nanterre with its registered office in Boulogne-Bilancourt 92100, 148/152 route de la Reine,
hereby grant authority to:
Emmanuelle WETZEL,
Director Patents
Intellectual Property Business Group
En cette qualité Emmanuelle WETZEL disposera des powvoirs suivants, conformément & la
‘numérotation de la délégation générale, sous les conditions ci-aprés précisées:
Emmanuelle Wetzel, in her capacity oF is granted the following authority according to the general
delegation numbering:
4— —Junivique, CONTENTIEUX, ASSURANCE
LEGAL MATTERS, LITIGATION, INSURANCE
a) Faire toute demande de brevet, dépét de marque, de dessin et modéle, demande
denregistrement de nom de domaine et, généralement, effectuer toute démarche,
passer tout acte visant la protection de tout droit de propriété intellectuelle (brevet,
marque, dessin et model, droits de propriété intellectuelle et artistique, logiciel, ete);
Submit patent requests and register trademarks, designs and models, requests for
domain names and in general take all measures, execute any instruments for the
Purpose of protecting intellectual property rights (patents, trademarks, designs and
‘models, intellectual and artistic property rights, software etc}NOKIA
bb Acquérir, transférer, concéder ou recevoir en licence ov sousdlcence, radier et
énéralement disposer de tout droit de propriété intellectuelle, notamment de tout
brevet, toute marque, tout dessin et modéle, tout droit de propriété littéraire et
artistique, tout logiciel, de toute licence des droits précités et de tout enregistrement de
nom de domaine ;
Acquire, transfer, grant or receive licenses or sub-licenses, cancel and, in general make
use of any intellectual property right, in particular any patent, trademark, design or
‘model, literary and artistic property right, software, any license of said rights and of any
registration of domain name;
l_ Agir pour le compte de la Société pour toute question ou procédure judiciaire ou
‘administrative relative aux droits de propriété intellectuelle et les transactions y
afférentes;
‘Manage on behalf of the Company all legal, judicial and administrative matters and
proceedings relating to intellectual property rights and the settlements related thereto;
9} Conclure tous accords relatifs aux droits des salariés en matiére de propriété
intellectuelle,
Enter into agreements relating to employees’ rights with respect to intellectual
property.
413 Eormaltés diverses
Formalties
‘Accomplir toute formalité exigée par les lois francaises et étrangéres applcables & la Société.
Complete all formaities required by French and foreign laws that are applicable to the
Company.
4.14 Administrations diverses (hors administration fiscale)
Représenter la Société vis-8-vis de toute administration, de tout ministére, de tout
gouvernement, en dehors de administration fiscale, des douanes et des droits indirects.
Represent the Company before third parties, ministries, governments, cities, municipalities,
‘focal communities, administrations, except taxation authorities, customs and indirect right
authorities.NOKIA
73
14
75
76
Négocer, signer, moder, résiler tout contrat-cadce global achat de fouritures, de
prestations de services et de sous-traitance, accord pouvant déboucher & terme sur des
‘commandes ou contrats particuliers passés directement par les fllales du Groupe et réglés
par eles.
‘Negotiate, sign, modify and terminate global purchase framework agreements for supplies,
‘services and subcontracting agreements, which can eventually lead to purchasing orders
directly placed by the Group's subsidiaries and handled by them.
Négocer, signer, modifier, és tout corrat-adhe local achat de foumitures, de
prestations de services et de sous-traitance, accord pouvant déboucher & terme sur des
commandes ou contrats particuliers passés directement par la Société et réglés par elles.
‘Negotiate, sign, modify and terminate local purchase framework agreements for supplies
and services, sub-contracting agreement.
Negocir, signer, modi, rsiler tout contrat global achat de fournturs, de prestations
de services et de sous-traitance, accord pouvant déboucher 8 terme sur des commandes ou
contrats particuliers passés directement par les fiiales du Groupe et réglés par elles.
Negotiate, sign, modify and terminate global purchase framework agreements for supplies,
services and subcontracting agreements, which can eventually lead to purchasing orders
directly placed by the Group's subsidiaries and handled by them.
« ra : 7
Local;aurchase agreements for supplies, services, sub-contract
Négocier, signer, résier tout contrat local d'achat de fournitures, de prestations de services
et de sous-traitance.
Negotiate, sign, and terminate locel purchase agreements for supplies and services, and
sub-contracting agreements.
Bons de commandes
Purchase orders
Emettre, signer, modifier et résilier tout bon de commande de fournitures, services ou de
‘sous-traitance dans les mites des contrats auxquels is s‘appiquent.
‘Issue, sign, modify and terminate purchase orders for any supplies or services or
subcontracting agreements within the limits of the agreements.NOKIA
Limites sur les pouvoirs de cette délégation:
Further detail and constraints of this delegation:
> Pouvoirs pouvant &tre exercés conformément & la réglementation des signatures du
Groupe Nokia telle que décrite dans les documents “Standard Operating Procedure Policy
on Signatory Rights” et “Limits of Authorization” ;
Authority that may be exercised strictly in accordance with the Nokia Group signature
policies as stated in the documents “Standard Operating Procedure Policy on Signstory
Rights" and “Limits of Authorization’:
.
Pouvoirs pouvant étre exercés a 'exclusion des marques, noms de domaines et droits d'auteur
et dans la limite de 50 milion d'euros par opération :
Authority thet may be exercised except for trademarks and domain names and copyrights and’
within the limits of 50 milion euro per operation:
45a)
% Pouvoirs pouvant étre exercés & Fexclusion des marques, des noms de domaines, des droits
d'auteur et des accords de licences et dans la limite de 100 million d'euros par opération :
Authority that may be exercised except for trademarks and domain names and copyrights and!
except for license agreements and within the limits of 100 milion euro per operation:
45b)
Pouvoirs pouvant étre exercés pour chacun des points & exclusion des marques, des noms de
domaines et des droits d'auteur, et pour 1.1), 8 exclusion des accords de licences:
Authority that may be exercised, each for except trademarks and domain names and
copyrights, and for 1.1 ¢) except for license agreements:
450,450)
a
Powvoirs pouvant atre exercés dans les limites prévues dans la délégation générale et dans la
mite de 500.000 euros par opération :
Authority that may be exercised within the limits provided in the general delegation and within
the limit of 500 000 eures per transaction:
72,73,7.4,75,78
> Pouvoirs pouvant étre subdélégués, par écrit, toute personne de son choix et dans les limites
quilfixera :
Authority that may be subdelegated, in writing, to any person of his choice and within limits to
be set:
45 alet 4.5 b) et pour chacun de ces points & exclusion des marques, des noms de domaines,
des droits d'auteur et pour chacun dans les limites fixées ci-dessus et pour 4.5b) et 4.5) &
Texelusion des accords de lcerices, 4 Sd), 4.13, 4.14
45 al and 4,5 6) each except trademarks and domain names and copyrights and each within
the monetary constraints set hereinabove, and for 4.5 b| and 4.5 ¢) each except for licenses
agreements, 45d), 4.13, 4.14NOKIA
La présente détégation annule et remplace ta délégation émise en votre faveur en date du 21
juin 2016.
The present delegation cancels and replaces that granted to you on June 21", 2016.
Cette délégation a durée indéterminée prend effet & compter de la signature des présentes et
prendra fin de plein droit avec les fonctions du délégataire ou par révocation expresse du
délégant.
This delegation is of indefinite duration and enters into effect as from the signing of the present
document. It shall be automatically terminated in case of termination of the delegate's mandate or
‘if expressly revoked by the delegator.
Fait 4 Boulogne-Billancourt, le Ter mars 2017 Bon pour acceptation
Executed in Boulogne-Bilancourt, on March 1st, 2017 Delegation of authority accepted
—__—_ 7
a Hh
Emmanuelle WETZEL
‘Thierry BOISNON
PresidentNOKIA
DELEGATION DE SIGNATURE
DELEGATION OF SIGNATURE
Je soussigné,
|, the undersigned,
Thierry BOISNON,
agissant en qualité de Président dAlcatel Lucent, Société par Actions Simplifiée au capital de
176 984 245.95 EUR, dont le siége social est situé & Boulogne-Billancourt 92100, 148/152 route de
la Reine, immatriculée sous le numéro 542 019 096 R.C.S. NANTERRE,
acting in my capacity as President of Alcatel Lucent, société par actions simplifiée (simplified
form limited company) with a share capital of 176.984 245.95 EUR, Registered at 542 019 096
RCS Nanterre with its registered office in Boulogne-Bilancourt 92100, 148/152 route de la Reine,
Constitue par la présente et nomme les personnes ci-dessous 8 effet de contresigner au nom et
our le compte d’Alcatel Lucent, tous les documents concernant le domaine des brevets au nom
de la société, en qualité de second signataire, pour répondre a la procédure de double-signature du
Groupe Nokia:
Do hereby constitute and appoint the folowing persons as our representatives to counter-sign for
and on behalf of Alcatel Lucent, any and al documents related to patents for the company as
second signatory, to meet the double signature Nokia Group process :
Domenico MENZIETTI (Stuttgart) - Senior IP Corporate Counsel
Jéréme MOUNEY (France) - Senior IP Counsel
Cette délégation de signature annule et remplace la précédente accordée le 13 mars 2017 et entre
en vigueur 8 compter de la date mentionnée ci-dessous. La présente délégation est régie et
constituée conformément au droit francais.
This Delegation of Signature cancels and supersedes the DOS granted on March 13%, 2017 and is
valid as of the date set out below. It shall be governed by and construed in accordance with the
lows of France.
Fait 8 Boulogne-Billancourt, le ter juillet 2017
Executed in Boulogne-Billancourt, on July 1st, 2017
‘BOISNON
Président11.06.18 15:08 Nokia 00496966814851000 1/ 16
Please find attached an important communication from the Applicant currently registered at EPO,
Yours faithfully,
Karine BERTHIER:
European and French Patert Attorrey
‘Tectraiogy Aron Laed, Senices / Appicatcns & Anaiytics
‘Site Manager Paterting rgonization = FRstes
Patent Susie «|
‘Sito do Nokia Pars Saclay, Route do Villgust, 91820 Nozay, FR
“T439 (0)1 7923 4276 | Me +39 (0) 3770 8373
sacoeliecier@eekacom
Received at the EPO on Jun 11, 2018 [Link]. Page 1 of 16
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NOKIA.
EUROPEAN PATENT OFFICE
D- 80298 MUNICH
GERMANY
Nozay, June 11, 2018
Withdrawal of current representative at EPO
Applicant : Alcatel Lucent
Dear Sirs,
We write to you as current Applicant on record at the European Patent Register for the list of
applications attached in the Annex.
As Applicant in this matter, we Alcatel Lucent, confirm that Bruce Dearling and Robin Browne
of Hepworth Browne are - and have been - sub-authorized as our professional representative
before the EPO in the application(s} listed in Annex, We further confirm that their sub-
authorization was effective from 1 February 2078 and that all actions taken since 1 February
2018 were made in a timely fashion and recognized as being fully authorized by the Applicant.
With respect to ongoing prosecution of the identified applications listed in Annex, please
send any future correspondence relating to the identified applications to Bruce Dearling at:
Hepworth Browne
15 St Paul's Street
Leeds
LSt 2UG
United Kingdom.
We would be grateful if you could confirm to Mr Dearling when the register has been updated
to reflect this change in representation.
We also include, for your information, the Subdelegation of Authority granted by Mrs
Emmanuelle Wetzel to Karine Berthier and the Delegation of Authority granted by Mr. Thierry
ALCATEL LUCENT.
Site Nokia Paris Saclay, Route de Villejust Page’
91620 NOZAY ~ FRANCE
Received at the EPO on Jun 11, 2018 [Link]. Page 2 of 16
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Boisnon, President of Alcatel Lucent, to Mrs. Emmanuelle Wetzel as well as a Delegation of
Signature granted by Mr. Thierry Soisnon to Mr. Jérome Mouney.
Very truly yours,
fe
v7
tL-
< Poo
Karine BERTHIER Jéréme Mouney
Tel +33 17323 4276
E-mail: [Link]@[Link]
Cc. : Bruce C. Dearling - Hepworth Browne
Eni.
= Annex: List of patent applications
- Delegation of Authority of the signatories
Annex Page 2
Received at the EPO on Jun 11, 2018 [Link]. Page 3 of 16 ——
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Annex - List of Patent applications
Applicant Reference | M#PMORHREFOWNE) Filing Date | Application number
11167-EP-EFT BUR-PS943EP 6 Nov 2013 137950788
811166-EP-£°T BUR-PSSa2EP | 06 Nov 2013 13795082.0
11186-P-PT | BUR-PS@IAEP 07 Jan2013 13700807.4
gi1168-EP-cPT BUR-PS9aaEP (06 Nov 2013 137950804
'[Link] 13 16 Dec 2010 10842583.6 |
805812-£P-EPA BUR-PSOLBEP 24 Dec 2010 10196979.8
207606-£°-EPA BUR-P5919EP (01 Dec 2010 10306332.7
807877-EP-PT BUR-PSO20EP 39 Dee 201: 11807821.1
812185-E0-EPA BUR-PS921EP 12 Dec 2011 12290433.7
836497-F°-£PA BUR-PSO26EP 19 Dec 2014 14307301.7
S16720-€P-EPA ‘BUR-P5927EP (04 Dec 2014 14306946.6
'816838-EP-EPA BUR-PS928EP 15 Dec 2014 14307030.8
'813557-EP-EPA BUR-PS9236P 20 Dec 2013 13306803.1
De Lind Van Wijngaarden 30- |
3 (NMEP-EPT BUR-PSBS4EP 04 Nov 2010 10829067.7
811538-€7-£PA BUR-PSBS7EP 7 Nov2012 12290385,9
811593-E0-4PA BUR-P5889EP 22 Nov 2012 32306452.9,
812339-EP EPA BUR-PS890EP 30 Nov2012 17306097.4
814497-FP-EPA BUR-PSE9ZEP 03 Dec 2013 133066555
817163-€P-EPA BUR-PSE93EP 14Nov2014 | 14306808.8
811578-€P-EPA BUR-PSBBBEP 21 Nov2012 12290406.3
'813200-EP-£PA ‘BUR-PSB91EP 27 Nov 2013 13194668.3
'809715-£P-£PA ~[eur-P5eo9eP 33 Dec 2011 31290573.2
805477-€0-EPT BUR-PSS97EP 2a Nov2010_| _10793076.0
805687-£°-EPT ‘BUR-PSB9BEP 22Nov2010_|_10795494.3
810922-£9-EPA BUR-PSOOLEP 24 Nov 2011 11306473.7
807561-tP-EPT BUR-PSSOZEP | _30Nov2010 30836367.0
Farag 5 (EN)-EP-EPT BUR-PSS6GEP [Link] 2006 067880658
114802-€P-EPA ‘BUR-P5967EP 28 Jul 2005 (05291616.0
105766-EP-EPA BUR-PS9BREP 07 Jul 2008 (06116862.1
114541. €P-EPA ‘BUR-PS969EP 05 Jul 2005 05291455.3,
108861-€P-EPA BUR-P5970EP 04 Jul 2008 (03291662.9
[so0663-eP-cPT BUR-PS971EP 24 Jul 2008 (087864153
106235-EP-EPA_ BUR-PS972EP (04 Jul 2007 (071117360
1114435-£°-£PA BUR-PS973EP 15 Jul 2004 '04291802.9
313468-P-EPA BUR-PS97BEP (08 Aug 2002 (02017835.
