你好,我现在自己做了一个AGX Orin的载板,时序是按照设计指导要求设计,载板插JAO可以在-20~+60℃正常启动。载板插JAOi模组可以在10~+66℃正常启动,但是-20℃下无法正常启动,表现是:
- 调试串口无任何打印;
- 强制进入烧录模式,也使用lsusb也无法找到JAOi设备。
还做了如下测试:
常温上电时序图如下:
低温下测试波形如下
二者波形差异不大,请问你这边有什么建议么?
你好,我现在自己做了一个AGX Orin的载板,时序是按照设计指导要求设计,载板插JAO可以在-20~+60℃正常启动。载板插JAOi模组可以在10~+66℃正常启动,但是-20℃下无法正常启动,表现是:
还做了如下测试:
常温上电时序图如下:
低温下测试波形如下
二者波形差异不大,请问你这边有什么建议么?
*** Please note that this reply is generated by LLM automatically ***
The provided information appears to be related to the NVIDIA Jetson Linux Developer Guide, specifically the Jetson Orin Series, which includes the Jetson Orin Nano Series, Jetson Orin NX Series, and Jetson AGX Orin Series.
However, the question seems to be asking about the output of the lsusb command on a Jetson AGX Orin device. The output shows several USB devices connected to the system, along with their device IDs, vendor IDs, and descriptions.
Here is a breakdown of the output:
Bus 001 Device 001: ID 1d6b:0002 Linux Foundation 2.0 root hub
Bus 001 Device 002: ID 0bda:8152 Realtek Semiconductor Corp. USB 10/100 LAN
Bus 001 Device 003: ID 0bda:8152 Realtek Semiconductor Corp. USB 10/100 LAN
Bus 001 Device 004: ID 0bda:8152 Realtek Semiconductor Corp. USB 10/100 LAN
Bus 001 Device 005: ID 0bda:8152 Realtek Semiconductor Corp. USB 10/100 LAN
Bus 001 Device 006: ID 0bda:8152 Realtek Semiconductor Corp. USB 10/100 LAN
The lsusb command is used to display information about USB buses and devices connected to the system. The output includes the bus number, device number, device ID, vendor ID, and a description of the device.
In comparison to other Jetson devices, the output of the lsusb command may vary depending on the specific hardware configuration and the devices connected to the system. However, the general format of the output should be similar.
It’s worth noting that the provided output does not seem to be related to the NVIDIA Jetson Linux Developer Guide or the Jetson Orin Series, but rather appears to be a standalone output of the lsusb command.
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你好 你这回答感觉没理解我的问题
- 强制进入烧录模式,也使用lsusb也无法找到JAOi设备。
Is this board able to enter recovery mode when the temperature is in normal situation (e.g > 0C)?
在常温情况下可以进入恢复模式
还有就是我想问一下,下图中的overlay都需要解压到Linux_for_Tagre中去么? 我现在用的是JetPack_5.1.4的操作系统,只解压了‘overlay_JAOi_low_temp_35.4.1.tar.gz’ 是否会有影响?
这些overlay实际上是影响JAOi模组里的哪些地方?
Those overlay is not dealing with the same problem as you have right now.
Not able to enter a recovery mode is a hardware problem. Not related to the software overlay.
多谢解答!
那我在一楼的测试的上电波形是否有问题(不管是常温,还是低温)?
然后就是据我提供的信息推测 可能还在什么地方有问题?
你好,你这边有什么建议么,关于低温启动问题
Can you confirm that recovery mode cannot be entered when powering up at -20°C? That would be unusual.
Most of your power sequencing captures look ok. What is “VICC_ON_BAD”?
The user in the thread below had a problem with Jetson AGX Orin booting at -20C due to circuitry on the custom carrier board affecting some of the levels on boot straps. Does your carrier board have any circuitry that could be interfering with the straps on UART5_TX (pin J58) and UART5_RTS (K58)?
AGX Orin 32G cannot be booted into the system at -20 degrees Celsius
Can you confirm that recovery mode cannot be entered when powering up at -20°C? That would be unusual.
我确认在-5℃或者低于-5℃下,开机无法进入恢复模式,但是在常温和高温都可以进入烧录模式。
Most of your power sequencing captures look ok. What is “VICC_ON_BAD”?
VICC_ON_BAD 是我的标记错误,实际是“VDDIN_PWR_BAD_N ”信号
The user in the thread below had a problem with Jetson AGX Orin booting at -20C due to circuitry on the custom carrier board affecting some of the levels on boot straps. Does your carrier board have any circuitry that could be interfering with the straps on UART5_TX (pin J58) and UART5_RTS (K58)?
这个我去查看一下。
顺便我再问一下,SYS_VIN_SV 电源的负载只有0.3A,我现在PCB走线只有7mil宽,这个有可能是低温下起不来的原因么?
“CARRIER_POWER_ON ” 信号拉高是在JAOi启动程序之前 还是之后?
万分感谢
你好 你这边对于我这里的疑问有啥建议么
@ChrisB_NV
下面帖子中的用户遇到了 Jetson AGX Orin 在 -20°C 下无法启动的问题,原因是定制载板上的电路影响了启动带上的某些电平。您的载板上是否有任何电路可能会干扰 UART5_TX(引脚 J58)和 UART5_RTS(引脚 K58)上的启动带?
AGX Orin 32G cannot be booted into the system at -20 degrees Celsius
我将J58和K58连接的信号全部断开后,仍然无法在低温下启动,低温下时,这个信号“CARRIER_POWER_ON ”一直是低电平,不知道这个地方有什么怀疑的地方?
我使用开发板载板+JAOi在低温下可以正常启动,测试开发板的时序中我发现MV在HV后上电的,我也尝试将时序改成和开发板一致的情况,仍然无法启动。
请帮忙看看我下述的一个地方有什么值得怀疑的地方:
1 “VDDIN_PWR_BAD_N” 是否需要下拉电阻或者上拉电阻?
2 “HV”的去耦电容有没有限制? 我目前是80uF,这个值是否合理?
帮忙看看,万分感谢
The NVIDIA Dev Kit Carrier Board uses a trace width of 0.3mm (11.811 mil) for SYS_VIN_SV. It’s unclear if this would prevent low temp boot.
CARRIER_POWER_ON pulls high by hardware as part of the module’s power on sequence, 12-50ms before the power sequencer releases the reset of the Orin SoC.
If CARRIER_POWER_ON stays low, the power sequencer did not fully execute the power on sequence. What is the voltage level of the MODULE_POWER_ON when you observe this?
The Dev Kit does not use the (updated) recommended power on sequence as noted in the Design Guide:
The module has a 10k pull up to SYS_VIN_MV on the VDDIN_PWR_BAD_N. The Design Guide describes how the signal should be used: Carrier board should stop asserting this signal and allow on-module pull-up to bring high only when HV/MV are stable and have reached required voltage levels. This prevents SoC from powering up until the main input supply voltages are stable.
Did you not leverage the Dev Kit carrier board reference design provided by NVIDIA? 80uF is low. Directly on the VCC_SRC net that provides SYS_VIN_HV to the module, there is 132.2uF. Including the VCC_SRC_NET that suppllies VCC_SRC, the overall total is 320.3uF.
Did you ground pin J62 of the AGX Orin module connector through a 0 ohm resistor?
CARRIER_PWR_ON comes from the power good signal of the last regulator that turns on as part of the power on sequence. So the module completes its power on sequence before the rest of the carrier starts to power up.
On the industrial module, SV powers the power sequencer and some other logic specific to the industrial version.
That is unusual and unexpected. A couple of questions: