For IoT product developers, time to market is a significant challenge and a potential competitive advantage. Silicon Labs, also known as “芯科科技”, has recently launched the pre-certified xGM210x module series based on the Wireless Gecko Series 2 multi-protocol wireless SoC platform, which helps reduce the R&D cycle associated with RF design and protocol development, allowing engineers to focus on end applications. These modules are pre-certified for the North American, European, Korean, and Japanese markets, significantly reducing the time, cost, and risk factors associated with global wireless certification. xGM210PMulti-Protocol Wireless Module The xGM210P Bluetooth, Zigbee, and Thread multi-protocol module optimizes the package design with an integrated chip antenna, making it compact and suitable for space-constrained IoT designs, including smart lighting, HVAC, building, and factory automation systems.
xGM210LIdeal Application Module for Smart Lighting The xGM210L module features a custom package for easy installation inside LED bulb bases, equipped with a PCB trace antenna to significantly increase wireless range, has a high rated temperature, and has obtained multiple global regulatory certifications. With low active power consumption, it is an ideal wireless solution for cost-sensitive high-capacity smart LED bulbs.
Providing Optimal Protection for IoT Products The xGM210x modules offer top-notch functionality with a dedicated security core that isolates the application processor and provides fast, energy-efficient encryption operations, enabling developers to implement reliable security in IoT products. Explore more information and technical documentation on Silicon Labs xGM210x multi-protocol wireless module series: https://cn.silabs.com/products/wireless/xgm210x-series-2-modules You can also scan the following QR code to follow Silicon Labs on social media.