814664-EP-£PA BUR-PEOLSEP 13 Sep 2013 13290220.6
BUR-P6OL3EP 29 Mar 2013_| 131618720
809604-E9-EFT BUR-PGOODEP 17 Apr 2012 127153849
812306-6P-€FT_ BuRpeo11EP | 26 Aug2013 | __13786751.1
‘amex Page?
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Applicant Reference [*PWORMBFOWNE] Fring pate | Application number
Garrett 4-5(D)-EP. BUR-P6O23EP_ 02 Aug 2002 02753430.4
812637-£P-€PA, euR-p6oizE | 27Sep2012 | 12306173.
811232-EP-EPA BUR-P6OO7EP 27 Jan 2012 | 12360006.6
806800-EP-EPT BUR-P6008EP_ 15 Sep 2011, 117681932
311125-€P-PT BUR-PG0L0E | 22 Jan 2013 | 13703218.1
814774-€9-£PA auR-peo1aep | a2 aug 2013 | —13360015.8
814739-£9-£PA BUR-PGOIGEP | _0.Augzois| 133061016
815694-£9-EPA BUR PeOI7EP 1Siul2014 | 14306148.9
Bachi8-28 24-12 BuR-pco1seP | 16 Aug 2008 | 067807702
801725-£P-EPA uR-p6026EP | 09 Aug 2007 | 07301301.3
[312306-€P-EPT un-pco27er | 22 Aug 2004 | 117491563
'317290-6P-PT wun-peoaser | 23 aug 2013 | 137569745
Mooney 5-27 (CF)-EP-EPT | BUR-P6029EP 110 Jan 2007 07716496.0
812372 EF £PA sun-p6030e | 29 aug 2012 | 17290285.1
807966 €P-£PA BUR PGO3tED 28an2011 | 112900535
B11135-EP-£PA BUR Pe032EP 26 an 2012 | 19305202.
a0eai-eP-ePT BUR-PGO33EP 32 ul 2013 137401642
814534-EP-EPA BUR-P6034EP_ 22 Oct 2013 13306454.3
816825-E9-EPA eua-pe03se | 06 Jan 2015 | 15305007.5,
809186-EP-EPT auR-p6036e | 23 May 2012 | __12726087.1
1248e-e-EPT sur-P6037e | 300ct 2013 | 13887343.6
816933-EP-£PA BuR-Peo3ac | 13 oct 2014 | 143066132
812313-EP-PT BUR-P6OSOEP- 11 Jul 2013 13742091.5,
810098-EP-PT_ BUR-PGO48EP_ 13 Jul 2012 127694610
3312029-¢9-PT BUR P6OASEP 03 42013 13740421.6
811295-LP-EPT BUR 6047E 224ul2013 137715942
811641-E7-£PA DUR-P6OSaEP 36Jan 2013 | 1930500a.7
150163-EF7-£P juR-p6063¢° | 06 Mar2007__| 077349082
'805547-EP-PT juR-D6056e | 23Nev2010 | 1078882.8
812077-€0-0T jUR-D50SaFP | ~22May 2013 | 13727547.5
e11825-10-6T ‘BUR. P60SBEP 134un2013 | 137303248
812604-EP-EPA_ BUR-P6OGOEP_ 11 Feb 2013 13290026.7
Dominique 11-8(F)-EP-EPA_ BUR-P6062EP_ 20 Jul 2005 05254499.6
200095-£P-£PD BUR-PGOSSEP | 30 Nov 2007 | 14290484.2
814868-EP-EPA. BUR-P6O067EP- 21. Jan 2014 14305078.9
150063-£0-9T BUR-PGO6GED 16Jan-2008 | 087198743
801935-€0-EPT BUR-pG075E | 29 Aug 2008 | 088298708
803157-CP-EPA auR-p5326¢> | 12 Avg 2009 | 091676775
'808712-£7-£PA euR-b6337E7 | 27 Jan 2011 | 11290087.7,
B0954i-EP-EPT ‘BUA-b6333EP 15 Mar2013_| 137136560,
810894-£P-£PA “Tate peasacr 3iJan2012 | iza900384
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Applicant Reference [FPMORRBOWP] ing Date | Application number
135870 20a auRvea7sen | iooas6en | _oa0220035
00087-0697 BUR-P6099E" | 31. Augao07 | _o7eaoa00.
200273.£P-EPT suR-psioier | _201u12007 | o77e77o.8
801180-EP-EPT BUR-P6102EP 26 Mar 2009. 09726713.2
[Link]™ | nu-soger | “14 bsc2009 | 000020557
803515-89-EPA aun.pets0e> | 02 Nov 008 | 091747705
ne7ea-t0A auRreiic | ~12Mar2009 | 093052280
s05s16.1FPA eunrsia7er | 32.aug2000 | 093600985
05116. 7. FFT BuRPELA9EP | s0aug2007 | 078016060
06957-F.007 sune1236P | _ossuiaoaa | 37430026
o7104-.607 auTureizae> | ~10 an 012 | s27015709
07805 [Link] auRvew7e" | 27 am 201 | au741a75s
some? FPA BUR sia96P | a6 Dee2010 | 103064242
[Link] aukveia7=> | ~a0augaos | 293600265
809503-EP-EPT BUR-P6138EP_ 30 Apr 2012 127203586
208509-E77A BUR-eIa0E0 | “aD Nay 2011 | 533600017
300509-60.9 uRneiazeP 07 2014 | 513050713
309628 [Link] BUR-PGL45EP | O6May 201 | 133055947
00013-67698 aun-reisore | _1eqna0i1 | 113600282
200872.7-£PA BURPGISICP | O6Sep2051_ | _11290307.6
euouse-cP-i9T aunpeis2e [97 un7012 | 127379388
10560 -9.£PA BuRPeA6REP | atina0i2 | _a73057119
[Link] auRisseP [AL una012 | 12305666
s10886.6°-.P& aure169e> | 02 Auga0i2 | 573600512
suaLer-iPa un rerraee | ~36Mar2012 "| 573600183
B1u133.67-£08 BuRvei77e” | ain 2012 | 373051153
sciass-ererT suncpeizeen | as'sep 2012 | asromaras
a31669-0 EPA [Link] | asmar201a_|13305357.9
211959 9-677 ~jnuk-pe1s7ep | ~o8 waya013 | s37245815
[Link]-PA sunvpezanre | 27sep2012 | 173600702 |
212900-0.208 auperise | 05 nov2012 | 173063664
12610-1608 aurcpezzsep | on Marz013_| 133052025
[Link] sunveaa6eP | 26mar2019 | 13160098.
13873-0604 BuR#62308 | 20Mayaoi3 | _43305717.4
ELIOIO-EP-EPA BuRP62maEP | 25Sep2013 | _13306307.3
i730. Bu-6a37EP | 25 Mar 2015 | 35716260.3_
[Link] BUR-Ps228EF | 22012014 | _14851067.5
B1a372-0P EPA aunrézaoce | ~26Sep 2013 | 13306992
514a35-£P-EDA__suicPezaiee | s0.apra0ia | 1005522.6
su46i3-EPPA sur-pezeze> | og Mar 2010 | _14205306.4
sun pe2aaeP | 27sep 2613 [133083388
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Applicant Reference HePworth Browne ring Date | Application number
14933-€P-EPT BUR-P52a7EP 22 0c 2014 1a793717.4
| s15632-EP-£9T BUR-P6256EP 11 Aug 2015 15837354.2
815664-EP-EPA BUR-P6257EP 30Jan 2034 14305128.2
815695-EP-EPA BUR-P6258EP 30 Jan 2014 14305121.7
B17182-EP EPA BUR-PE272EP 24 Apr 2015; 15305631.2
817426-ED-EPA BUR-P5273EP 19 Dec 2014 103071025
81766-EP-EPA BUR-PE276EP 24 Apr 2015, 15305630.4
818246-EP-EPA BUR-P5278EP (04 Aug 2015 153062641
'819475-E9-EPA ‘BUR-P5279EP 13 Sep 2016 163061542
105618-EP-EPA, BUR-P6338EP | 12 Jul 2005 (05106371.7
106278-EP-EPA_______| BUR-P6339EP 23 Oct 2007 07119074.8
115229-EP-EPA, BUR-PG340EP 41 Jul 2007 (072908825
'801365-EP-EPA BUR-PE3E7EP. 28 Sep 2007 07291175.3
'805130-EP-EPA BUR-PSS75EP 12 Aug 2009 (09305751.3
805561:EP-EPA | BUR-P5378EP 05 Jan 2010 '10305007.6
| 806615-EP-EPA BUR-PE3B3EP 16 Aug 2010 110305893.9
807031-EP-£PA BUR-P6387EP 28 jun 2010 10305688.3
807967-EP-EPT UR-PE396EP 28 Jul 2011 14743908.1
808510-EP-EPT BUR-P6A00EP (09 Jul 2008 (047676515
808870-EP-EPT BUR-P6AO3EP 06 Sep 2011, 11755307 3
808917-EP-EPT BUR-PEADAEP 19 Nov 2012 12795692.8
811318-E0-EPT BUR-PEAIGEP 23 Sep 2013 13844321.3
811577-EP-EPA BUR-POAITEP 06 Jun 2012 12305638.4
811873-EP-EPA BUR-P64IBEP 40Sep2012__| _12290298.4
812158-EP-FPA BUR-PEA2IEP 30 Oct 2012 12306353.9
812467 EP-EPA BUR-P6425EP (03 Dec 2012 12306506.2
B13901-EP-EPA BUR-PBA27EP 24 May 2013 33305677.0
14544-EP-EPA BUR-PGA28EP 37 Jan 2014 14305063.2
'815429-EP-EPA BUR-PG433EP 30 Jan 2014 103051308
B16763-FP-EPA BUR-P6ASAEP 29 Jan 2015 15305102.6
B17272-EP- EPA __—_—_—(| BUR-P6436EP 30 Jan 2015 153051388
Annex Page &
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3:18. Page 7 of 16
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NOKIA
SUBDELEGATION DE POUVOIRS
SUBDELEGATION OF AUTHORITY
LaSoussignée,
|, the undersigned,
Emmanuelle WETZEL,
Agissant en qualité de Director Patents, Intellectual Property Business Group pour Alcatel
Lucent, Société par Actions Simplif
16 au capital de 176 984 245.95 EUR, dont le siége social
est situé 3 Boulogne-Billancourt 92100, 148/152 route de la Reine, immatriculée sous le
numéro 542 019 096 R.C.S. NANTERRE, |, décice de déléguer des pouvoirs 8:
Acting in my capacity as Director Patents, intellectual Property Business Group for Alcatel
Lucent, société par actions simplifiée (simplified form limited company) with a share capital
0f 176 984 245.95 EUR, Registered at 542 019 O96 RCS Nariterte with its registered office
in Boulogne-Bilancourt 92100, 148/152 route de la Reine, hereby grant authority to:
Karine BERTHIER
Responsable Brevets Sites FR
FR Sites Patenting Manager
Patent Business Organization
En cette quali
numérotation de la délégation générale, sous les conditions ci-aprés précisées:
Karine BERTHIER, in her capacity of FR Sites Patenting Manager, is granted the following
authority according to the general delegation numbering:
4 JURIDIQUE, CONTENTIEUX, ASSURANCE
LEGAL MATTERS, LITIGATION, INSURANCE
4.5. Protection, gestion, acqui
Protection, management. acquisition, transter of intellectual property rights
ion, disposition de droits de propriété intellactuelle
Karine BERTHIER disposera des pouvoirs suivants, conformément & fa
a) Faire toute demande de brevet, dépat de marque, de dessin et madéle, demande
d'enregistrement de nom de domaine et, généralement, effectuer toute démarche,
passer tout acte visant la protection de tout droit de propriété intellectuelle (brevet,
marque, dessin et modéle, droits de propriété inteliectuelle et artistique, fogiciel,
etch
Submit patent requests and register trademarks, designs anid models, requests For
domain names and in general take all measures, execute any instruments for the
purpose of protecting intellectual property rights (patents, trademarks, designs and
models, intellectual and artistic property rights, software etcl:
Received at the EPO on Jun 11, 2018 [Link]. Page 8 of 16
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NOKIA
bl Acquérir, transférer, concéder ou recevoir en licence ou sous-licence, radier et
généralement disposer de tout droit de propriété intellectuelle, notamment de tout
brevet, toute marque, tout dessin et modéle, tout droit de propriété littéraire et
artistique, tout logiciel, de toute licence des droits précités et de tout
enregistrement de nom de domaine ;
Acquire, transfer, grant or receive licenses or sub-licenses, cancel and, in general
make use of any intellectual property right, in particular any patent, trademark,
design or model, literary and artistic property right, software, any license of sald
rights and of any registration of domain name;
©) Agir pour le compte de la Société pour toute question ou procédure judiciaire ou
administrative relative aux droits de propriété intellectuelle et les transactions y
afférentes ;
Manage on behalf of the Company all legal, judicial and administrative matters and
proceedings relating to intellectual property rights and the settlements related
thereto;
d) Conclure tous accords relatifs aux droits des salariés en matiére de propriété
intellectuelte.
Enter into agreements releting to employees’ rights with respect to intellectual
property.
4.13 Eormalité[Link].
Formalities
Accomplir toute formalité exigée par les lois francaises et étrangéres applicables
alle Societe.
Compiete all formalities required by French and foreign laws that are applicable ta the
Company.
4.14 Administrations diverses {hors administration fiscale)
Adhninistrations lexcept taxation authorities)
Représenter la Société vis-a-vis de toute administration, de tout ministére, de tout
gouvernement, en dehors de l'administration fiscale, des douanes et des droits
indirects.
Represent the Company before third parties, ministries, gavernmments, cities,
municipalities, local communities, administrations, except taxation authorities;
customs and indirect right authorities.
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NOKIA
> Pouvoirs pouvant @tre exercés conformément & la régiementation des signatures du
Groupe Nokia telle que décrite dans les documents “Standard Operating Procedure
Policy on Signatory Rights” et “Limits of Authorization” ;
Authority that may be exercised strietly in accordance with the Nokia Group signature
policies as stated in the documents “Standard Operating Procedure Policy on Signatory
Rights” and “Limits of Authorization”;
% Pouvoirs pouvant étre exercés 4 lexclusion des marques, noms de domaines et droits
d'auteur et dans la limite de 50 million d'euros par opération :
Authority that may be exercised except for trademarks and domain names and copyrights
and within the limits of 50 milion euro per operation:
48a}
> Pouvoirs pouvant étre exercés a exclusion des marques, des noms de domaines, des
droits d'auteur et des accords de licences et dans la limite de 100 millian d'euros par
opération:
Authority that may be exercised except for trademarks and domain names and copyrights
and except for license agreements and within the limits of 100 million euro per operation:
45b)
> Pouvoirs pouvant étre exercés pour chacun des points 4 lexclusion des marques, des
noms de domaines et des droits d'auteur, et pour 1-1¢), 8 Vexclusion des accords de
licences:
Authority that may be exercised, each for except trademarks and domain names and
copyrights, and for 1.1 c} except for lense agreements.
