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Y. Gobil

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2024
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A. Divay, Olivier Valorge, Christophe Dubarry, M. Medbouhi, Rémi Franiatte, Daniel Mermin, R. Velard, Y. Gobil, F. Morisot, Erwan Morvan, Ismael Charlet, Luca Lucci, J. Lugo, Xavier Garros:
Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique. VLSI Technology and Circuits 2024: 1-2

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