| Author | Affiliation | INVITED PAPER TOPIC |
|---|---|---|
| Todd Bauer | DARPA | Review of DARPA’s T-MUSIC Program |
| Yves Gigase | Chips Joint Undertaking | The European Chips Act |
| Hoi Lee | University of Texas, Dallas | High-efficiency high-conversion-ratio power delivery circuits for computing applications |
| Steven Callender | Intel | D-Band meets FinFET: Fully-Integrated Transmitter and Receiver Architectures for 100+ Gb/s Links |
| Eric Bryerton | Virginia Diode | Trends in mmW & THz Test Equipment |
| Teruo Jyo, Munehiko Nagakani | NTT | 300-GHz-Band InP HBT Power Amplifier and InP-CMOS Hybrid Phased-Array Transmitter |
| Alyosha C. Molnar | Cornell University | N-path mixers beyond CMOS |
| Pascal Chevalier | ST Microelectronics | A 55-nm Flexible SiGe BiCMOS Technology for Wired, Wireless, and Satcom Applications |
| Takuya Maeda | University of Tokyo | Characterization of ScAlN/GaN Toward Electronic Device Application |
| Trevor Thornton | Arizona State University | Diamond-BN Heterojunctions for High Power Devices: The Ultimate HEMT? |
| Jim Sowers | Maxar Space Infrastructure | III-V Semiconductors in Commercial Communication Satellite Payloads |
| Kenle Chen | University of Central Florida | Load Modulated Balanced Amplifiers for Next-G Wireless Communications |
| Bernhard Grote | NXP | Advances in GaN HEMT and GaN PA techniques for base-stations |
| Lan Wei | University of Waterloo | A Family of Physics-Based Models for Monolithic GaN Integration |
| Larry Dunleavy | Modelithics Inc., University of South Florida | Practical Dimensions on Contemporary GaN HEMT Modeling |
| Alexander Rylyakov | Nokia | Next Generation Optical Transceiver for Data Center Interconnect |
| Christian Reimer | Hyperlight | Integrated Photonics in Thin-Film Lithium Niobate |
| Tsunenobu Kimoto | Kyoto University | SiC based power devices for extreme temp operations |
| Zlatan Stanojevic | Global TCAD | Process to Parasitics Simulations |
| Randy Wolf | GlobalFoundries | State of the Art in PA Design for Wireless applications – Opportunities and challenges for compact modeling |
