17th Edition
GaN power electronics, microLED market traction, SiC revitalisation, surface-emitting optoelectronics and ultra-wide bandgap materials.
Visit Website17th Annual · 5 Co-located Conferences
The global home of chip-level innovation.
Five co-located conferences bringing the compound semiconductor, photonics, power electronics and advanced packaging industries together in Brussels.
- 5Co-located conferences
- 750+Senior delegates
- 90+Exhibitors
- 120+Presentations
- 3Days, 1 venue
AngelTech 2027 brings together the global compound semiconductor, photonic integrated circuits, power electronics and advanced packaging communities, all under one roof at the Sheraton Airport Hotel in Brussels.
The portfolio comprises four international conferences (CS, PIC, PE and AP) plus the C-level AngelTech Innovate Summit, which runs the day before the main programme. With a single ticket spanning all four conferences and a dedicated executive forum on top, attendees get the full supply chain in one place: customers, suppliers, fabs, investors and analysts.
- 40+ industry & academic leaders presenting per conference
- One ticket grants access to all four conferences
- Executive Innovate Summit on Day 1 (separate registration)
The Conferences
Five events, one venue.
Every layer of the chip stack, side by side. Compound semiconductors, photonic integrated circuits, power electronics and advanced packaging under a single ticket.
12th Edition
PIC design foundations, scalable connectivity for high-speed networks, sensing & imaging, and PICs for photonic processing and quantum computing.
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5th Edition
The thriving power electronics landscape. Soaring silicon device sales, explosive growth in SiC and GaN, and the drivers behind the industry boom.
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2nd Edition
The materials, methods and technologies reshaping chip-level packaging and system integration, from thermal solutions to next-gen wirebond and leadframe formats.
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2nd Edition
A C-level, interactive forum bringing together senior leaders, entrepreneurs, analysts and funders to address the industry's most pressing challenges.
Visit WebsiteWhy AngelTech
Three reasons it's the must-attend event.
The whole industry, under one roof
CS, PIC, PE and AP communities co-located. Customers and suppliers spanning the full chip-level supply chain: fabs, equipment, integrators, end markets.
Senior, peer-led content
40+ industry and academic leaders per conference deliver presentations, panels and fireside chats focused on real-world technology, market and execution challenges.
Curated networking
One large networking space and two evening receptions with drinks and snacks, plus the executive Innovate Summit, mean quality conversations with the people who set strategy and write the cheques.
2027 Speakers
Senior leaders shaping the next decade of chip-level innovation.
2027 Sponsors & Exhibitors
Meet the sponsors and exhibitors shaping the industry.
Register for 2027
Choose how you join us in Brussels.
AngelTech 2027
€895per attendee
One registration grants access to all four international conferences (CS, PIC, PE and AP) across three days.
- All four international conferences (13 - 14 April)
- Full exhibition access (13 - 14 April)
- Welcome drinks on Day 1 (12 April)
Register via any of the event sites
Innovate Summit
€245executive pass
The next-generation Executive Strategy Summit. Outcome-driven sessions for senior leaders, entrepreneurs, analysts and funders.
- Three sessions plus a collaboration forum
- Focus: data centres, 6G, automotive, AI
- Separate registration required
Register at the event site
Get in touch
Got questions about AngelTech 2027?
Whether you're interested in attending, exhibiting, sponsoring or speaking, drop us a line and the team will get back to you within one working day.
- Email[email protected]
- Phone+44 (0)24 7671 8970
- OfficeAngel Business Communications Ltd
Coventry, United Kingdom