4.5cl, 4.50)
Cette subdélégation & durée indéterminge prend effet compter de fa signature des
présentes et prendra fin de plein droit avec les fonctions du délégataire ou par révocation
expresse du délégant
This subdelegation is of indefinite duration and enters into effect as from the signing of the
present document. it shaif be automatically terminated in case of termination of the
delegate’s mandate or if expressly revoked by the delegator.
Fait a Stuttgart, le 13 mars 2017 Bon pour acceptation
Executed in Stuttgart, on March 13°, 2017 Delegation of authority accepted
Ce NeA
Emmanuelle WEYZEL Karine BERTHIER
Director Patents
Intellectual Property Business Group
Received at the EPO on Jun 11, 2018 [Link]. Page 10 of 16
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NCICIA
DELEGATION DE POUVORRS.
DELEGATION OF AUTHORITY
Je soussigr
{the undecsigned,
Thierry BOISNON,
agissent en quattt de Président dialcatel Lucent, Société par Achons Simplfige au capital de
176984 245.95 EUR, dant ie siége social est situé 8 Boulogne-fillancourt $2100, 148/182 route de
la Retve, immnetriculge sous le rumnéro 542 G19 096 RCS, NANTERRE, décite de deleguer des
pouvoirs 8:
acting in my capacity as President of Alcatel Lucent, société par actions sknpliiée bimpbfied form
dimited company) with 3 share capital of 176.984 245.95 EUR, Registered at 542 019 096 RCS
Nanterre with its registered office in Bouiogne-Bilencourt 92100, 4B/ISZ route de le Reine,
hereby grant authority t0:
Emmanuctle WETZEL
Dicector Patents
Intellectual Property Business Group
Eo cette qualité Emmanuel WETZEL disposers des pouvoirs suivents, conformément & ls
rummérotabion de la dékigation générale, ous les condtions c-aprés précisées
Emovanueke Wetzel in her capacity of is granted the folowing authority according to the general
selegation mumbenng™
4— —_jumipique, conTenTicux, assurance
LAGAL MATTERS, LITIGATION, MSURAKCE
45. Protection. gestion, acquisition, disposition de droits de propriété inteiecnuetic
Protection management. acquisition, treaster of mteliectual property rights
al Fare toute demande de brevet, dépét de marque, de dessin et modtle, demande
denregistrement de nom ce domaine et, généralement, effectuer toute démarche,
passer tout acte visant la protection de tout droit de propriété intellactuslie tbrevet,
mrarque, dessivet moddke, droits de propriéts intellectuctie at artistique, logiciel, ete)
Subenit patent eequests and register vademarks, designs and mmndels, requests far
coma names and in general take all measures, execute any instruments for the
pumpose of protecting intelectual property nights (patents, trademarks, designs ane!
modes, intelieetusl and artistic property rights, soRware ete)
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NICK LA
b) Acquitin, transférer, concéder ou recevoir en fence av sousclcence, radier et
ginéralemant dspooer de tout drait de propriété intelectuele, ratamment de tout
brevet, toute marque, tout dessin et maddie, tout droit de proprieté lttéraire et
artistique, tout iogicel, de toute cence des droits précités et de tout envegistrement de
rom de domeine ;
Acquire, ransler, grant cr receive icenses or sublicenses, cancel and, in general make
use of any imellectual property right, in particular any patent, tractemark, design ar
‘model, itecary and artistic property right, softsere, any fcense of sail rights and of any
registration of domain name;
‘ch Agir pour fe compte de le Sociét® pour toute question ou procédure juticiaire ou
administrative relative aux droits de propriété intetectuelle et les transactions y
aférentes;
Manage on behalf of the Company af lego, judicial and acirnistrative matters ant
proceedings relating to intellectual property nights and the settlements related thereto;
4} Concure tous accords relatifs aux droits des salarits en matiére de propriété
‘eteFectuelle,
fniter into agreements reketing to employees’ rights with respect to intellectuat
property.
493 formalitésstiversiy
Eonnalities
Accamplir toute formalité exigbe par les joisfrangaizes et étrangéres epplicables Ale Société,
Complete aff formatties required by French and foreign ews that are appscable to the
Canipany.
4.14 Administrations diverses thors adenist
Représenter fa Société vis-d-vis de toute administration, de tout minstere, de tout
‘gouvernement, endebors de Factministration Facal, des dousnes et des droits indrects
Represent the Company before third partes, ministries, governments, cies, municipalities,
‘ocal caumnunities, administrations, except taxation authorities, customs and indirect right
authorities
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INC EA
7 Acaas
Purcnases
72 Conteata cadres globawx achat de fourniuses, de_orestations oe seevices. de sous:
teaitance
Globe! aucchase framework agreements far supplies, services, sub-contracts
Negocer, signer, madifer, résiier tout conteat-cadee global achat de fournitures, de
prestations de services et de sous-tritance, accord pouvant déboucher a terme sur des
commands ou contrats particulers passés drectement por les filles du Groupe et régles
parelies.
Negotiate, sign, madity and terminate giobal purchase framework agreements for supplies,
services and subcontracting agreements, which can eventaly lesd to purchasing orders
rectly placed by the Group's subsidiaries and hanced by them.
73. Contrats cadre locaux d'achat de foumitwes, de pcestations de services, de sous-traitance
Lokal uchase framewarkagreements for supoliss, services, subcontracts
Négovier, signer, modifier, résilier tout contrat-cadre iecat achat de fournitures, de
prestations de services et de sous-traitance, accord pouvant déboncher & tence sur des
commande ov contrats particulters passés directement parla Societe et replés par efes.
Negotiate, sign, modify and terminate focal purchase framework agreements for supplies
and services, sub-contracting agreement
74 Costtrets elabaux d'achat de fournitures, de prestations de services, de sousctealtance
Glolsal pucchaseagreeménts for sunnles. services, sub-conirats
Négocler, signer, modifier, réstier tout contrat global Pachat de founitures, de prestations
de services et de sous-traitance, acrord pouvant déboucher & terme sur des eammandes ox
cantrats particuiers passés directement par les fitales ck: Groupe et réglés par eles
Negotiate, sign, madity and terminste giobal purchase framework agreements for supplies,
services and subcontracting agreements, which can eventuely lead fo purchasing orders
directly placed by the Group's subsictaries and handled by ther.
75 Contiats locauxd achat de Fournitures, de orestations de services. de sous-traitance
hecaleuichase agreements for simples, services, sub-contract
Négocier, signer, résiier tout contrat local d’ achat de fournitures, de prestations de services
et de sous-traitance.
Negotiate, sign, and terminate loca! purchase agreements for supplies and services, and
sub-contracting agreements.
78 Bons de cornenandes
[Link]
Fmeltre, sgner, modifier et sésilier tout bon de commande de fouritures, services ou de
s0us-traitance dans les limites des contvats auxquels il s’appliquert
‘sue, sign, modify and terminate purchase orders for any supplies or services. or
subcontracting agreements within the limits of the agreements
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NCHA
i ei past ae
Euctrer detail and constraints of this delegation:
* Pouvoies pouvant atre exercés confarmément 4 la réglementation des signatures dis
Groupe Nokia tele que décrite dons tes documents “Standard Operating Procedure Policy
fon Signatory Rights" et “Limits of Authorization’ ;
Authority that may be exercived strictly In accordeace with the Nokia Group signature
policies as stated in the documents “Standard Operating Procedure Policy on Sigaatory
Rights” and “Limits of Authorization’:
* Pouvoirs pouvant étre exercés a Yexclusion des marques, noms de domsines et droits d’auteur
let dans Ia limite de 50 milion d’euras par operation:
Authority that may be exercised except for trademarks and domain names and copyrights and
within the hans of 50 ailion euro per operation:
45al
4 Pouvoirs pouvant étre exercés 8 lexchision des marques, des noms de domaines, des deaits
auteur ot desaccords de icences ot dans a lite de 109 milion d'euros par opération
Authority that may be exercised except for trademarks ane! clomein names and copyrights and
except for tense agreements and within the linits of 100 milion eure per operation:
45b)
> Pouvairs pouvant étre exereés pour chacun des points & Fexclusion des marques, des noms de
domaine et des droits dauteur, et pour 110), al’exckision des accords de licences:
Authority thet may be exercised, each for except trademaris and domwin nemes ant
copyrights, and for 7,1except for heense agreenents
450,450)
= Pouvoirs pouvant étre exercés dans les limites prévues dans le délégation péntrale et dans la
limite de 590 000 euros par operation :
Authority that may be exercised within the linits previded in the general delegation ad wither
the nit of $00 000 eures per transaction:
12,73, 74,75,78
~~ Pouvoirs pouvent étre subdélégués, par écrit, 8 toute personne de son choix et dans les limites
quilfixera :
Authority that may be subdelegated, in writing, ta any person of his choice and within brits to
beset:
45 2) 24,5 b) et pour chacun de ces points & Vexckusion des marques, des ome de domaines,
des droits d'auteur et pour chacun dans les limites fixées ci-dessus et pour 4 Sb) et 45 cl 3
Fexdusion des accords de licences, 45d, 413, 4.24
45 a} and 4.5 6) each except traemarks and domain names and capyrights and each within
the monetary constraints set hereinabove, and for 4 bl anid 4.5 ¢) each except for kcenses
agreements, 45d) 4.13, 4.16
Received at the EPO on Jun 11, 2018 [Link], Page 14 of 16
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NDIKLA
La présente détégation annule et remplace 1a délégation émise en votre faveur en date du 21
jin 2016.
The present delegation cancels and replaces that granted to you on June 20, 2016
Cette délégation 4 durée indéterminge prend effet & compter de Is signature des présentes et
Prendra fin de plein drait avec les functions. du délégataire ou par révocation expresse du
dalegant.
This delegation is of definite duration and enters into effect as trom the signing of the present
eocument. it shall be automaticaly terminated m case of termination of the delegate's mandate or
‘itexpressly revoked by the delegate
Fait& Boulogne-Bilancourt le Ler mars 2017 Bon pour aeceptation
Executed in Boulogne: Bitencout, an March Ist, 2017 Delegation of autherily accepted
Thierry BOSNON
Prosident
Received at the EPO on Jun 11, 2018 [Link], Page 15 of 16
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NOKIA
DELEGATION DE SIGNATURE
DELEGATION OF SIGNATURE
Je soussigné,
1 the undersigned,
Thierry BOISNON,
agissant en qualité de Président c’Alcatel Lucent, Socité par Actions Simplfiée au capital de
176 984 245.95 EUR, dont le siége socal est situé A Boulogne Billancourt 92100, 148/152 route de
la Reine, immatriculée sous ie numéro 542 019.096 [Link]. NANTERRE,
acting in my capacity as President of Alcatel Lucent, société par actions simplifide (simplified
Form limited company) with a share capital of 176 984 245.95 EUR, Registered at 542 019 096
RES Nanterre with its registered office in Bowlogne-biltancourt 92100, 148/152 route de b Reine,
Constitue par la présente et nomme fes personnes ci-dessous & effet de contresigner au nom et
pour le compte d’Aleate! Lucent, tous les documents concernant le domaine des brevets au nom
de le société, en qualité de second signataire, pour répondre & la procédure de double-signature du
Groupe Nokia
Do hereby constitute and appaint the following persons as our repvesentatives to counter-sign for
and on behslf of Alcatel Lucent, any and all documents related to patents for the company as
second signatory, to meet the double-signatire Nokia Group process:
Domenico MENZIETT (Stuttgart) - Senior IP Corporate Counsel
Jérme MOUNEY (France) ~ Senior iP Counsel
Cette délégation de signature annule et remplace la précédente accordée fe 13 mats 2017 et entre
‘en vigueur & compter de la date mentionnée ci-dessous, La présente délégation est régie et
constituée conformément au droit frangals.
This Delegation of Signature cancels and supersedes the DOS granted on March 13%, 2017 and &
vol as of the date set out below. it shall be governed by and construed in accordance with the
laws of France,
Feit 3 Boubogne-Bilancourt le er jullet 2017
Executed in Bouiogne-Bilancourt, on July 18t, 2017
va
1
Président
Received at the EPO on Jun 11, 2018 [Link], Page 16 of 16
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pase ‘50288 MUNICH
tarpon, GERMANY
‘Questions about this communication ?
Contact Customer Services at www. po orgloontact
‘Shamsaei Far, Hassan
Atcatel-Lucent International
Patent Business.
Site Nokia Paris Saclay
Route de Villejust
91620 Nozay
FRANCE
Dae
20.03.18,
Praca Toplsaion No Patent
817163/HAS/TPM. 44306808 8 - 1211 / 3021354
SRT ORT
Atcatel Lucent
Communication
concerning the registration of amendments relating to
1 atransfer (R. 22 and 85 EPC)
MZ entries pertaining to the applicant / the proprietor (R. 143(1)(0) EPC)
‘As requested, the entries pertaining to the applicant of the above-mentioned European patent application
to the proprietor of the above-mentioned European patent have been amended to the following
AL AT BE BG CH CY OZ DE DK EE ES FI FR GB GR HR HU IE IS IT LILTLU
LV MC MK MT NLNO PL PT RO RS SE SI SK SM TR
Alcatel Lucent
Site Nokia Paris Saclay
Route de Villejust
91620 Nozay/FR
The registration of the changes has taken effect on 13.03.18,
In the case of a published application / a patent, the change will be recorded in the Register of European
Patents and published in the European Patent Bulletin (Section 1.12 /l.12)
Your attention is drawn to the fact that, in the case of the registration of a transfer, any automatic debit
order only ceases to be effective from the date of its express revocation (cf. point 14(c) of the
Arrangements for the automatic debiting procedure, supplementary publication 3 - OJ EPO 2018).
Receiving Section / For the Examining Division / For the Opposition Division / For the Legal Division *)
3 Pate,
ech Pitentan,
&
$ ¢,
aes ~
oie aay"
+) See note
PO Fom25448 0718 (1800/8) page t of2 EB21171ae Application No, 14306808.8
Note
This communication is issued by/for the department with whom responsibility lies, The Legal Division is
responsible for the registration of transfers, changes of name (Articles 71, 72 and 74 EPC and Rules 22
and 85 EPC) as well as for the rectification of the designation of the inventor (Rule 21 EPO) (see Decision
of the President of the EPO, OJ EPO 2013, 600). In all other cases, the Receiving Section, the Examining
Division or the Opposition Division is responsible, depending on the stage in proceedings.
PO Fom25448 0718 (1800/8) page of213.03.18 16:04 Nokia 00496966814851000 © 1/ 11
Lydia CHANTON-MANDON
aad of Patent Admin Prosecution (FEFRIGB)
avert Business Group - NOKIA
‘So Nin re Sony, a a Vs. 1629 NERA, FR
ass (ant a
‘sdacnaceremccrnaietiacsce
‘Faso nega andl achrars Yarelad wih far coir ary cotsin cay pvlooed and conic terion
yasaroentenrtoneadtosperke Piresnag peas donc tor Sas ferro jee yas erase) fo san y ely oe dee mneage any
eae.
Received at the EPO on Mar 13, 2018 [Link]. Page 1 of 11
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NOKIA No
a Technologies
EUROPEAN PATENT OFFICE
Client Data Registration
D- 80298 MUNICH
GERMANY
BY FACSIMILE
00 49 89 2399 4465 ‘To the attention to Mr. Eric Bihl
Nozay, Tuesday, 13 March 2018
O/Ref.: CHANGE OF ADDRESS OF ALCATEL LUCENT
Dear Sir,
Please be informed that the applicant ALCATEL LUCENT changed its address since
September 2017.
New address
Alcatel Lucent
Site Nokia Paris Saclay
Route de Villejust
91620 NOZAY- France
Please record the new address for all patent applications / patents where Alcatel Lucent is.
the applicant.
We also include, for your information, the Subdelegation of Authority granted by Mrs Emmanuelle
Wetzel to Karine Berthier and the Delegation of Authority granted by Mr. Thierry Boisnon, President
Of Alcatel Lucent, to Mrs. Emmanuelle Wetzel as well as a Delegation of Signature granted by Mr.
Thierry Boisnon to Mr. Jérome Mouney.
Very truly yours,
Karine BERTHIER Jéréme MOUNEY
Tel +33 (OMI 7323 4276
E-mail is@[Link]
ALCATEL-LUCENT INTERNATIONAL
Site Nokia Paris Saclay, Route de Villejust
91620 NOZAY - FRANCE
Received at the EPO on Mar 13, 2018 [Link]. Page 2 of 11
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NCICIA
DELEGATION DE POUVORRS.
DELEGATION OF AUTHORITY
Je soussigr
{the undecsigned,
Thierry BOISNON,
agissent en quattt de Président dialcatel Lucent, Société par Achons Simplfige au capital de
176984 245.95 EUR, dant ie siége social est situé 8 Boulogne-fillancourt $2100, 148/182 route de
la Retve, immnetriculge sous le rumnéro 542 G19 096 RCS, NANTERRE, décite de deleguer des
pouvoirs 8:
acting in my capacity as President of Alcatel Lucent, société par actions sknpliiée bimpbfied form
dimited company) with 3 share capital of 176.984 245.95 EUR, Registered at 542 019 096 RCS
Nanterre with its registered office in Bouiogne-Bilencourt 92100, 4B/ISZ route de le Reine,
hereby grant authority t0:
Emmanuctle WETZEL
Dicector Patents
Intellectual Property Business Group
Eo cette qualité Emmanuel WETZEL disposers des pouvoirs suivents, conformément & ls
rummérotabion de la dékigation générale, ous les condtions c-aprés précisées
Emovanueke Wetzel in her capacity of is granted the folowing authority according to the general
selegation mumbenng™
4— —_jumipique, conTenTicux, assurance
LAGAL MATTERS, LITIGATION, MSURAKCE
45. Protection. gestion, acquisition, disposition de droits de propriété inteiecnuetic
Protection management. acquisition, treaster of mteliectual property rights
al Fare toute demande de brevet, dépét de marque, de dessin et modtle, demande
denregistrement de nom ce domaine et, généralement, effectuer toute démarche,
passer tout acte visant la protection de tout droit de propriété intellactuslie tbrevet,
mrarque, dessivet moddke, droits de propriéts intellectuctie at artistique, logiciel, ete)
Subenit patent eequests and register vademarks, designs and mmndels, requests far
coma names and in general take all measures, execute any instruments for the
pumpose of protecting intelectual property nights (patents, trademarks, designs ane!
modes, intelieetusl and artistic property rights, soRware ete)
Received at the EPO on Mar 13, 2018 [Link]. Page 3 of 11
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NICK LA
b) Acquitin, transférer, concéder ou recevoir en fence av sousclcence, radier et
ginéralemant dspooer de tout drait de propriété intelectuele, ratamment de tout
brevet, toute marque, tout dessin et maddie, tout droit de proprieté lttéraire et
artistique, tout iogicel, de toute cence des droits précités et de tout envegistrement de
rom de domeine ;
Acquire, ransler, grant cr receive icenses or sublicenses, cancel and, in general make
use of any imellectual property right, in particular any patent, tractemark, design ar
‘model, itecary and artistic property right, softsere, any fcense of sail rights and of any
registration of domain name;
‘ch Agir pour fe compte de le Sociét® pour toute question ou procédure juticiaire ou
administrative relative aux droits de propriété intetectuelle et les transactions y
aférentes;
Manage on behalf of the Company af lego, judicial and acirnistrative matters ant
proceedings relating to intellectual property nights and the settlements related thereto;
4} Concure tous accords relatifs aux droits des salarits en matiére de propriété
‘eteFectuelle,
fniter into agreements reketing to employees’ rights with respect to intellectuat
property.
493 formalitésstiversiy
Eonnalities
Accamplir toute formalité exigbe par les joisfrangaizes et étrangéres epplicables Ale Société,
Complete aff formatties required by French and foreign ews that are appscable to the
Canipany.
4.14 Administrations diverses thors adenist
Représenter fa Société vis-d-vis de toute administration, de tout minstere, de tout
‘gouvernement, endebors de Factministration Facal, des dousnes et des droits indrects
Represent the Company before third partes, ministries, governments, cies, municipalities,
‘ocal caumnunities, administrations, except taxation authorities, customs and indirect right
authorities
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INC EA
7 Acaas
Purcnases
72 Conteata cadres globawx achat de fourniuses, de_orestations oe seevices. de sous:
teaitance
Globe! aucchase framework agreements far supplies, services, sub-contracts
Negocer, signer, madifer, résiier tout conteat-cadee global achat de fournitures, de
prestations de services et de sous-tritance, accord pouvant déboucher a terme sur des
commands ou contrats particulers passés drectement por les filles du Groupe et régles
parelies.
Negotiate, sign, madity and terminate giobal purchase framework agreements for supplies,
services and subcontracting agreements, which can eventaly lesd to purchasing orders
rectly placed by the Group's subsidiaries and hanced by them.
73. Contrats cadre locaux d'achat de foumitwes, de pcestations de services, de sous-traitance
Lokal uchase framewarkagreements for supoliss, services, subcontracts
Négovier, signer, modifier, résilier tout contrat-cadre iecat achat de fournitures, de
prestations de services et de sous-traitance, accord pouvant déboncher & tence sur des
commande ov contrats particulters passés directement parla Societe et replés par efes.
Negotiate, sign, modify and terminate focal purchase framework agreements for supplies
and services, sub-contracting agreement
74 Costtrets elabaux d'achat de fournitures, de prestations de services, de sousctealtance
Glolsal pucchaseagreeménts for sunnles. services, sub-conirats
Négocler, signer, modifier, réstier tout contrat global Pachat de founitures, de prestations
de services et de sous-traitance, acrord pouvant déboucher & terme sur des eammandes ox
cantrats particuiers passés directement par les fitales ck: Groupe et réglés par eles
Negotiate, sign, madity and terminste giobal purchase framework agreements for supplies,
services and subcontracting agreements, which can eventuely lead fo purchasing orders
directly placed by the Group's subsictaries and handled by ther.
75 Contiats locauxd achat de Fournitures, de orestations de services. de sous-traitance
hecaleuichase agreements for simples, services, sub-contract
Négocier, signer, résiier tout contrat local d’ achat de fournitures, de prestations de services
et de sous-traitance.
Negotiate, sign, and terminate loca! purchase agreements for supplies and services, and
sub-contracting agreements.
78 Bons de cornenandes
[Link]
Fmeltre, sgner, modifier et sésilier tout bon de commande de fouritures, services ou de
s0us-traitance dans les limites des contvats auxquels il s’appliquert
‘sue, sign, modify and terminate purchase orders for any supplies or services. or
subcontracting agreements within the limits of the agreements
Received at the EPO on Mar 13, 2018 [Link]. Page 5 of 11
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NCHA
i ei past ae
Euctrer detail and constraints of this delegation:
* Pouvoies pouvant atre exercés confarmément 4 la réglementation des signatures dis
Groupe Nokia tele que décrite dons tes documents “Standard Operating Procedure Policy
fon Signatory Rights" et “Limits of Authorization’ ;
Authority that may be exercived strictly In accordeace with the Nokia Group signature
policies as stated in the documents “Standard Operating Procedure Policy on Sigaatory
Rights” and “Limits of Authorization’:
* Pouvoirs pouvant étre exercés a Yexclusion des marques, noms de domsines et droits d’auteur
let dans Ia limite de 50 milion d’euras par operation:
Authority that may be exercised except for trademarks and domain names and copyrights and
within the hans of 50 ailion euro per operation:
45al
4 Pouvoirs pouvant étre exercés 8 lexchision des marques, des noms de domaines, des deaits
auteur ot desaccords de icences ot dans a lite de 109 milion d'euros par opération
Authority that may be exercised except for trademarks ane! clomein names and copyrights and
except for tense agreements and within the linits of 100 milion eure per operation:
45b)
> Pouvairs pouvant étre exereés pour chacun des points & Fexclusion des marques, des noms de
domaine et des droits dauteur, et pour 110), al’exckision des accords de licences:
Authority thet may be exercised, each for except trademaris and domwin nemes ant
copyrights, and for 7,1except for heense agreenents
450,450)
= Pouvoirs pouvant étre exercés dans les limites prévues dans le délégation péntrale et dans la
limite de 590 000 euros par operation :
Authority that may be exercised within the linits previded in the general delegation ad wither
the nit of $00 000 eures per transaction:
12,73, 74,75,78
~~ Pouvoirs pouvent étre subdélégués, par écrit, 8 toute personne de son choix et dans les limites
quilfixera :
Authority that may be subdelegated, in writing, ta any person of his choice and within brits to
beset:
45 2) 24,5 b) et pour chacun de ces points & Vexckusion des marques, des ome de domaines,
des droits d'auteur et pour chacun dans les limites fixées ci-dessus et pour 4 Sb) et 45 cl 3
Fexdusion des accords de licences, 45d, 413, 4.24
45 a} and 4.5 6) each except traemarks and domain names and capyrights and each within
the monetary constraints set hereinabove, and for 4 bl anid 4.5 ¢) each except for kcenses
agreements, 45d) 4.13, 4.16
Received at the EPO on Mar 13, 2018 [Link]. Page 6 of 11
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NDIKLA
La présente détégation annule et remplace 1a délégation émise en votre faveur en date du 21
jin 2016.
The present delegation cancels and replaces that granted to you on June 20, 2016
Cette délégation 4 durée indéterminge prend effet & compter de Is signature des présentes et
Prendra fin de plein drait avec les functions. du délégataire ou par révocation expresse du
dalegant.
This delegation is of definite duration and enters into effect as trom the signing of the present
eocument. it shall be automaticaly terminated m case of termination of the delegate's mandate or
‘itexpressly revoked by the delegate
Fait& Boulogne-Bilancourt le Ler mars 2017 Bon pour aeceptation
Executed in Boulogne: Bitencout, an March Ist, 2017 Delegation of autherily accepted
Thierry BOSNON
Prosident
Received at the EPO on Mar 13, 2018 [Link]. Page 7 of 11
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NOKIA
SUBDELEGATION DE POUVOIRS
SUBDELEGATION OF AUTHORITY
LaSoussignée,
|, the undersigned,
Emmanuelle WETZEL,
Agissant en qualité de Director Patents, Intellectual Property Business Group pour Alcatel
Lucent, Société par Actions Simplif
16 au capital de 176 984 245.95 EUR, dont le siége social
est situé 3 Boulogne-Billancourt 92100, 148/152 route de la Reine, immatriculée sous le
numéro 542 019 096 R.C.S. NANTERRE, |, décice de déléguer des pouvoirs 8:
Acting in my capacity as Director Patents, intellectual Property Business Group for Alcatel
Lucent, société par actions simplifiée (simplified form limited company) with a share capital
0f 176 984 245.95 EUR, Registered at 542 019 O96 RCS Nariterte with its registered office
in Boulogne-Bilancourt 92100, 148/152 route de la Reine, hereby grant authority to:
Karine BERTHIER
Responsable Brevets Sites FR
FR Sites Patenting Manager
Patent Business Organization
En cette quali
numérotation de la délégation générale, sous les conditions ci-aprés précisées:
Karine BERTHIER, in her capacity of FR Sites Patenting Manager, is granted the following
authority according to the general delegation numbering:
4 JURIDIQUE, CONTENTIEUX, ASSURANCE
LEGAL MATTERS, LITIGATION, INSURANCE
4.5. Protection, gestion, acqui
Protection, management. acquisition, transter of intellectual property rights
ion, disposition de droits de propriété intellactuelle
Karine BERTHIER disposera des pouvoirs suivants, conformément & fa
a) Faire toute demande de brevet, dépat de marque, de dessin et madéle, demande
d'enregistrement de nom de domaine et, généralement, effectuer toute démarche,
passer tout acte visant la protection de tout droit de propriété intellectuelle (brevet,
marque, dessin et modéle, droits de propriété inteliectuelle et artistique, fogiciel,
etch
Submit patent requests and register trademarks, designs anid models, requests For
domain names and in general take all measures, execute any instruments for the
purpose of protecting intellectual property rights (patents, trademarks, designs and
models, intellectual and artistic property rights, software etcl:
Received at the EPO on Mar 13, 2018 [Link]. Page 8 of 11
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NOKIA
bl Acquérir, transférer, concéder ou recevoir en licence ou sous-licence, radier et
généralement disposer de tout droit de propriété intellectuelle, notamment de tout
brevet, toute marque, tout dessin et modéle, tout droit de propriété littéraire et
artistique, tout logiciel, de toute licence des droits précités et de tout
enregistrement de nom de domaine ;
Acquire, transfer, grant or receive licenses or sub-licenses, cancel and, in general
make use of any intellectual property right, in particular any patent, trademark,
design or model, literary and artistic property right, software, any license of sald
rights and of any registration of domain name;
©) Agir pour le compte de la Société pour toute question ou procédure judiciaire ou
administrative relative aux droits de propriété intellectuelle et les transactions y
afférentes ;
Manage on behalf of the Company all legal, judicial and administrative matters and
proceedings relating to intellectual property rights and the settlements related
thereto;
d) Conclure tous accords relatifs aux droits des salariés en matiére de propriété
intellectuelte.
Enter into agreements releting to employees’ rights with respect to intellectual
property.
4.13 Eormalité[Link].
Formalities
Accomplir toute formalité exigée par les lois francaises et étrangéres applicables
alle Societe.
Compiete all formalities required by French and foreign laws that are applicable ta the
Company.
4.14 Administrations diverses {hors administration fiscale)
Adhninistrations lexcept taxation authorities)
Représenter la Société vis-a-vis de toute administration, de tout ministére, de tout
gouvernement, en dehors de l'administration fiscale, des douanes et des droits
indirects.
Represent the Company before third parties, ministries, gavernmments, cities,
municipalities, local communities, administrations, except taxation authorities;
customs and indirect right authorities.
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NOKIA
> Pouvoirs pouvant @tre exercés conformément & la régiementation des signatures du
Groupe Nokia telle que décrite dans les documents “Standard Operating Procedure
Policy on Signatory Rights” et “Limits of Authorization” ;
Authority that may be exercised strietly in accordance with the Nokia Group signature
policies as stated in the documents “Standard Operating Procedure Policy on Signatory
Rights” and “Limits of Authorization”;
% Pouvoirs pouvant étre exercés 4 lexclusion des marques, noms de domaines et droits
d'auteur et dans la limite de 50 million d'euros par opération :
Authority that may be exercised except for trademarks and domain names and copyrights
and within the limits of 50 milion euro per operation:
48a}
> Pouvoirs pouvant étre exercés a exclusion des marques, des noms de domaines, des
droits d'auteur et des accords de licences et dans la limite de 100 millian d'euros par
opération:
Authority that may be exercised except for trademarks and domain names and copyrights
and except for license agreements and within the limits of 100 million euro per operation:
45b)
> Pouvoirs pouvant étre exercés pour chacun des points 4 lexclusion des marques, des
noms de domaines et des droits d'auteur, et pour 1-1¢), 8 Vexclusion des accords de
licences:
Authority that may be exercised, each for except trademarks and domain names and
copyrights, and for 1.1 c} except for lense agreements.
