Heat-curing-type sealing materialとは 意味・読み方・使い方

LIGHT AND HEAT CURING COMBINED USE-TYPE RESIN COMPOSITION, LIGHT AND HEAT CURING COMBINED USE-TYPE MOISTURE-PROOF SEALING MATERIAL FOR ELECTRONIC PAPER, ELECTRONIC PAPER, AND METHOD FOR PRODUCING THE ELECTRONIC PAPER例文帳に追加

光及び熱硬化併用型樹脂組成物、電子ペーパー用の光及び熱硬化併用型防湿シール材、電子ペーパー及びその製造方法 - 特許庁

To obtain a polyamide-imide resin composition having excellent low warpage, flexibility, adhesion to a sealing material, solvent resistance, and chemical resistance, and further, being nitrogen-free type polar solvent-soluble, and having low-temperature curing properties, and excellent heat resistance, electrical characteristics, humidity resistance, workability and economic efficiency, and to obtain a coating film forming material having the above characteristics by using the same.例文帳に追加

低反り性、柔軟性、封止材との密着性、耐溶剤性及び耐薬品性に優れ、しかも非含窒素系極性溶媒に可溶で低温硬化性を有し、耐熱性、電気特性、耐湿性、作業性及び経済性に優れるポリアミドイミド樹脂組成物及びそれを用いた優れた前記特性を有する被膜形成材を提供する。 - 特許庁

To provide a one-pack type epoxy resin composition for underfill sealing, surely connecting semiconductor devices such as CSP and BGA on a circuit board and increasing connecting reliability in heat cycle treatment after curing, wherein the filling property of the underfill material is kept at a level of practically no problem and productivity is kept.例文帳に追加

アンダーフィル材料の充填性を実用上問題のない水準として、生産性を維持しながら、配線基板上にＣＳＰやＢＧＡ等の半導体装置を確実に接続でき、かつ、硬化後のヒートサイクル処理時の接続信頼性を向上させることができるアンダーフィル封止用の一液型エポキシ樹脂組成物を提供する。 - 特許庁