a raw circuit boardとは 意味・読み方・使い方

To provide a copper alloy foil for laminate with small surface roughness, which can be directly bonded with a polyimide film without being roughened, because of adequate wettability with a varnish including polyamic acid, in a two-layer printing circuit board which makes the resin substrate from the varnish as a raw material.例文帳に追加

ポリアミック酸を含むワニスを原料として樹脂基板とする２層プリント配線板において、ワニスとのぬれ性が良好で粗化処理を施さずにポリイミドとの直接接合が可能な表面粗さの小さい積層板用の銅合金箔を提供すること。 - 特許庁

To provide a copper alloy foil for a laminate sheet with a small surface roughness which has satisfactory wettability with varnish, and can directly be joined with polyimide even without undergoing roughening treatment in a two layer printed circuit board having a resin substrate in which varnish containing a polyamic acid is used as the raw material.例文帳に追加

ポリアミック酸を含むワニスを原料として樹脂基板とする２層プリント配線板において、ワニスとのぬれ性が良好で粗化処理を施さずにポリイミドとの直接接合が可能な表面粗さの小さい積層板用の銅合金箔を提供すること。 - 特許庁

To provide copper alloy foil for a laminate sheet with a small surface roughness which has satisfactory wettability with varnish, and is directly joined with polyimide even without undergoing roughening treatment in a two layer printed circuit board having a resin substrate in which varnish containing polyamic acid is used as the raw material.例文帳に追加

ポリアミック酸を含むワニスを原料として樹脂基板とする２層プリント配線板において、ワニスとのぬれ性が良好で粗化処理を施さずにポリイミドとの直接接合が可能な表面粗さの小さい積層板用の銅合金箔を提供すること。 - 特許庁

The circuit board 1 has a ground layer 5 and signal wiring 3a, 3b arranged on the ground layer via an insulator layer 2 wherein a shield layer 7 formed of a conductive raw material is formed on an insulating covering layer 4 for covering the signal wiring on a surface reverse to the ground layer.例文帳に追加

グランド層５と前記グランド層に対して絶縁体層２を介して信号配線３ａ，３ｂを配設してなる回路基板１において、前記グランド層とは反対面の前記信号配線を覆う絶縁被覆層４上には導電性素材によるシールド層７が形成される。 - 特許庁

The manufacturing method includes a step of setting the position of the projection portion through hole 14 through which the projection portion 16 is inserted and the position of the bent pin portion 18 to be inserted into a circuit board to be at the same position and working them when a metal plate 19 as a raw material of the shield case 11 is blanked.例文帳に追加

製造方法としては、シールドケース１１の素材となる金属板１９を打ち抜く加工の際に、凸部１６を挿通するための凸部通し穴１４と、回路基板に差し込まれる切り起こしピン部１８とを同じ位置にして加工する工程を行う。 - 特許庁

To provide a photosensitive composition having proper sensitivity and superior raw stock preservability by using an oxime derivative and a specific sensitizer, a photosensitive film, a permanent pattern forming method using the photosensitive composition, and to provide a printed circuit board on which a permanent pattern is formed by the permanent pattern forming method.例文帳に追加

オキシム誘導体と特定の増感剤を用いることにより、感度が良好で、かつ生保存性に優れる感光性組成物、感光性フィルム、前記感光性組成物を用いた永久パターン形成方法、及び前記永久パターン形成方法により永久パターンが形成されるプリント基板の提供。 - 特許庁

The waste copper etching solution and the waste resist solution, both of which are discharged from the printed circuit board, are simultaneously treated by adjusting both of the waste solutions to a pH of 8-13 in the presence of a rare earth element compound, sedimenting and separating copper as a hardly soluble substance while sedimenting and separating an organic substance in raw water.例文帳に追加

プリント基板から排出される銅エッチング廃液とレジスト廃液を希土類化合物の共存下で、ｐＨを８〜１３に調整することによって、該銅を難溶性物質として沈殿分離させること及び該原水中の有機物を沈殿分離させる銅エッチング廃液とレジスト廃液の同時処理方法。 - 特許庁

In the radiator 3, a heat sink 3a bonded on the other surface of the circuit board mounting the electronic parts and radiation fins 3b vertically erected to the heat sink are formed integrally of a metallic raw material, and a large number of through-holes 3c for making air flow are formed on a surface forming the radiation fins 3b.例文帳に追加

前記放熱器３は、前記電子部品が実装された回路基板の他の面に接着される放熱プレート３ａと、この放熱プレートに対して鉛直方向に立ち上がる放熱フィン３ｂとが金属素材により一体に形成されており、前記放熱フィン３ｂを形成する面には、多数の空気流通用の貫通孔３ｃが形成されている。 - 特許庁