4.5cl, 4.50)
Cette subdélégation & durée indéterminge prend effet compter de fa signature des
présentes et prendra fin de plein droit avec les fonctions du délégataire ou par révocation
expresse du délégant
This subdelegation is of indefinite duration and enters into effect as from the signing of the
present document. it shaif be automatically terminated in case of termination of the
delegate’s mandate or if expressly revoked by the delegator.
Fait a Stuttgart, le 13 mars 2017 Bon pour acceptation
Executed in Stuttgart, on March 13°, 2017 Delegation of authority accepted
Ce NeA
Emmanuelle WEYZEL Karine BERTHIER
Director Patents
Intellectual Property Business Group
Received at the EPO on Mar 13, 2018 [Link], Page 10 of 11
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NOKIA
DELEGATION DE SIGNATURE
DELEGATION OF SIGNATURE
Je soussigné,
1 the undersigned,
Thierry BOISNON,
agissant en qualité de Président c’Alcatel Lucent, Socité par Actions Simplfiée au capital de
176 984 245.95 EUR, dont le siége socal est situé A Boulogne Billancourt 92100, 148/152 route de
la Reine, immatriculée sous ie numéro 542 019.096 [Link]. NANTERRE,
acting in my capacity as President of Alcatel Lucent, société par actions simplifide (simplified
Form limited company) with a share capital of 176 984 245.95 EUR, Registered at 542 019 096
RES Nanterre with its registered office in Bowlogne-biltancourt 92100, 148/152 route de b Reine,
Constitue par la présente et nomme fes personnes ci-dessous & effet de contresigner au nom et
pour le compte d’Aleate! Lucent, tous les documents concernant le domaine des brevets au nom
de le société, en qualité de second signataire, pour répondre & la procédure de double-signature du
Groupe Nokia
Do hereby constitute and appaint the following persons as our repvesentatives to counter-sign for
and on behslf of Alcatel Lucent, any and all documents related to patents for the company as
second signatory, to meet the double-signatire Nokia Group process:
Domenico MENZIETT (Stuttgart) - Senior IP Corporate Counsel
Jérme MOUNEY (France) ~ Senior iP Counsel
Cette délégation de signature annule et remplace la précédente accordée fe 13 mats 2017 et entre
‘en vigueur & compter de la date mentionnée ci-dessous, La présente délégation est régie et
constituée conformément au droit frangals.
This Delegation of Signature cancels and supersedes the DOS granted on March 13%, 2017 and &
vol as of the date set out below. it shall be governed by and construed in accordance with the
laws of France,
Feit 3 Boubogne-Bilancourt le er jullet 2017
Executed in Bouiogne-Bilancourt, on July 18t, 2017
va
1
Président
Received at the EPO on Mar 13, 2018 [Link]. Page 11 of 11
Duration: 03.13.2018 [Link] PM - 03.13.2018 [Link] PM. This page 11 of 11 was completed at 03.13.2018 04.10.16 PMTeme European Patent Offce
pase ‘50288 MUNICH
tarpon, GERMANY
‘Questions about this communication ?
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BROWNE, Robin
15 St. Pauls Street
Leeds LS1 2)G
UNITED KINGDOM
Dae
28-02-2018
Praca Toplsaion No Patent
rfb/bur-P5893EP 14306808 8 - 1211 / 3021354
aT aT
ALCATEL LUCENT
Invitation to file an authorisation (R. 152(2) EPC)
Concerning the above-mentioned European patent application / patent you have notified your
appointment as the representative of the
[BX applicant / proprietor of the patent
opponent
Since the applicant / proprietor of the patent / opponent is already represented by an authorised
representative and since the EPO has not been notified of the termination of the authorisation of this
representative, an authorisation in your favour or a reference to a registered general authorisation must be
filed (R. 152(1) EPC in conjunction with Art. 1(2) of the Decision of the President of the EPO dated 12 July
2007 concerning the filing of authorisations, Special edition No. 3, OJ EPO 2007, L.1).
You are requested to file the authorisation referred to above within a period of two months from
notification of this communication (R. 162(2) EPC).
If the authorisation is not filed in due time, any procedural steps taken by you shall, without prejudice to
any other legal consequences provided for in the EPC, be deemed not to have been taken (R. 152(6)
EPO).
Important note
Please note that authorisations may not be filed by facsimile (Decision of the President of the EPO
dated 12 July 2007, Special edition No. 3, OJ EPO 2007, A.3) or by using the EPO web-form filing
service (Decision of the President of the EPO dated 10 September 2014, OJ EPO 2014, A.98)
For the Examining Division
ant? Plenty
= 6
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, s
"Fong aoyyO"
Registered letter
Eohtemden sei arnans pase tots \voa72017/01 2018 wep 16:36 PAX 0113 2438628 Hepworth Browne “+ epo munich oor/oor
Hepworth Browne
EUROPEAN PATENT & TRADE MARK ATTORNEYS
35 st Pauls Streot
leeds
st
Te: +44 (0)113:236.4680
European Patent Office +4 (}845 270 4900
80298 Munich Fax: +48 (0)845 270 2060
Geman Email: mall @[Link]
wn [Link]
By fax and post
17 January 2018
Our ref REB/BUR-P5893EP-
‘Dear Sirs
Re: European Patent Application No, 14306808.8-1555
In the name of Aleatel Lucent
We are instructed to take over representation for this case, I would be grateful if you could
amend your records and send future correspondence to this address.
Please ensure that any fees which are refunded are paid into our account,
‘The previous representatives have been notified.
‘Yours faithfully
Robin Browne
Hepworth Browne
Cc Hassan Shamsaei Far — Alcatel-Lucent International
‘ces in: Leads, Stratford-opon-Avon, eden Beldge ath
‘ears zeta corey
‘agulated by he Inalictual
Received at the EPO on Jan 17, 2018 [Link]. Page 1 of 1
Duration: 01.17.2018 05:34 10 PM- 01.17.2018 05.34.38 PM. This page 1 of 1 was completedat01.17.2018 053438 PMAcknowledgement of receipt
We hereby acknowledge receipt ofthe following subsequently filed document(s)
‘Submission number 5826167
Application number EP14306808.8
Date of receipt 28 November 2017
Receiving Office European Patent Office, The Hague
Your reference BUR-P5893EP
Applicant All applicants as on file
Documents submitted [Link] ep-sfd-request xml
[Link] (1 p.)
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receipt generated
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European Patent Otfice/
Acknowledgement of receipt - application number EP14306808.8 Page 1 of 1Otte européen
Representative:
Dr Robin Forsythe BROWNE
Hepworth Browne
15 St Pauls Street
Leeds Yorkshire LS1 2G
United Kingdom,
Phone: +44 113 236 4630
E-mail: re@[Link]
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0) Patent ottice Letter accompanying subsequently filed items.
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sents pertaining othe following application
143088088
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Foes Factor applied | Fee-schedule | Amount to be paid
751 | 034 Renewal ee forthe ath year 1 585.00 585.00
Totat EUR| 586.00
Payment
7 [Made of payment Debit fom deposit account
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indicated on the foes page.
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Signatures
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BUR-P5893EP26.09.17 10:48 Nokia 00496966814851000 1/ 1
NOKIA
EUROPEAN PATENT OFFICE
Client Data Registration
D- 80298 MUNICH
GERMANY
BY FACSIMILE
00 49 89 2309 4465 ‘othe attention to Mr. Eric Bihl
Nozay, Tuesday, 26 September 2017
VERY PORTANT
(O/Ref.: CHANGE OF ADDRESS OF ALCATEL-LUCENT INTERNATIONAL
Dear Sirs,
Please be informed that the representative ALCATEL-LUCENT INTERNATIONAL ~ Power 127 has
changed its address since September 18, 2017.
New address:
Alcatel-Lucent International
Patent Business
Site Nokia Paris Saclay
Route de Villejust
91620 NOZAY- FRANCE
Please record the new address for all patent applications / patents where Alcatel-Lucent
International is the representative.
Very truly yours,
Karine BERTHIER
Tel +33 (OM 73234276
E-mail: [Link]@[Link]
ALCATEL-LUCENT INTERNATIONAL
Site Nokia Paris Saclay, Route de Villejust
91620 NOZAY ~ FRANCE
Duration: 26:08 2017 [Link] - 26.00.2017 10-4817. Tris page 1 of 1 was completed at 26.00.2017 104817
Received at the EPO on Sep 26, 2017 [Link]. Page 1 of 1Acknowledgement of receipt
We hereby acknowledge receipt ofthe following subsequently filed document(s)
‘Submission number 4808428
Application number EP14306808.8
Date of receipt 17 November 2016
Receiving Office European Patent Office, The Hague
Your reference 817163EP/HASISP
Applicant All applicants as on file
Documents submitted package-data xml ep-sfd-request xml
[Link] (1 p.) EPLETT-1.pa817163_70a1_Reply.pd
t(4p.)
Submitted by CN=Solange Piekny 25925
Method of submission Online
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receipt generated
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Correction by the EPO of errors in debit instructions filed by eOLF
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(OJ EPO 1984, 301 and point 6.3 ff ADA, Supplement to OJ EPO 10/2007).
JEuropean Patent Office!
Acknowledgement of receipt - application number EP14306808.8 Page 1 of 1DP) he.
Representative:
Hassan SHAMSAE! FAR
Alcatel-Lucent International
148/152 Route de la Reine
92100 BOULOGNE BILLANCOURT
France
Phone: 0155141104
Fax: 0155141495
E-mail: [Link]@[Link]
‘The document(s) listed below is (are) subsequenty fled
‘Application number
‘Applicants or representative's reference
Letter accompanying subsequently filed items
80298 Munich
Germany
Tol. +49(0)89 2398-0 | Fax 4465
P.0. Box 5818
£2280 HV Rijs
Netherlands
Tol. #31(0)70 340.2040 | Fax -2018,
10958 Bertin
Germany
Tol. +49(0)30 25901-0 | Fax 840
sents pertaining othe following application
143088088
BI7183EPIHASISP
Description of document
(Original fe name
‘Assigned fle name
1 [Letter relating othe search and
‘examination procedure
17 163_T0a1_Reply pat
EPLETT-1 pa
Payment
7 [Mode of payment
‘Raters dob order
Gurrenoy
“The European Patent Office is hereby authorised, under the
‘Arrangements forthe automatic debting procedure, o debt
{rom the deposit account any foes and costs faling due.
Deposit account number:
‘Account holier
EUR
‘8040038
‘Alcatel-Lucent international
2__[Refund’Reimburserment
Reimbursement if any) be made to EPO deposit account
28040088
‘Account holder: | Alcatel-Lucent International
Signatures
Pace: BOULOGNE-BILLANCOURT
Date 7 Novernbor 2016
Signed by: ‘Massen SHAMSAE FAR
Representative name:
Capacity (Representative)
817 163EP/HAS/SP
Hassan SHAMSAEI FAREUROPEAN PATENT OFFICE
D- 80298 MUNICH
GERMANY
Boulogne-Billancourt, Thursday, 17 November 2016
O/Ref.: 817163 EP ~HAS/SP
Response To EPO Communication Pursuant To Rule 70a(1) EPC
European Patent Application No. 14306808.8 filed on 14/11/2014
Applicant: ALCATEL LUCENT
Dear Sirs:
In response to the European search opinion issued in relation to the above-identified European
patent application, the following remarks are submitted:
ALLOWABLE CLAIMS,
Applicant thanks the search Examiner for considering claims 11 and 12 as meeting the requirements
of the EPC. However, we believe that claim 1 of the present application is also patentable at least for
the reasons giver in the next sections.
NITY OF INVENTION
The search Examiner considers that the application lacks unity because claim 1 which recites the
common concept of the claims is not new. We respectfully disagree. As discussed in the
“Novelty/Inventive Step” section below we believe that claim 1 is new in view of the cited prior art.
For this reason, unity is believed to exist in the present application.
7 + Alcatel-Lucent @
[ALCATEL-LUCENT INTERNATIONAL
148/152 route de la Reine 1: +33 yt 5514 1010
92300 BOULOGNE-BILLANCOURT - FRANCE F033 (0) 5514 1495The search Examiner has mentioned in item 1.4 of the communication that “all additional search fees
have been paid." This seems to be a mistake, as we wrote the EPO on 6 May, 2015 that the applicant
did not wish to pay additional search fee. As we believe that unity does existin the application, we stil
consider that an additional search fee does not need to be paid.
NOVELTY / INVENTIVE STEP
The search Examiner has relied on D1 to allege that claim 1 lacks novelty. We however respectfully
disagree atleast for the reasons given below.
Claim 1 of the present application recites:
“L..] wherein the first heat source Is configured to heat the fluid in the first chamber to
and to make thermal contact with a second heat source to absorb heat from the second heat
source.”
D1 at least does not disclose at least the underlined part of this feature. Indeed, when the first heat
source in D1 (element 8) is heated, valves 7 and 11 are (preferably) closed (see page 6 line 24 to page
7 line1). Closing valves 7 and 11 would clearly block any flow of the fluid through the channel 23 (or
22). Therefore, heating the fluid in the first chamber in D1, does not cause the fluid to flow through
he channel, from the fi th r.
Regarding the use of the term “preferably” in the above passage of D1, we believe that this term
should not be construed as suggesting an option in D1 because a skilled person would clearly
consider that, in operation, the system disclosed in D1 would necessarily need valves 7 and 11 to be
closed in order to effectively cause diaphragm 4 to expand to position 4’ as shown in figure 1 of D1
Atleast for the above reasons, itis believed that claim 1 of the present application is new in view of.
D1
Although D4 has not been relied upon by the search Examiner for the assessment of novelty of claim
‘1, we nonetheless for the sake of completeness, also submit that claim 1 is new in view of Dé as least
for the reasons given below.
In the assessment of novelty of claim 10, the search Examiner has referred to figure 4-6 f D4. As
claim 10 depends from claim 1, we hereby refer to claim 1 to show the differences between this claim
‘and D4 (using the elements as assessed by the search Examiner in item 4.1 of the communication).
A.Claim 1 of the present application recites:
iad to make thermal contact with a second heat source heat from the second heat
source.
Dé does not disclose at least the underlined part of the above feature. Indeed, when the first heat
source 228 in D1 is heated (Figure 68), the second heat source 248 is cooled by the controller 280
‘and the thin film 224 is expanded to close the inflow passage 202 (see paragraph 59 of D4).
Therefore, 1)- heating the fluid in the first chamber does not cause the fluid to flow from the first
chamber to the second chamber because the inflow passage 202 is blocked by the thin film 224 and
2) any thermal contact between the fluid and the second heat source 248 (which in fact Is not
disclosed as such in D4) would not result in absorbing heat from the second heat source because the
second heat source is cooled at this time while the fluid is heated.
