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John H. L. Pang

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

John Hock Lye Pang

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affiliation: Nanyang Technological University, Singapore

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2020 – today

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2020
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Yang Liu, Xin Sun, John Hock Lye Pang:
A YOLOv3-based Deep Learning Application Research for Condition Monitoring of Rail Thermite Welded Joints. IVSP 2020: 33-38

2010 – 2019

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2015
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F. X. Che, John H. L. Pang:
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectron. Reliab. 55(12): 2769-2776 (2015)

2000 – 2009

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2009
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F. X. Che, John H. L. Pang:
Vibration reliability test and finite element analysis for flip chip solder joints. Microelectron. Reliab. 49(7): 754-760 (2009)
2008
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Yaofeng Sun, John H. L. Pang:
Digital image correlation for solder joint fatigue reliability in microelectronics packages. Microelectron. Reliab. 48(2): 310-318 (2008)
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C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun:
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48(4): 611-621 (2008)
2006
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Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong:
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectron. Reliab. 46(2-4): 558-573 (2006)
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Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low:
Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron. Reliab. 46(7): 1160-1171 (2006)
2004
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X. Q. Shi, John H. L. Pang, X. R. Zhang:
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectron. Reliab. 44(5): 841-852 (2004)

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Schloss Dagstuhl - Leibniz Center for Informatics is a member of the Leibniz Association and is funded by the federal government of Germany and the states of Germany, especially Saarland and Rhineland‑Palatinate.