electronic device solder jointとは 意味・読み方・使い方

METHOD OF MANUFACTURING ELECTRONIC CIRCUIT DEVICE, SOLDER JOINT METHOD AND ELECTRONIC CIRCUIT DEVICE例文帳に追加

電子回路装置の製造方法、はんだ接合方法、および、電子回路装置 - 特許庁

SOLDER JOINT PART LIFE PREDICTION METHOD, SOLDER JOINT PART LIFE PREDICTION DEVICE, AND ELECTRONIC APPARATUS例文帳に追加

はんだ接合部の寿命予測方法、はんだ接合部の寿命予測装置、及び電子機器 - 特許庁

PRETREATMENT DEVICE FOR SOLDER JOINT, PRETREATMENT METHOD AND ELECTRONIC COMPONENT MOUNTING DEVICE USING THE PRETREATMENT METHOD, AND ELECTRONIC COMPONENT例文帳に追加

はんだ接合用前処理装置、その前処理方法およびそれを適用した電子部品実装装置、電子部品 - 特許庁

To provide an electronic circuit device which does not contain solder defects and whose reliability is high by a method, where a solder joint shape is detected by a nondestructive inspection method and the solder unmelted defects of a solder bonded part is detected in the electronic circuit device, in which an electronic component and a circuit board are soldered and jointed by facing electrodes.例文帳に追加

電子部品と回路基板が対向する電極ではんだ接合する電子回路装置において、非破壊検査方法で、はんだ接合形状を検出しはんだ接合部のはんだ未溶融不良を検出しはんだ接合不良のない信頼性の高い電子回路装置を提供する。 - 特許庁

To solve the problem that, when a surface mounting electronic device is solder-joined on a circuit board, the surface mounting electronic device is mounted at a tilt, and thereby large mechanical stress is applied to the solder joint and cracks are easily generated in there.例文帳に追加

表面実装型電子デバイスを回路基板上に半田接合した際に傾きが生じ、半田接合部に大きな機械的応力が加わってクラックが発生し易くなるという不具合を解決する。 - 特許庁

To provide a solder joint part life prediction method, life prediction device, and electronic apparatus for highly accurately evaluating the life of each solder joint part in consideration of rigidity deterioration to occur in each joint part by the progress of damage.例文帳に追加

個々のはんだ接合部に損傷が進行することにより発生する剛性の低下を考慮し、接合部の寿命をより高精度に評価を行うはんだ接合部の寿命予測方法、寿命予測装置及び電子機器を提供する。 - 特許庁

To provide an electronic component device configured by connecting an electronic component through a solder bump to a circuit wiring board for preventing the occurrence of the open failure of the circuit of the electronic component, securing the wettability of solder, and preventing the deterioration of the joint reliability of the wiring circuit board, to provide the electronic component, and to provide a method for manufacturing the electronic component device.例文帳に追加

半田バンプを介して回路配線基板に電子部品が接続されてなる電子部品装置であって、前記電子部品の回路のオープン不良の発生を防止すると共に、半田の濡れ性を確保しつつ、前記配線回路基板と前記電子部品との接合信頼性の低下を防止することができる電子部品装置、及び当該電子部品装置の製造方法を提供する。 - 特許庁