At least for the above reasons, It Is believed that claim 1 of the present application is new in view of
D4,
Claim 1 is also inventive at least because the combination of features of this claim are not found in
the cited prior art documents taken either alone or in combination (for example, please refer to the
Underlined parts of claim 1 as recited above).
Inview of the above itis believed that claim 1 in patentable.
Dependent claims are also believed to be patentable at least by virtue of their dependency to @
patentable claim,CONCLUSION
In view of the above, itis believed that the application is now in order for grant and therefore 2
favorable decision in this respect Is requested. Nevertheless, should in the subsequent stages of
procedures the Examining Division intend to decide otherwise, and before such decision is taken, oral
proceedings are hereby requested under Art. 116 EPC.
Sincerely yours,
Hassan SHAMSAEI FAR SHAMSAEI FAR, Hassan
Attorney in charge PG 127
Tel +33 15514 1104
Fax 433 15514 1495
E-mail: [Link]@[Link]Teme European Patent Offce
pase ‘50288 MUNICH
GERMANY
‘Questions about this communication ?
Contact Customer Services at www. po orgloontact
‘Shamsaei Far, Hassan
Atcatel-Lucent International
148/182 route de la Reine
92100 Boulogne-Billancourt
FRANCE.
Dae
23.05.16
Praca Toplsaion No Patent
817163/HAS/TPM. 44306808 8 - 1555 / 3021354
SRT ERTS
ALCATEL LUCENT
Communication pursuant to Rule 69 EPC - reminder concerning payment of the designation fee
(Art. 79(2) EPC) and of the examination fee (Art. 94(1) EPC) - and invitation pursuant to Rule 70a(1)
EPC
‘The date on which the European Patent Bulletin mentions the publication of the European search report
for the above-mentioned European patent application is: 18.05.16.
Your attention is drawn to Article 79(2) and Rule 39(1) EPC as well as Article 94(1), Rule 70(1) and Rule
70a(1) EPC, according to which within six months of the above-mentioned publication date of the search
report
= the designation fee must be paid,
= the request for examination must be filed and the examination fee must be paid,
= comments on the objections raised in the opinion accompanying the European search report and/or
any amendments to the description, claims and drawings correcting any deficiencies noted in the
opinion must be filed (R. 70a(1), 137(2) EPC; Guidelines for Examination in the EPO, B-XI, 8)
1. Payment of the designation fee and of the examination fee
The current designation fee for one or more Contracting States designated is: EUR 585,00
The current examination fee is: EUR 1635,00
If the written request for examination is filed in an admissible non-EPO language in accordance with
Article 14(4) EPC, a reduction of the examination fee according to Rule 6(3) EPC applies.
For European patent applications filed on or after 01.04.2014, the reduction applies only if the applicant(s)
has (have) declared to be an entity or a natural person within the meaning of Rule 6(4) EPC (Decision of
the Administrative Council of 13 December 2013, OJ EPO 2014, Ad).
If the designation fee and the examination fee are not paid within the period laid down in Rule 39(1) and
Rule 70(1) EPC, the application will be deemed to be withdrawn (R. 39(2) and Art. 94(2) EPC).
Any extension or validation fees are also payable within the above-mentioned period
Registered letter
[EPO Form 108106 15 (NFS/RTEVESOPOI=N) Page: t of2ae Application No, 14306808.8
2. Comments on the opinion accompanying the European search report and filing of amendments
‘Should the reply to the invitation pursuant to Rule 70a(1) EPC be filed in an admissible non-EPO
language, a translation is to be submitted within one month of its fling (R. 6(2) EPC).
If fling amendments, you must identify them and indicate the basis for them in the application as filed.
Failure to meet either requirement may lead to a communication from the Examining Division requesting
that you correct this deficiency (R. 137(4) EPC).
‘Should you not comply with this invitation within the time limit, the application will be deemed to be
withdrawn in accordance with Rule 70a(3) EPC.
Note to users of the automatic debiting procedure
Unless the EPO receives prior instructions to the contrary, the examination fee and the designation fee
will be debited on the last day of the period for payment. For further details see the Arrangements for the
automatic debiting procedure, supplementary publication 3 - OJ EPO 2016.
Important information concerning fee amounts
Following any amendment to the Rules relating to Fees, the amount(s) mentioned in this communication
may be different from the amount(s) actually due on the date of payment. The latest version of the
‘Schedule of fees and expenses, published as a Supplement to the Official Journal of the EPO, is also
available on the EPO website ([Link]) and can be found under [Link]/schedule-of-fees,
which allows the viewing, downloading and searching for individual fee amounts, both current and
previous.
Please note that procedural fees are usually adjusted every two years, on even years, with effect from 1
April
Payments by cheque delivered or sent direct to the EPO are no longer accepted as from 1 April 2008 (see
(OJ EPO 2007, 626),
Note concerning renewal fees
Under Article 86 EPC renewal fees shall be paid to the EPO for the European patent application. These
fees shall be due in respect of the third and each subsequent year, calculated from the date of filing. Due
‘account should be taken that the EPO will not send invoices or reminders to pay any fees in due time,
Receiving Section
x08 Plenty,
s my
* :
Pine any
[EPO Ferm 108 06.15 (NFS/RTEVESOPOI=N) Page:2 02Teme European Patent Offce
pase ‘50288 MUNICH
GERMANY
‘Questions about this communication ?
Contact Customer Services at www. po orgloontact
‘Shamsaei Far, Hassan
Atcatel-Lucent International
148/182 route de la Reine
92100 Boulogne-Billancourt
FRANCE.
Dae
20.04.16
Praca Toplsaion No Patent
817163/HAS/TPM. 44306808 8 - 1555 / 3021354
SRT ERTS
ALCATEL LUCENT
Notification of European publication number and information on the application of
Article 67(3) EPC
You are hereby informed that the technical preparations for the publication of the above-mentioned
European patent application have been completed.
The application will be published on 18.05.16 with the European search report
The publication number is: 3021354,
‘The publication will be mentioned in European Patent Bulletin number 2016/20.
([Link]
The provisional protection under Article 67(1) and (2) EPC in the individual contracting states becomes
effective only when the conditions referred to in Article 67(3) EPC have been fulfilled. For further
information, also with respect to extension states, please refer to the EPO brochure ‘National Law relating
to the EPO" (http:/[Link]/patents/law/legal-texts/national-law-epc. html).
‘The title of the invention in the three official languages of the European Patent Office is worded as follows:
Fluidische Pumpe
A fluidic pump
Pompe fluidique
In all future communications to the EPO, please quote the application number as indicated above, ie.
including the final four figures (which identify the Directorate responsible for the subsequent procedure)
Remark
‘The publication can be downloaded, free of charge, from the EPO publication server
[Link] or can be ordered from the Vienna sub-office upon payment of
a fee (see Decision of the President of the EPO dated 12 July 2007 concerning the form of publication of
European patent applications, European search reports and European patent specifications, Special
edition No. 3, OJ EPO 2007, 97).
EPO Fomm1138 07:18 Page: t of2ae Application No, 14306808.8
Note concerning renewal fees
Under Article 86 EPC renewal fees shall be paid to the EPO for the European patent application. These
fees shall be due in respect of the third and each subsequent year, calculated from the date of fling. Due
‘account should be taken that the EPO will not send invoices or reminders to pay any fees in due time.
Accelerated prosecution of European patent applications
Applicants wishing to accelerate proceedings before the EPO may file a request according to the
programme for accelerated prosecution of European patent applications - “PACE” (Od EPO 2010, 362),
EPO Form 1005 is available on the EPO website ([Link]) for this purpose,
Receiving Section
a Patetey,
701mg aay"
s
é
EPO Fomm1138 07:18 Page:2 02Teme European Patent Offce
pase ‘50288 MUNICH
9) tarpon, GERMANY
nop
‘Questions about this communication ?
Contact Customer Services at www. po orgloontact
‘Shamsaei Far, Hassan
Atcatel-Lucent International
148/182 route de la Reine
92100 Boulogne-Billancourt
FRANCE.
Dae
10.08.15,
Praca Toplsaion No Patent
817163/HAS/TPM. 14306808 8 - 1555
SRT ERTS
ALCATEL LUCENT
Communication
‘The extended European search report is enclosed.
‘The extended European search report includes, pursuant to Rule 62 EPC, the European search report
(R. 61 EPC) or the partial European search report/ declaration of no search (R. 63 EPC) and the
European search opinion.
Copies of documents cited in the European search report are attached
SO adkitional se(s) of copies of such documents is (are) enclosed as well
The following have been approved
Abstract Title
(The Abstract was modified and the definitive texts attached to this communication.
The following figure(s) will be published together with the abstract: 1A
Refund of search fee
If applicable under Article 9 Rules relating to fees, a separate communication from the Receiving Section
on the refund of the search fee will be sent later.
‘Should you wish to further prosecute this application in the examination phase, your attention is drawn to
the provisions of Rule 70a EPC. An invitation to respond to the extended European search report will be
issued once the date of publication of the European search report has been mentioned in the European
Patent Bulletin (R. 69(1), R. 70(2) EPC).
0 Paton
go Peta,
$ ,
= &
. QD):
6, ¢
"toang aayDatum
Date
Date
Pa ‘Anmelde-Nr
cf Form 1507 Sheet 1 Apoleation 44 306 808.8
No
Feuile pen
‘The examination is being carried out on the following application documents
Description, Pages
147
as originally filed
Claims, Numbers
1415
as originally filed
Drawings, Sheets
113-3/3
D1
D2
D3
D4
ve
1.2
13
14
as originally filed
WO 2005/071748 A1 (PHILIPS NV ) 4 August 2005
US 2006/078434 A1 (KIM TAE-GYUN [KR] ET AL) 13 April 2006
US 2.910 836 A (SEBASTIAN KARRER) 3 November 1959
US 2011/020140 A1 (PARK TAE-SIK [KR] ET AL) 27 January 2011
The application lacks unity within the meaning of Article 82 EPC.
Claims 1-9, 13-15 relate to a pump driven by heat expansion of pumped fluid
comprising a peltier-element for driving
Claims 10-12 relate to a pump driven by heat expansion of pumped fluid
comprising two separate heaters for driving
The common concept of the two subjects is pumping by heat expansion of the
pumped fluid (claim 1). But this concept is known, see D1. Claim 1 can thus
not provide the single general inventive concept that is required by Art. 82 to
link the two subjects. In fact, the embodiments corresponding to the two
groups of claims (pump with a peltier element and pump with two separate
heaters) are essentially different constructions, which are not linked by a
common single general inventive concept.
This communication concerns all claims since all additional search fees have
been paidDatum
Date
Date
24
Pa ‘Anmelde-Nr
cf Form 1507 Sheet 2 Apoleation 44 306 808.8
Feuil A
euite Demande o*
The present application does not meet the requirements of Article 52(1) EPC.
because the subject-matter of claim 1 is not new within the meaning of Article
54(1) and (2) EPC.
Document D1 discloses in Fig. 1 an apparatus comprising:
- a first heat source (8);
-a fluid (heat transporting fiuid, p. 3 |. 24.);
- a first chamber and a second chamber (3, 13) connected to one another
through a channel (23); wherein the first heat source is configured to heat the
fluid in the first chamber to cause the fluid to flow, through the channel, from
the first chamber to the second chamber and to make thermal contact with a
second heat source (electronic device 1) to absorb heat from the second heat
source (heater 8 drives fluid to cool electronic device 1, p. 6 |. 10-17).
Dependent claims 2-9 and 13-15 do not appear to contain any additional
features which, in combination with the features of any claim to which they
refer, meet the requirements of the EPC with respect to novelty and/or
inventive step for the following reasons,
- claims 2, 3, 5, 14 and 15: The additional features are known from D1, see
Fig. 1
- claim 6: A nozzle or a diffuser is equivalent to the valves 7, 15 in D1, Fig. 1
because they have the same function, namely to prevent re-entrainment of
the fluid into the chamber from where it emerges. Replacing the valves 7, 15
by nozzles or diffusers is therefore obvious and leads to the subject-matter of
claim 6.
- claims 7-9: The diaphragm-pump in D1 and the Peltier-element-pump in D2
or D3 have the same function, replacing the pump in D1 by the pump from D2
or D3 is thus obvious and leads to the subject-matter of claims 7-9, which are
therefore not inventive.
- claim 13: In D1, Fig. 1 chamber 13 is simultaneously a pressure chamber
and a cooling chamber (p. 41. 16 ff), adding a separate cooling chamber
appears obvious and cannot justify an inventive step,Datum
Date
Date
at
Pa ‘Anmelde-Nr
cf Form 1507 Shest 3 Apoleation 44 306 808.8
Feuil A
ne Demande o*
The present application does not meet the requirements of Article 52(1) EPC.
because the subject-matter of claim 10 is not new within the meaning of
Article 54(1) and (2) EPC.
Document D4 discloses in Figs. 4-6 an apparatus comprising
- a first heat source (228);
~a fluid;
- a first chamber (206) and a second chamber (208) connected to one
another through a channel (200); wherein the first heat source is configured to
heat the fluid in the first chamber to cause the fluid to flow, through the
channel, from the first chamber to the second chamber and to make thermal
contact with a second heat source (248) to absorb heat from the second heat
source,
wherein the first heat source is a located outside the first chamber and the
apparatus comprises a third heat source (262) located outside the second
chamber, the third heat source being configured to heat the fluid in the
second chamber (peltier-element can heat chamber 200).
Dependent claims 11 and 12 appear to meet the requirements of the EPC
with respect to novelty and inventive step because an apparatus according to
claim 1 further comprising an additional third heat source inside the chamber
is neither disclosed in nor rendered obvious by the cited prior art.EUROPEAN SEARCH REPORT
‘Application Number
EP 14 30 6808
DOCUMENTS CONSIDERED TO BE RELEVANT
‘Gtation of dosument with inceation, where appropriate,
of relevant passages
US 2006/078434 Al (KIM TAE-GYUN [KR] ET
AL) 13 April 2006 (2006-04-13)
* Figures 1A, 1B *
US 2 910 836 A (SEBASTIAN KARRER)
3 November 1959 (1959-11-03)
* figure 1 *
WO 2005/071748 A1 (KONINKL PHILIPS
ELECTRONICS NV [NL]; SOGHAL RAMPRASAD
[IN]) 4 August 2005 (2005-08-04)
* figure 1 *
US2011/020140 Al (PARK TAE-SIK [KR] ET
AL) 27 January 2011 (2011-01-27)
* Figures 4-6 *
13-15
10-12
11,12
‘The present search report has been dawn up for ll laime
Relevant | CLASSIRCATION OF THE
toelaim | APPLICATION (PO)
INV.
HO1L23/473
Fo4B19/24
TEGHNIGAL FIELDS,
SEARCHED (PC)
HOLL
FO4B
The Hague 30 July 2015
Kastner, Martin
sees
pares
SSoument
i
TT: theory or prnsbleunderiing the invention
E carr part coeument, but pubiehed on, oF
rt feombine wih anther
© deoument fad the sppioaton
re calor 1 ooumen ste fr
2 Technologie basegroune
©: nonwiten eloere
{pier ote sare palo fay, oaesponding»)
para sppeaton Number
ae EP 14 30 6808
CLAIMS INCURRING FEES
‘The present European patent application comprised at the time of filing claims for which payment was due.
