moisture proof reliabilityとは 意味・読み方・使い方

To provide an aqueous moisture-proof insulating coating for use in a packaging circuit-board which has a superior film making property and superior flexibility, and electric/electronic components of high reliability insulated with the aqueous moisture-proof insulating coating and a method of manufacturing the same.例文帳に追加

造膜性及び可とう性に優れた実装回路板用水性防湿絶縁塗料、この水性防湿絶縁塗料で絶縁処理された信頼性の高い電気・電子部品及びその製造方法を提供する。 - 特許庁

To obtain an epoxy resin resin composition for semiconductor sealing excellent in adhesion to nickel plating and having characteristics excellent in moisture proof reliability and moldability.例文帳に追加

ニッケルメッキへの接着に優れ、耐湿信頼性、成形性に優れた特性を有する半導体封止用樹脂組成物を提供すること。 - 特許庁

To provide a semiconductor-sealing epoxy resin composition excellent in high temperature storage properties and moisture-proof reliability as well as in the balance thereof with flame retardancy.例文帳に追加

高温保管特性及び耐湿信頼性、かつ難燃性とのバランスに優れた半導体封止用エポキシ樹脂組成物を提供すること。 - 特許庁

To provide a glass sealed package capable of reducing manufacturing processes and improving a wafer yield while maintaining reliability of moisture proof performance or the like, and to provide a method for manufacturing the glass sealed package.例文帳に追加

防湿性能等の信頼性を維持しつつ、製造工程の削減やウエハ歩留まり向上の図ったガラス封止型パッケージ及び製造方法を提供する。 - 特許庁

To provide an epoxy resin composition for semiconductor sealing not containing a halogen-based flame retardant and an antimony compound and excellent in flame retardance, high-temperature storage characteristics and moisture proof reliability.例文帳に追加

ハロゲン系難燃剤、及びアンチモン化合物を含まず、難燃性、高温保管特性、及び耐湿信頼性に優れた半導体封止用エポキシ樹脂組成物を提供すること。 - 特許庁

To obtain an epoxy resin composition for sealing a semiconductor, excellent in moldability, flame retardancy, characteristics in high temperature preservation, and moisture proof reliability without containing a halogen-based flame retardant and an antimony compound.例文帳に追加

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、高温保管特性、耐湿信頼性に優れた半導体封止用エポキシ樹脂組成物を提供すること。 - 特許庁

To provide an epoxy resin composition having fast-setting property and excellent in soldering resistance, moisture-proof reliability, storage property at high temperature and flame retardance and to provide a semiconductor device using the composition.例文帳に追加

本発明の目的は速硬化性であり、耐半田性、耐湿信頼性、高温保管性、難燃性に優れたエポキシ樹脂組成物、及びこれを用いた半導体装置を提供する。 - 特許庁

To obtain an epoxy resin composition for sealing an optical semiconductor excellent in transparency, adhesiveness, moisture proof reliability and molding flash releasability by compounding an epoxy resin, a curing agent, a specific mold releasing agent and a specific curing accelerator.例文帳に追加

生産効率を向上させることができ、しかも透明性、密着性、耐湿信頼性、バリ離型性にも優れる光半導体封止用エポキシ樹脂組成物を提供する。 - 特許庁