Only part of the claims have been paid within the prescribed time limit. The present European search
report has been drawn up for those claims for which no payment was due and for those claims for which
claims fees have been paid, namely claim(s):
[No claims fees have been paid within the prescribed time limit. The present European search report has
been drawn up for those claims for which no payment was due.
LACK OF UNITY OF INVENTION
‘The Search Division considers that the p
requirements of unity of invention and relates to several inventions or groups of inventions, namely
int European patent application does not comply with the
see sheet B
All further search fees have been paid within the fixed time limit. The present European search report has|
been drawn up for all claims.
AAs all searchable claims could be searched without effort justifying an additional fee, the Search Division
did not invite payment of any additional fee.
Only part of the further search fees have been paid within the fixed time limit. The present European
search report has been drawn up for those parte of the European patent application which relate to the
inventions in respect of which search fees have been paid, namely olaims:
[None ofthe further search fees have been paid within the fixed time limit. The present European search
report has been drawn up for those parts of the European patent application whiah relate to the invention
first mentioned in the claims, namely claims:
‘The present supplementary European
arch report has been drawn up for those parts
of the European patent application which relate tothe invention frst mentioned in the
claims (Fule 164 (1) EPC),o) as LACK OF UNITY OF INVENTION coeemaanaes
Sener SHEET B EP 14 30 6808
‘The Search Division considers that the present European patent application does not comply with the
requirements of unity of invention and relates to several inventions or groups of inventions, namely:
1. claims: 1-9, 13-15
pump driven by heat expansion of pumped fluid comprising a
peltier-element for driving
2. claims: 10-12
pump driven by heat expansion of pumped fluid comprising two
separate heaters for driving2
z
ANNEX TO THE EUROPEAN SEARCH REPORT
ON EUROPEAN PATENT APPLICATION NO.
EP 14 30 6808
‘This annex lists the patent family members eating to the patent deouments cited in the above-mentioned European search report
“The members are as contained in the European Patent Office EDP file on
‘The European Patent Office i in no way lable for these particulars which are merely given forthe purpose of information
30-07-2015
Patent document Publestion Patent family Publotion
cited in search report ate. member(s) date
US 2006078434 Al 13-04-2006 JP 4150739 B2 17-09-2008
JP 2006090310 A 06-04-2006
KR 20060024608 A 17-03-2006
US 2006078434 Al 13-04-2006
us 2910836 A 03-11-1959 NONE
WO 2005071748 Al 04-08-2005 CN 1910751 A 07-02-2007
ep 1709683 AL 11-10-2006
JP 2007519249 A 12-07-2007
KR 20060130129 A 18-12-2006
US 2009021909 Al 22-01-2009
WO 2005071748 AL 04-08-2005
US 2011020140 Al 27-01-2011 JP 2007247404 A 27-09-2007
KR 20060063123 A 12-06-2006
US 2011020140 Al
27-01-2011
For mote details about this annex : see Offical Joumal ofthe European Patent Offioe, No. 12/82Acknowledgement of receipt
We hereby acknowledge receipt ofthe following subsequently filed document(s)
‘Submission number 3481031
Application number EP14306808.8
Date of receipt 06 May 2015
Receiving Office European Patent Office, The Hague
Your reference 817163 HASISP
Applicant All applicants as on file
Documents submitted package-data xml ep-sfd-request xml
[Link] (1 p.) EPLETT-1.pdf817163 EP no payment
second search [Link] (1 p.)
Submitted by CN=Solange Piekny 25925
Method of submission Online
Date and time 06 May 2015, 17:21 (CEST)
receipt generated
Message Digest ‘AK[Link] :36:8E:65:CB:96:DE:AE:6E:4D
Correction by the EPO of errors in debit instructions filed by eOLF
Errors in debit instructions fled by eOLF that are caused by the editing of For 1036E entries or the continued use of outdated
software (all forms) may be corrected automatically by the EPO, leaving the payment date unchanged (see decision T 152/82,
(OJ EPO 1984, 301 and point 6.3 f ADA, Supplement to OJ EPO 10/2007),
JEuropean Patent Office!
Acknowledgement of receipt - application number EP14306808.8 Page 1 of 1) Hur Sce Letter accompanying subsequently filed items
Otte européen
Representative: 80296 Munich
Gece
M. Hassan SHAMSAE! FAR Tet *49(0}89 2500-0 | Fax-4465
Alcatel-Lucent International
148/152 Route de la Reine P.O. Box 5618
92100 BOULOGNE-BILLANCOURT ee ny Rijswike
France Tel. +31(0)70 340-2040 | Fax -3016
Phone: +33155141104 re)
Fax: +33155141495 Gormany
E-mail: [Link]@[Link] Tel +49(0)90 2500-0 | Fax 840
‘The document(s) listed bolow is (are) subsequently fled documents pertaining to the following application
‘Application number 143088088
‘Applicants or representative's reference 817163 HASISP
Description of document (Original fe name ‘Assigned fle name
7 | Lelier relating to the search and '817 763 EP no payment second search EPLETT-1 pa
‘examination procedure feo pat
Signatures
Place: BOULOGNE-BILLANCOURT
Date 06 May 2015
Signed by: ‘Masson SHAMSAEI FAR
Capacity (Representative)
817163 HAS/SP.EUROPEAN PATENT OFFICE
D- 80298 MUNICH
GERMANY
Boulogne-Billancourt, Wednesday, 06 May 2015
O/Ref.: 817163 - HAS/SP
European Patent Application No. 14306808.8
Filed on 14/11/2014
Owner Alcatel Lucent
Dear Sirs,
In response to the communication of the EPO dated 28 April 2015, please be informed that
Applicant does not wish to pay a second search fee.
Accordingly, please issue an extended search report with the search opinion on the searched claims.
Sincerely yours,
Hassan SHAMSAEI FAR SHAMSAEI FAR, Hassan
Attorney in charge PG 127
Tel 433 15514 1104
Fax 33 15514 1495
E-mail: [Link]@[Link]
ALCATEL-LUCENT INTERNATIONAL
148/152 route de la Reine Ts #33 (0)1 5514 1010
92100 BOULOGNE-BILLANCOURT - FRANCE Fs #33 (0)1 5514 1495Teme European Patent Offce
pase ‘50288 MUNICH
tarpon, GERMANY
Sener
‘Questions about this communication ?
Contact Customer Services at www. po orgloontact
‘Shamsaei Far, Hassan
Atcatel-Lucent International
148/182 route de la Reine
92100 Boulogne-Billancourt
FRANCE.
Dae
28.04.15
Praca Toplsaion No Patent
817163/HAS/TPM. 14306808 8 - 1555
SRT ERTS
ALCATEL LUCENT
Communication
‘The partial European search report (R. 64 EPC) is enclosed,
‘The applicant is informed that if the European search report is also to cover inventions other than the
invention(s) already searched and for which a meaningful search can be carried out, a further search fee
‘must be pald for each of these inventions, in the present instance
1 search foo(s)
within two months after notification of this communication.
‘The amount payable for each further search is EUR 1285,00.
Note to users of the automatic debiting procedure
Unless the EPO receives prior instructions to the contrary, the fee(s) will be debited on the last day of the
period for payment, For earlier payment(s) another method of payment must be used. For further details
see the Arrangements for the automatic debiting procedure (Supplementary publication 4 - QJ EPO 2014)
If applicable, a European search opinion covering those invention(s) for which a search fee has been paid
will then be sent together with the European search report.
Copies of documents cited in the European search report are attached.
$0 adcitional sets) of copies of such documents is (are) enclosed as well
The following have been approved
Ms Abstract Title
C_— The Abstract was modified and the definitive text is attached to this communication.
The following figure(s) will be published together with the abstract: 1A
Registered letter
EPO Form 150700414 (RTE)ae page 2 Application No, 14306808.8
Important information concerning fee amounts
Following any amendment to the Rules relating to Fees, the amount(s) mentioned in this communication
may be different from the amount(s) actually due on the date of payment. The latest version of the
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Please note that procedural fees are usually adjusted every two years, on even years, with effect from 1
April
Payments by cheque delivered or sent direct to the EPO are no longer accepted as from 1 April 2008 (see
OJ EPO 2007, 626)
sh,
&
eovate +
ol Lin
EPO Form 15070 04.14 (RTE)9) Heine PARTIAL EUROPEAN SEARCH REPORT ‘Application Number
ie under Rule 64, paragraph 1 of the European Patent EP 14 30 6808
Convention
DOCUMENTS CONSIDERED TO BE RELEVANT
Casgon| eaten rma peepee foam | APBLIERTION We)
x WO 2005/071748 Al (KONINKL PHILIPS 1-6, INV.
ELECTRONICS NV [NL]; SOGHAL RAMPRASAD 13-15 | Ho1L23/473
[IN]) 4 August 2005 (2005-08-04) Fo4B19/24
y * figure 1 * 7-9
y — |US 2006/078434 Al (KIM TAE-GYUN [KR] ET |7-9
AL) 13 April 2006 (2006-04-13)
* Figures 1A, 1B *
Y US 2 910 836 A (SEBASTIAN KARRER) 7-9
3 November 1959 (1959-11-03)
* figure 1 *
TEGHNIGAL FIELDS,
Hearne ibe)
HOLL
FO4B
LACK OF UNITY OF INVENTION
Te Sean Ovonsoeo ath evn Exepear plo emai seep a wh
Tiepemnl nyotmesonatdns oto siwanon sp ove
see sheet B
| amegtpes era seep ase camp teen ate Ege
The Hague 17 April 2015 Kastner, Martin
CATEGORY OF TED DOGUMENTS “hero pepe undying ha enon
E carr part coeument, but pubiehed on, oF
YY arteuay retvart feombined with another © deoument fad the sppioaton
Soument oft sme soegory (sosument sited for other easone
2 Technologie basegroune
©: nonwiten eloere {pier ote sare palo fay, oaespondingo) as LACK OF UNITY OF INVENTION coeemaanaes
Sener SHEET B EP 14 30 6808
‘The Search Division considers that the present European patent application does not comply with the
requirements of unity of invention and relates to several inventions or groups of inventions, namely:
1. claims: 1-9, 13-15
pump driven by heat expansion of pumped fluid comprising a
peltier-element for driving
2. claims: 10-12
pump driven by heat expansion of pumped fluid comprising two
separate heaters for driving
The common concept of the two subjects is pumping by heat expansion of
the pumped fluid (claim 1). But this concept is known, see D1. Claim 1
can thus not provide the single general inventive concept that is
required by Art. 82 to link the two subjects. In fact, the embodiments
corresponding to the two groups of claims (pump with a peltier element
and pump with two separate heaters) are essentially different
constructions, which are not linked by a common single general inventive
concept.ANNEX TO THE EUROPEAN SEARCH REPORT
ON EUROPEAN PATENT APPLICATION NO. EP 14 30 6808
‘This annex lists the patent family members eating to the patent deouments cited in the above-mentioned European search report
“The members are as contained in the European Patent Office EDP file on
‘The European Patent Office i in no way lable for these particulars which are merely given forthe purpose of information
17-04-2015
Patent document Publestion Patent family Publotion
cited in search report ate. member(s) date
WO 2005071748 Al 04-08-2005 CN 1910751 Al 07-02-2007
ep 1709683 Al 11-10-2006
JP 2007519249 A 12-07-2007
KR 20060130129 A 18-12-2006
US 2009021909 Al 22-01-2009
2005071748 AL 04-08-2005
US 2006078434 Al 13-04-2006 JP 4150739 B2 17-09-2008
JP 2006090310 A 06-04-2006
KR 20060024608 A 17-03-2006
2006078434 AL 13-04-2006
us 2910836 A 03-11-1959 NONE
2
z
For mote details about this annex : see Offical Joumal ofthe European Patent Offioe, No. 12/82Application No,: 143068088
‘The search has started on 17.04.15 (see Notice from the European Patent Office dated 03/2013, OJ EPO
2013, 153)
Receiving Section==.
Hassan SHAMSAEI FAR
‘Alcatel-Lucent International
148/152 Route de la Reine
92100 BOULOGNE BILLANGOURT
FRANCE
Date
Reference
Application number
09 December 2014
817163/HAS/TPM.
EP 14306808.8
Applicant
ALCATEL LUCENT
The European Patent Office hereby confirms receipt of the above-mentioned application,
which was filed with the central industrial property office or other competent authority of a
contracting state (Article 75(1)(b) EPC). For a list of documents received with the application,
please refer to the acknowledgement of receipt issued by the national authority (attached). All
further documents relating to this application must be sent directly to the European Patent
Office.
Dato of receipt at EPO 03 December 2014
‘See overeatEuropaisches European Office européen
0) Patentamt Patent Office des brevets
Acknowledgement of receipt
We hereby acknowledge receipt of your request for grant of a European patent as follows
Submission number
Application number
File No. to be used for
priority declarations
Date of receipt
1000265131
EP14306808.8
EP 14306808
14 November 2014
Your reference
817163/HAS/TPM
Applicant | ALCATEL LUCENT
Country | FR
Title | A Fluidic Pump
[Link] [Link]
[Link] ep-request pdf (4 p.)
SPECEPO-1.pd817163_EP Te | [Link] (1 p.)
xt and [Link] (24 p.)
[Link] (1 p.) [Link] (1 p.)
[Link] (1 p.)
Submitted by
Method of submission
Date and time receipt
generated
Official Digest of
‘Submission
EMAIL=[Link]@[Link],CN=Marie-Anne
HUMBERT,O=ALCATEL-LUCENT INTERNATIONAL,C=FR
Online
14 November 2014, [Link] (CET)
[Link]
JINPI, section dépat!ABSTRACT
A fluidic pump is disclosed having a first heat source configured to heat a fluid in
a first chamber to thereby increase the pressure in the fluid and cause it to flow
to a second chamber through a channel. The fluid is configured to absorb heat
from a second heat source and cool said heat source as it flows from the first
chamber to the second chamber. The flow may be periodic in in backward and
forward directions or it may be one-directional. A heat transfer assembly
comprising the micro-fluidic pump is also disclosed
(Figure 1A)Europaisches European Office européen
fh) Patentamt Patent Office des brevets
Acknowledgement of receipt
We hereby acknowledge receipt of your request for grant of a European patent as follows:
Submission number
Application number
File No. to be used for
priority declarations
Date of receipt
1000265131
EP14306808.8
EP14306808
14 November 2014
Your reference
817163/HAS/TPM
Applicant | ALCATEL LUCENT
Country | FR
Title | A Fluidic Pump
Documents submitted | [Link] [Link]
application-body xml ep-request pdf (4 p.)
SPECEPO-1.pd817163_EP_Te | [Link] (1 p.)
xt and [Link] (24 p.)
£[Link] (1 p.) £[Link] (1 p.)
[Link] (1 p.)
Submitted by
Method of submission
Date and time receipt
generated
Official Digest of
Submission
EMAIL=[Link]@[Link],CN=Marie-Anne
HUMBERT,O=ALCATEL-LUCENT INTERNATIONAL,C=FR
Online
14 November 2014, [Link] (CET)
[Link] [Link]
INPI, section dépot!10
15
20
25
18-
CLAIMS
1. Anapparatus comprising:
- a first heat source;
- afluid;
- a first chamber and a second chamber connected to one another through
a channel;
wherein the first heat source is configured to heat the fluid in the first chamber to
cause the fluid to flow, through the channel, from the first chamber to the second
‘chamber and to make thermal contact with a second heat source to absorb heat
from the second heat source.
2. The apparatus of claim 1, wherein the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in a
second direction in response to receiving heat in the second chamber.
3. The apparatus of claim 1, wherein the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in the
same first direction in response to receiving heat in the second chamber.
4. The apparatus of any one of claims 1 to 3, wherein the fluid is configured
to change phase from liquid to gas in response to receiving heat from the first
heat source.
5. The apparatus of any one of claims 1 to 3, wherein the fluid is configured
to undergo thermal expansion in response to receiving heat from the first heat
source.
6. The apparatus of any one of the preceding claims, wherein According to
some specific embodiments, the apparatus further comprises a nozzle and a
diffuser located on a flow path of the fluid wherein a nozzle is configured to
provide higher resistance to the flow of the fluid than a diffuser.15
20
25
-19-
7. The apparatus of any one of the preceding claims, wherein the first heat
source is configured to heat the fluid in the first chamber and cool the fluid in the
second chamber.
8. The apparatus of any one of the preceding claims, wherein the first heat
source is a thermoelectric cooler.
9. The apparatus of claim 8, wherein the first heat source is located between
the first chamber and the second chamber.
10. The apparatus of any one of the preceding claims 1 to 7, wherein the first
heat source is a located outside the first chamber and the apparatus comprises a
third heat source located outside the second chamber, the third heat source
being configured to heat the fluid in the second chamber.
14. The apparatus of any one of the preceding claims 1 to 7, wherein the first
heat source is a located inside the first chamber and the apparatus comprises a
third heat source located inside the second chamber, the third heat source being
configured to heat the fluid in the second chamber.
12. The apparatus of claim 11, wherein the first heat source and the third heat
source each comprise one or more electronic or optical components configured
to generate heat during operation.
13. The apparatus of any one of the preceding claims, further comprising a
cooling chamber configured to cool the fluid prior to the fluid reaching the second
heat source.
14, The apparatus of any one of the preceding claims further comprising a
plurality of one-directional valves being arranged so as to allow a flow of the fluid
in one direction and to block a flow of the fluid in a direction opposite to the one
direction.15. A heat transfer assembly comprising the apparatus of any one of the
previous claims 1 to 14 and further comprising a thermal energy removal
mechanism.10
15
20
25
A Fluidic Pump
The present disclosure relates to cooling techniques for electronic or optical
equipment using fluidic pumps.
BACKGROUND
The recent significant growth in data traffic in telecommunications requires more
functionality from future electronic or photonics packages. More functionality
implies comparatively higher levels of heat generation. The current thermal
solutions employed today do not appear to be capable of scaling sufficiently to
meet future network demands. One approach for cooling such components is
based on using fluidic pumps.
SUMMARY
‘Some embodiments feature an apparatus comprising:
- afirst heat source;
- afluid;
- a first chamber and a second chamber connected to one another through
achannel;
wherein the first heat source is configured to heat the fluid in the first chamber to
cause the fluid to flow, through the channel, from the first chamber to the second
chamber and to make thermal contact with a second heat source to absorb heat
from the second heat source.
According to some specific embodiments, the fiuid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in a
second direction in response to receiving heat in the second chamber.10
15
20
25
According to some specific embodiments, the fluid is configured to flow in a first
direction in response to receiving heat in the first chamber and to flow in the
same first direction in response to receiving heat in the second chamber.
According to some specific embodiments, the fluid is configured to change phase
from liquid to gas in response to receiving heat from the first heat source.
According to some specific embodiments, the fluid is configured to undergo
thermal expansion in response to receiving heat from the first heat source.
According to some specific embodiments, the apparatus further comprises a
nozzle and a diffuser located on a flow path of the fluid wherein a nozzle is
configured to provide higher resistance to the flow of the fluid than a diffuser.
According to some specifi
bodiments, the first heat source is configured to
heat the fluid in the first chamber and cool the fluid in the second chamber.
According to some specific embodiments, the first heat source is a thermoelectric
cooler.
According to some specific embodiments, the first heat source is a thermoelectric
cooler and is located between the first chamber and the second chamber.
According to some specific embodiments, the first heat source is a located
outside the first chamber and the apparatus comprises a third heat source
located outside the second chamber, the third heat source being configured to
heat the fluid in the second chamber.
According to some specific embodiments, the first heat source is a located inside
the first chamber and the apparatus comprises a third heat source located inside
the second chamber, the third heat source being configured to heat the fluid in
the second chamber.
‘According to some specific embodiments, the first heat source and the third heat
source each comprise one or more electronic or optical components configured
to generate heat during operation.10
15
20
25
According to some specific embodiments, the apparatus further comprises a
cooling chamber configured to cool the fluid prior to the fluid reaching the second
heat source,
According to some specific embodiments, the apparatus further comprises a
plurality of one-directional valves being arranged so as to allow a flow of the fluid
in one direction and to block a flow of the fluid in a direction opposite to the one
direction.
Some embodiments feature a heat transfer assembly comprising the apparatus
as recited above and further comprising a thermal energy removal mechanism.
These and further features and advantages of the proposed solution are
described in more detail, for the purpose of illustration and not limitation, in the
following description as well as in the claims with the aid of the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1A, 1B and 1C are various exemplary schematic representations
corresponding to a pump according to some embodiments.
Figure 2A and 2B are exemplary schematic representations corresponding to a
Pump according to some embodiments.
Figure 3 is an exemplary schematic representation corresponding to a pump
according to some embodiments.
Figure 4 is an exemplary schematic representation corresponding to a pump
according to some embodiments.
DETAILED DESCRIPTION
Due to an increasing trend in designing small-size and highly reliable devices, a
cooling mechanism used in such devices is also desired to be small and highly10
15
20
25
reliable. It is further desired that such cooling mechanism is capable of being
situated within a package of reduced size and of delivering the required pressure
rise in the working fluid (e.g. in the range of 10kPa or higher at a flow rate in the
range of Sml/min or higher).
Various known cooling techniques rely on the use of moving parts to cause a
fluid (liquid or gas) to flow in the vicinity of the component to be cooled to thereby
absorb heat from the component through thermal contact and transfer it to other
environments (e.g. the ambient). Such solutions however are typically not
sufficiently reliable because the moving parts will typically suffer from mechanical
failure (e.g. wearing out or breakage) after some usage.
Furthermore, the pumping mechanisms using moving parts (e.g. piezoelectric
diaphragm pumps) occupy some space which is typically relatively large as
compared to the overall size of the device. This makes the miniaturization of the
device difficult.
Some known devices such as electro-osmotic pumps have no moving parts,
however these devices typically do not have the required fluidic performance and
therefore are typically not suitable for applications such as micro-fluidic cooling,
The solution proposed herein takes advantage of the fact that under an increase
in temperature due to absorption of heat, the volume of a fluid increases for a
fixed pressure. Conversely, the pressure of the fluid increases if the volume in
which it is contained is fixed.
This pressure increase may, in some cases, be the result of imposing a phase
change in the fluid (e.g. liquid turning into vapor); and in some other cases, it
may simply be the result of the thermal expansion in a fluid in response to an
increase in temperature,15
20
25
Therefore, when a fiuid is heated within in a volume that is provided with an
outlet, the increase in the pressure of the fluid within that volume causes the fluid
to move (flow) out of that volume through its outlet
Embodiments of the disclosure aim at hamessing the above-described effect of
fluid motion induced by the pressure changes in the fluid, due to variation in
temperature, to obtain a pumping effect. This pumping effect can be provided in
any suitable manner. Two non-limiting examples of preferred approaches are
provided below and described in further details with reference to the drawings.
A first approach is to cause the fluid to move in two opposing direction (e.g.
backwards and forwards, as in a shuttle) over the components to be cooled.
Assecond approach relates providing a flow of the fluid on only one direction over
the component to be cooled. This second approach can be achieved for example
by using one-directional valves to make a pump mechanism with continuous flow
in one direction.
In the context of the present description the term “thermal contact" and
derivations thereof are to be understood to refer to both a direct contact, without
an interface, between two elements that are meant to transfer heat between each
other; an a contact through an interface (a third element) located between the
two elements and capable of transferring heat from one of the two elements to
the other.
In the following, some exemplary embodiments are provided in relation to micro-
fluidic pumps. These pumps typically use micro-channels for the flow of fluid
within the cooling mechanism. Micro-fluidic pumps may be used in applications
where small size components need to be cooled, such as for example in
telecommunications. Herein, a micro-channel is to be understood to refer to a
channel having at least one cross sectional dimension below 1mm in length. For10
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example a rectangular micro-channel cross section can have the following
dimensions: 0.9mm x 5mm
However the disclosure is not limited to the use of micro-channels in pumps and
is likewise applicable to larger pumping applications where a reliable pump is
required, for example in larger scale pumps for XFP cooling or for biomedical
application where channel may have a cross-sectional dimension over 1mm.
Figures 1A, 1B and 1C illustrate an example embodiment of a heat transfer
assembly comprising a micto-fluidic pump according to the first approach. In
these figures, by way of illustration and not limitation, a pump mechanism is
shown that uses the concept of phase change (e.g. liquid-vapor). However, those
skilled in the related art will understand that pump mechanism without phase
change, and merely using the expansion/contraction effect of a fluid in response
to variation in temperature, may also be made using the principles of the
disclosure.
Referring first to figure 1A, there is shown a heat transfer assembly 100,
comprising a pump 110 (in this example being a multi-phase pump), a heat
source 120 which may comprise one of more optical component or one or more
electronic components, to be cooled and a thermal energy removal mechanism
130 such as a heat sink
A working fluid 112 is used for heat transfer operations. The working fluid 112 is
capable of flowing through micro-channels 140 in backward or forward directions.
The heat transfer assembly 100 further comprises a cooling chamber 150
through which the working fluid can flow.
The pump 110 comprises a thermoelectric cooler (TEC) 111. A TEC is a known
solid-state heat pump that is capable of pumping the heat from one side to the
other in response to a supplied voltage. The direction of pumping the heat
depends on the polarity of the supplied voltage. If the voltage applied to the TEC10
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is reversed, the direction of the heat pumping effect will be reversed also.
Therefore, under ambient temperature, this heat transfer therefore results in one
side of the TEC being above and the other side being below the ambient
temperature.
Figure 1B shows the pump 110 of figure 1A in a larger scale. The pump 110 has
a housing 113 comprising a first chamber 113a and a second chamber 113b.
With simultaneous reference to both figures 1A and 1B, it is assumed that the
TEC 111 is excited by a voltage applied thereto. As a result, one side 111a of the
TEC heats up while the other side 111b cools down relative to the initial
temperature within the TEC (e.g. ambient temperature). Therefore, the hot side
11 1a of the TEC causes the working fluid 112 to change phase from liquid to
vapor 112a, thereby increasing in pressure within the boundaries 113 of the first
chamber 113a. The opposing side 111b of the TEC cools the fluid, resulting in
the fluid changing phase from vapor to liquid, or simply contracting in volume,
thus decreasing the pressure inside the second chamber 113b. This operation
causes the fluid to be shuttled in a first direction (anticlockwise in the example
shown in figures 1A and 1B). As a result the fluid can move through the micro-
channels 140 and enter the cooling chamber 150 (figure 1A). The cooling
chamber 150 is in thermal contact with the thermal energy removal mechanism
130 through which it exchanges heat with the ambient. Therefore, the fluid 112
may be cooled down to some degree in the cooling chamber before it flows
further to reach the heat source 120. Further details related to the movement of
the fluid within the heat chamber are provided below.
After the fluid 112 has entered in thermal contact with the heat source 120 and
absorbed heat therefrom, the heated fluid 112 then continues to flow out of the
cooling chamber 150 and through micro-channels 140 to finally reach the second
chamber 113b and the cooler side 111b of the TEC 111. In this manner a closed10
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loop is provided in which the fluid is made to move, i.e. pumped, from the pump
110 toward the heat source 120 and back to the pump 110, as shown by arrows
in figure 1A.
Referring now to figure 1C a scenario is shown in which the polarity of the
voltage applied to the TEC 111 is reversed thereby causing the fluid 112 to move
in the reverse direction (clockwise in the example shown in figure 1C) due to the
same effects as described with reference to figure 1A.
The polarity of the applied voltage may be varied according to any desired
frequency to meet the cooling demands of each particular application and to suit
the performance of the heat transfer assembly of figures 1A, 1B and 1C.
As an additional measure to ensure efficient cooling the heat source 120 may be
situated such that the fluid 112 heated by the TEC 111 does not directly reach it
For example the heat source 120 may be located at a distance from the pump
which is longer than the distance along which the pump can push the fluid from
the TEC 111. Therefore, with each stroke (back and forth), the fluid heated by the
TEC 111 moves away from the TEC without reaching the heat source 120.
The pump may be configured such that relatively little amount of energy would be
required to cause a phase transformation or thermal expansion in the fluid and
thus relatively little heating is caused. For example, if the working fluid is water at
atmospheric pressure, and if the system is set to operate at 99C then the TEC
only needs to heat the water by 1C to trigger the phase change from a liquid to a
gas; which is very little heating. On the other hand, if the pressure is reduced by
applying a vacuum on the system then the phase transition temperature can be
changed from 100C to another, say 50C, and the process can be repeated. In
this manner the pump can be configured so that the TEC 111 does very ttle
sensible heating of the fluid, Other fluids, for example dielectric fluids, may also
be used in a similar manner.20
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The cooling chamber 150 comprises nozzles and diffusers 151-154. These
nozzles and diffused are employed to prevent re-entrainment of the heated fluid
112 into the cooling chamber 150 after it has been heated by entering into
thermal contact with the heat source 120,
In the context of the present disclosure, a nozzle may be considered to be a
contraction in the cross sectional area of the micro-channel relative to the
direction of flow of the fluid. Likewise, a diffuser may be considered as an
expansion in the cross sectional area of the micro-channel relative to the
direction of flow of the fluid. Therefore, by changing the direction of flow of the
fluid, a nozzle may become a diffuser and vice-versa.
For example in figure 1A, elements shown by reference numerals 154 and 152
are nozzles; and elements shown by reference numerals 151 and 153 are
diffusers. Diffusers have a lower resistance to fluid flow than nozzles of
comparable size; therefore the fluid will tend to pass through a diffuser easier
than through a nozzle.
The cooling chamber 150 comprises two sections 150a and 150b separated by a
wall 155. As can be seen in the figures 1A and 1C, a nozzle 152 and a diffuser
151 are located in one section 150b of the cooling chamber and a nozzle 154
and a diffuser 153 are located in the other section 150a,
In the example of figure in figure 1A, the fluid is shown to be moving away from
the right hand side of the TEC 111. It enters the right hand side section 150a of
the cooling chamber and flows through the diffuser 153 and on towards the heat
source 120 where it receives thermal energy. Then the fluid flows into the left
hand side section 150b of the cooling chamber and finally flows toward the TEC
111 by passing through the diffuser 151 and out of the left hand section 150b of
the cooling chamber. When the polarity of the voltage applied to the TEC 111 is
reversed, the direction of the flow of the fluid 112 reverses (figure 1C) and
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